Transcript CDR_MontAlto_Boston

Mont Alto Projectile Project
(M.A.P.P.)
BU Novel Magnetometers
Flight Experiment
Critical Design Review
Penn State Mont Alto
Boston University
12/17/2008
MAPP Team
Kylie Flickinger – Mechanical Engineering
Adam Kuhlman – Data Acquisition
William K. McDannell Jr. – Software
Chris Small – Strain Gauge Board
Robert Stottlemyer – Team Leader
Tim Svirbly – Test Equipment Development
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BU Mag Dog Team
•
•
•
•
•
•
Sensors – Aichi – Shawn Doria
Sensors – Honeywell – John Gancarz
Power – Tracy Thai
Rabbit Controller – Andy Lee
Mechanicals – Jim Thumber
Software/Simulations/Analysis – TBD
– Nanosat teams join after January 30
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MAPP Science
The purpose of this experiment is to investigate the mechanical
stresses in an elastic structure during the flight of a sounding
rocket. The structure proposed consists of a circular plate, the
deck plate, which is supported by four longerons, which connect
in turn to circular plates at either end of the longerons simulating
a payload section of previous sounding rocket flights. A dummy
mass is attached to the center of the deck plate. During the
flight, dynamic loads in the axial and lateral directions will cause
the deck plate to deflect. The resulting deformation will be
measured at selected points using strain gauges connected to
electronic boards to obtain time-varying voltage signals which in
turn will be digitized and stored for later analysis. The obtained
data will be compared to theoretical predictions. Careful preflight calibration of the entire data stream will be conducted.
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Novel Magnetometers Flight Experiment Science
• Design, assemble, and test two COTS, solid state 3-axis
magnetometers with controller, data storage and power:
– Honeywell HMR2003 - anisotropic magneto-resistance
– Aichi Micro Intelligent AMI302 - giant magneto-impedance
• Compare directly the X,Y,Z flight readings of both sensors
• Measure EMI from the chips’ bias straps (Honeywell) and
bias coils (Aichi).
• Honeywell device proposed for U. Colorado small satellite
design (2003). We have found no other evidence of its use
in space flight.
• Aichi chip under study by US Navy for navigation of
autonomous marine vehicles. We have found no record of
the Aichi chip being used in space.
December 17, 2008
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Subsystem Requirements
Mechanical Subsystems MAPP
Electrical Subsystems MAPP
a)Bottom Plate
b)Deck Plate
c)Top Plate
d)Longerons
e)Test Weight
f)Trays for Boards
g)Braces
a)G-Switch + Latched Relay
b)Battery and Regulation
c)Strain Gauge Boards
d)Strain Gauges
e)Controller + A/D conversion
f)Data Storage
Mechanical Subsystems BU
Electrical Subsystems BU
a)Main PCB
b)Rabbit daughter board
c)Battery pack
a)G-Switch + Latched Relay
b)Battery and Regulation
c)Honeywell magnetometer
d)Aichi magnetometer
e)Controller + A/D conversion
f)Data Storage
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Block Diagrams
A/D
Controller
Strain Gauges
Strain Gauge
Data Card
Power
G-switch
Launch safing
Honeywell
A/D
Controller
Magnetometers
Aichi
Data Card
Power
December 17, 2008
G-switch
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Launch safing
7
Assembly Mont Alto
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Test weight
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Top disk
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Bottom Disk
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Deck plate
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MAPP Strain Gauges
• After testing in SolidWorks, we determined that the deck
plate would not deform enough for the strain boards that
we built for the USERS program to amplify the signal
enough to get meaningful data using metal strain
gauges. After research, we decided to use semiconductor strain gauges, which have a gauge factor of
~60 times that of a metal foil strain gauge. We will
implement them in a configuration that would both
double signal output and reduce concerns about
temperature sensitivity. Using this configuration should
allow us to use our boards from the USERS program
with only minor changes.
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Strain Gauge (Up Close)
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G-Switch + Latched Relay
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MAPP Controller + Memory
-
Memory Needs : 12 Analog Signal Streams each digitized at ~250 samples/second to
be sampled for 750 seconds at 2 bytes per sample = 4.5 Megabytes
-
Data stored on a SD card inserted into Miniboard (45mm x 55 mm) www.futurlec.com/mini_sc.shtml
standard SD or SPI communication. 3 Volt power
-
Microcontroller Board –
www.microchip.com/wwwproducts/devices.aspx?ddocname=en024691 Model :
PIC24HJ256GP206 , 18 channels 12 bit A/D conversion at up to 500 ksps,
2-UART,2-SPI, 2-12C digital communication, 3 to 3.6 Volt power with on-chip 2.5
Volt power regulator, size 1.0”x2.2” . Programming language C
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Special Requirements
• MAPP Special Requirements
– Shift in center of mass along length axis on rocket
• BU Special Requirements
– Minimize magnetic materials and fields
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MAPP Commands and Sensors
-
-
-
Always On – Triggered by the G-Switch
Turned off by microcontroller before splash down
12 Analog Signal Streams each digitized at ~250 samples/second to
be sampled for 750 seconds at 2 bytes per sample = 4.5 Megabytes
Data stored on a SD card Miniboard (45mm x 55 mm) www.futurlec.com/mini_sc.shtml
Microcontroller Board (protopic 28) – 1.0” x 2.2” –
www.microchip.com/wwwproducts/devices.aspx?ddocname=en024
691 Model : PIC24HJ256GP206 , 18 channels A/D conversion,
on-chip 2.5 Volt power regulator
Strain Gauge: Vishay or Semiconductor (to be decided)
Data Acquisition Controlled by Microcontroller initiated by power on
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MAPP Test Plans
• Mechanical Stress Distribution
-
-
G-Switch and Latched Relay
-
-
Temperature sensitivity
Circuitry and Signal Strength – simple beam test
Compare to metal foil strain gauges
Calibration
Data Acquisition/Storage
-
-
Spring loaded launch in a controlled setting
Ensure compliance with no-volts requirement when integrated with power supply
Strain Gauges
-
-
SolidWorks
Thin Plate Theory
Static Force Rig (similar to the one we used for USERS)
Store and retrieve data
All electronics: Burn in period
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•
•
•
By the end of fall semester (12/19/08)
–
Critical design review completed
–
Begin ordering parts
–
Wrap up design phase
Over Christmas Break (12/19/08 – 01/12/09)
–
Continue ordering parts
–
Begin planning build phase
Beginning of Spring Semester (01/12/09)
–
Meet to plan build phase
–
Take an inventory of parts
MAPP Timeline
•
Between (01/12/09 – 03/15/09) Build Phase
• Manufacture circuit board for data collection
• Alter strain gauge boards
• Manufacture testing rigs—Static force rig like we used for USERS, Spring mechanism to test G-Switch
• Manufacture G-switch
• Manufacture plates, longerons, alter dummy weight from USERS, braces, and housing for battery and g-switch.
•
Between (3/15/09 – 4/25/09) Testing Phase
• Test performance of Semiconductor Strain Gauges—Compare to metal foil strain gauges. Also test temperature drift.
– Static force rig similar to the one we used for testing for the USERS project
• Test performance of G-Switch and power supply
– see that it meets launch safing no volts requirements.
– Use spring mechanism to test the performance of the “ball and tube” part of the G-Switch
• Test performance of Data Acquisition unit
• Burn in period for electronics
Preliminary Integration Phase (4/25/09 – 5/3/09)
• Assemble structure
• Attach strain gauges to test points in structure
• Integrate electronic components—manufacture wire harnesses
• Have structure ready to install in can
Finals week (5/4/09 – 5/8/09)
See you in June! Launch at Wallops
•
•
•
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MAPP Parts List
Mechanical parts
#
4
4
8
1
1
-
Item
Brace A
Brace B
Brace C
Bottom Disk
Top Disk
Status
designed
designed
designed
designed
designed
# Item
Status
1 Test Weight Completed
4 Trays
Completed
4 Longeron
designed
1 Deck Plate designed
Not at the nut and bolt level… just major hardware that will be purchased or built in house
Lead times (This can make or break a project)
Distributors
Manufacturers
Cost (Don’t forget to consider shipping and tax)
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MAPP Parts list, cont.
Electronic Parts :
#
2
1
1
1
Item
Strain gage board
Power regulator board
G-switch and associated electronics
data acquisition/storage + controller
December 17, 2008
Status
Modification needed
Modification needed
needs more design work
needs more design work
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MAPP Budget
Item
Description
Cost
1
4 Trays for electronic boards ( in hand )
2
Test weight ( in hand )
3
remaining physical structure, material
4
controller, data storage , development
5
Wire harness
6
PCB boards and electr. parts
7
Payments to NSROC
8
Travel to workshop,integration,launch
9
Contingency
Total Cost
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$0
$0
$150
$300
$50
$250
$0
$1500
$500
$2750 23
RockSat Payload Canister User Guide
Compliance (MAPP & BU)
Mass estimate includes everything shown in slide 16 . Missing
are the electronic boards ( 4 of 4”x4” ) for MA and electronic
boards and battery for BU
m = 10.86 lbs (< 12.75, the heavy test mass can be reduced)
Center of mass 0.35” off axis and 1.06” below geometric
center. Because electronic boards and tray for the BU
experiment have not been included, the center of mass will
move slightly closer to the geometric center.
Entire structure fits into a cylinder of 9” (<9.2) diameter and
9.275” (<9.4) height leaving 0.125” for washers.
Connection with 5 bolts to top and bottom bulk head ,
respectively, is provided.
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RockSat Payload Canister User Guide
Compliance– cont.
-
Payload Activation
a battery , a G-switch, and shorting wires to Wallops shorting plug form a
complete loop with electric current flowing only if both the G-switch and
shorting plug are in closed position simultaneously. Once current is flowing
a circuit consisting of a second battery (ies) and all electronic boards is
activated using a solid-state latched relay and switch transistor. This
second loop maintains itself even when the G-switch subsequently falls
back into its open position (during ballistic flight phase).
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Shared Can Logistics Plan
o Boston University (Mike Ruane)
o Penn State Mont Alto (Zig Herzog)
Sharing mechanical structure but independent power supply,
controller, data acquisition, and data storage. Possibility of future
sharing of these items is not excluded .
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Team Management
Dr. Siegfried Herzog
Penn State University at Mont Alto
Assistant Professor of Mechanical Engineering
1 Campus Drive
Mont Alto, PA 17237
Tel (717)-749-6209 Fax (717)-749-6069
E-Mail: [email protected]
Dr. Michael Ruane
Professor, ECE Dept.,
Boston University
8 St. Mary's Street, Boston, MA 02215
Phone: 617-353-3256 617-353-6440 fax
E-Mail: [email protected]
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MAPP Conclusions
- Lab space available
- Students are nervous but excited
- We have some previous experience with the USERS
program and can re-use some parts
- We aim to finish by the end of April (end of the spring
semester)
- Looking forward to beach time! 
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BU Subsystems
•
•
•
•
Sensor 1 Aichi
Sensor 2 Honeywell
Power (Battery + Regulation)
Controller
– Sequencing of sensors
– Data A/D conversion
– Storage to SD card
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BU – Aichi AMI302 Magnetometer
• Sensing technology
– Based on Magneto-Impedance effect of amorphous magnetic wire
• Range of measurable magnetic flux density: -2 to +2 gauss
• 3 sensors for length, width, and height (X, Y, Z)
• Inputs and Outputs: Name I/O Pin #
Description
Unit: mm
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CS
CH2
CH1
Input
Input
Input
10
9
8
Chip Standby
OUT
Output
1
Linear DC output proportional to magnetic fields
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X axis / Y axis / Z axis output switching
30
BU – Aichi AMI302 Magnetometer
• Supply Voltage: -0.3 to +6.5 VDC
• Maximum Supply Current: 200
mA
– Approximately 1% duty cycle on this
peak current
• Operating Temperature: -20 to
+85°C
• Magnetic Characteristics
Property
Output Offset Voltage at
Zero Gauss
Sensitivity
Min.
Typical
Max.
Units
0.8
1.5
1.9
Volts
0.16
0.24
0.38
Volts/gauss
– Operating Test Conditions
• Ambient Temperature: 25°C
• Power Supply: 3 VDC
μF ceramic capacitorRockSat
between
December• 17,10
2008
CDR
Power Supply and Ground
31
BU - Honeywell HMC2003
Magnetometer
• Sensing technology
– Anisotropic magneto-resistance
• Range of measurable magnetic flux density: -2 to +2
gauss
• 3 sensors for length, width, and height (X, Y, Z)
– One output for each direction (Xout, Yout, Zout)
Symbol
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A
A1
D
e
H
Millimeters
Max
Min
10.92
11.94
2.92
3.42
25.91
27.3
2.41
2.67
18.03 3219.69
BU - Honeywell HMC2003
Magnetometer
• Supply Voltage: 6 to 15 VDC
• Maximum Supply Current: 20
mA
• Operating Temperature: -20
to +85°C
• Magnetic Characteristics
Property
Null Field Output
Sensitivity
Output Voltage
Min. Typical Max.
Units
2.3
2.5
2.7 Volts
0.98
1 1.02 Volts/gauss
0.5
4.5 Volts
– Operating Test Conditions
• Ambient Temperature: 25°C
• Power Supply: 12 VDC
• Set/Reset switching is active
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BU - RCM4300 RabbitCore
•
•
•
•
•
•
1GB of storage – mini-SD memory card
Runs at 58.9MHz
20 parallel digital I/O lines
8 channel analog input with 12 bit resolution
Max asynchronous transfer rate =Clk (58.9MHz)/8
4 PWM registers, 10 bit counter, priority interrupts
Input/Output:
• 3 Inputs from Aichi - X axis / Y axis / Z axis output from
Aichi
• 3 Inputs from Honeywell - X axis / Y axis / Z axis output
from Honeywell
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BU - RCM4300 RabbitCore cont.
Aichi
•
•
•
•
•
Use timer to time selection of outputs for x, y, z axes
Iterate outputs from RabbitCore to read different axes on Aichi
Different channels for x, y, and z axes
Take input and pass through A/D converter from each Aichi channel
Store converted values onto SD flash memory for future use
Honeywell
• Use timer to constantly poll Honeywell for all x, y, and z axes nearlysimultaneously
• Store data from each axis on a separate place on the SD flash
• Each axis is read from a separate output pin on Honeywell chip
• Use A/D converter to store as value and store converted value on flash
Both chips
• User timer to select which chip is off for EMI comparisons
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BU – Sensor Schematics
AMI302
RCM4300 Header
J3
HEADER 50
3.3V
D1
U13
VDC12VAMI
1
50
49
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
24
23
22
21
20
19
18
17
16
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
D6
DIODE13
VIN
2
VOUT
VDC3_3VAMI
3
R3
RESISTOR
ADJ
DIODE13
LM317_K
D3
DIODE13
GND12VAMI
VDC3_3VAMI
R7
POT
C6
C4
CAPACITOR NON-POL
CAPACITOR NON-POL
C7
C5
CAPACITOR NON-POL
PWR05VHMC
GND12VAMI
LM741/DIP8
C10
R15
CAP NP
39K
VDC3_3VAMI
GND12VAMI
VDC3_3VAMI
VDC3_3VAMI
CH1
CH2
VDDA
CS
OUT
GND12VHMC
NC5
NC4
NC3
NC2
J1
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
AMI302-1
AMI302-1-Out
GND12VAMI
C9
HMCSR_SET
AMI302
Axis Switching
Magnetometer
PWR05VHMC
C11
CAP NP
CAP NP
U17
7
1
Q1
2N2222
R12
R18
RESISTOR
Y out
PWR05VHMC
D7
RESISTOR
DIODE ZENER
3
+
2
-
6
HMCY out
HMCSR_SET
4
5
SW2HMCReset
LM741/DIP8
GND12VHMC
R14
GND12VHMC
39K
U18
7
1
Zout
PWR05VHMC
VDC12VHMC
1
VIN
2
VOUT
PWR05VHMC
3
D4
DIODE13
ADJ
DIODE13
LM317_K
R6
POT
D8
RESISTOR
DIODE ZENER
2
+
6
GND12VHMC
Y TrimHMC
Y out
HMCBridge
HEADER 25
HMCZout
LM741/DIP8
GND12VHMC
GND12VHMC
R2
R16
2000 ohm
CAPACITOR NON-POL
CAPACITOR NON-POL
C1
3
20
19
18
17
16
15
14
13
12
11
4
5
R13
U14 DIODE13
D2
SRZof f +
Xof f Zof f Ztrim
Xof f +
Xtrim
SR+
Y of f - Y of f +
Zout
Y trim
Xout
Y out
Vref
Vbias
GND Vbridge
V+
Vsense
HMC2003
3-Axis
Magnetometer
PWR05VHMC
D5
1
2
3
4
5
Zout
6
Xout
7
Vref HMC
8
GND12VHMC
9
PWR12VHMC 10
ZTrimHMC
XTrimHMC
GND12VHMC
Test Header PSU
Integrator DB25S
HMCXout
4
5
RESISTOR
R17
RESISTOR
6
VDDM
2
PWR05VHMC
+
GNDA
Vref HMC
3
GNDM
Xout
CAPACITOR NON-POL
U16
7
1
R11
C2
C3
39K
CAPACITOR NON-POL
GND12VHMC
Title
RockSat BU Pay load -M. Ruane
Size
B
Date:
December 17, 2008
RockSat CDR
Document Number
BU RockSat 0002
Friday , December 12, 2008
Rev
2
Sheet
1
of
1
36
BU - Science Experiment Timing
Normal 1
H A M
5 Mins
Start at
Launch
EMI 1
~H A M
30 Sec
Key:
H - Honeywell
A - Aichi
M - Memory(rabbit)
EMI - Electromagnetic Interference
Safe
~H ~A ~M
End
Normal 4
H A M
10 Mins
December 17, 2008
EMI 3
~H ~A M
30 Sec
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Normal 2
H A M
3 Mins
EMI 2
H ~A M
30 Sec
Normal 3
H A M
3 Mins
37
BU - Data Flows
•
•
•
•
•
•
•
•
2 sensors, 4 data sources, housekeeping
12 b/sample on Rabbit RCM4300
Slow change in Earth’s field over flight
Changes from spin of rocket (<10 Hz)
Sample 10 pts/cycle or 100 Sa/s
Estimated flight 22.5 min or 1350 s
135k Sa x 4 x 12b/Sa = 6.48 Mb = 0.8MB
Well within low-end SD card capacities
December 17, 2008
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BU Testing Plans
• Electrical systems operation
– Timing test for sequencing
– DAQ test with sensors
– SD card storage and retrieval
• Sensor operation
– Earth field testing
– Helmholz coil testing of boards
• Power operation
– Charging/discharging
– Voltage regulation and distribution
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BU - Parts & Vendors
• Aichi AMI302 (3 on hand from Aichi; two
week order time)
• Honeywell (2 on hand; distributors; 2 week
order time)
• PCB fab - turnaround (5 business days)
• PCB Assembly for Aichi (10 business days)
• Rabbit Core 4300 (Dev kit on hand)
• Miscellaneous DigiKey/Newark parts
December 17, 2008
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BU - RockSat Payload Canister User Guide
Compliance
•
•
•
•
•
•
Sensor PCB ~15 cm x 15 cm x 2 cm; < 150 g
Rabbit PCB ~ 5 cm x 8 cm x 1 cm; <100 g
Battery ~ 6 cm x 10 cm x 2 cm; <150 g
(Easily reside in ½ canister or even ¼ height)
Will follow G-switch and Rocket wire protocol
Independent of MAPP system except CG
December 17, 2008
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Shared Can Logistics Plan
• Penn State Mont Alto
- Boston University
• Each system is
independent
• Structural interfacing
(PSMA)
December 17, 2008
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BU Mechanical Layout
Top Plate
Battery volume
Sensors
Rabbit uP
BU Volume
Mont Alto MAPP
Alternate: Trim one corner to avoid
Cable channel and align standoff
Holes accordingly.
December 17, 2008
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RockSat Student Launch – Mag Dogs, Boston University
Conceptual Use of BU Volume
M. Ruane
SIZE
FSCM NO
SCA
LE
1/2 : 1
DWG NO
REV
BURS-2008-01
14-Dec-08
SHE
ET
1.0
1 OF 1
43
BU Timeline
Dec 2008
ID
Task Name
12/21 12/28
1
CDR Phone Conference
1d
2
Bench testing of circuits
25d
3
PCB 1 layout
10d
4
Battery and regulator bench testing
20d
5
Canister arrives at MA campus
1d
6
Online Progress Report 4
12d
7
PCB 1 assembly
10d
8
Sensor testing
10d
9
Subsystem testing reports
7d
10 Online progress report 5
1/4
1/11
1/18
Feb 2009
1/25
2/1
2/8
2/15
Mar 2009
2/22
3/1
3/8
3/15
Apr 2009
3/22
3/29
4/5
4/12
4/19
May 2009
4/26
5/3
5/10
5/17
Jun 2009
5/24
5/31
6/7
6/14
Jul 2009
6/21
6/28
7/5
7/12
10d
11 PCB 2 layout (if necessary)
5d
12 PCB 2 assembly
10d
13 Subsystem integration
10d
14 Subsystem testing report
6d
15 Full mission simulation DITL Testing
13d
16 Online Progress Report 6
12d
17 2nd full Mission Simulation Report
17d
18 Online Progress Report 7
11d
19 Launch Readiness Review Teleconf
1d
20 Canister Integration & Testing
1d
21 Launch Day
2d
22 Data Analysis and Report
30d
December 17, 2008
Jan 2009
Duration
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44
7/19 7/26
Item
Description
BU Budget
1
Aichi AMI302 (3 in hand, one needed)
2
Honeywell HMR2300 (2 in hand) (sensor <$100)
3
Controller (in hand) and development board (in hand)
4
PCB fabrication (two, possibly three cycles)
5
PCB assembly of surface mount elements (flight board)
6
Wire harness, connectors, miscellaneous ICs, discretes
7
NSROC payment for launch
8
Travel for integration, launch workshop June 2009
9
Contingency
Total Cost
December 17, 2008
RockSat CDR
Cost
$100
$100
$250
$300
$500
$100
$0
$2000
$1000
$4300 45
• BU Conclusions
– BU Mag Dogs Team is closing out its semester and catching up
to the RockSat schedule
– We have an enthusiastic group of students, a lab space for work,
and a Nanosat team becoming available in January
– Our experiment is building on a sensor board from USERS and a
microcontroller DAQ system
December 17, 2008
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46
Appendices –
Backup Slides
December 17, 2008
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47
Management
Dr. Michael Ruane
Professor, ECE Dept.,
Boston University
8 St. Mary's Street, Boston, MA 02215
Phone: 617-353-3256 617-353-6440 fax
E-Mail: [email protected]
Dr. Siegfried Herzog
Penn State University at Mont Alto
Assistant Professor of Mechanical Engineering
1 Campus Drive
Mont Alto, PA 17237
Tel (717)-749-6209 Fax (717)-749-6069
E-Mail: [email protected]
December 17, 2008
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48
Housing , Battery + G-switch
December 17, 2008
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49
Strain Gauge Circuit
December 17, 2008
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50
Rabbit Daughter Board
December 17, 2008
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51
BU - Expedited & Day in the Life Testing
Normal 1
H A M
5 Sec
Start
EMI 1
~H A M
.5 Sec
Key:
H - Honeywell
A - Aichi
M - Memory(rabbit)
EMI - Electromagnetic Interference
Safe
~H ~A ~M
End
Normal 4
H A M
10 Sec
December 17, 2008
EMI 3
~H ~A M
.5 Sec
RockSat CDR
Normal 2
H A M
3 Sec
EMI 2
H ~A M
.5 Sec
Normal 3
H A M
3 Sec
52
Brace A
December 17, 2008
RockSat CDR
53
Brace B
December 17, 2008
RockSat CDR
54
Brace C
December 17, 2008
RockSat CDR
55
Longeron
December 17, 2008
RockSat CDR
56
Tray A
December 17, 2008
RockSat CDR
57