Transcript civinini
The CMS Silicon Strip Tracker Carlo Civinini INFN-Firenze On behalf of the CMS Tracker Collaboration Sixth International "Hiroshima" Symposium on the Development and Application of Semiconductor Tracking Detectors Carmel Mission Inn, California September 11-15, 2006 Pixel Detector Inner Barrel (TIB) The CMS 1.2 m Silicon Tracker Inner Disks (TID) 2.7 m Outer Barrel (TOB) End Caps (TEC) •4 layers in TIB •6 disks in TID •6 layers in TOB S. Mersi •18 disks in TEC Silicon Strip Modules • TIB Module Front-End Hybrid APV and control chips 29 different Module Flavours Kapton tails Pitch Adapter Kapton Bias Circuit All single sided sensors double sided detectors Carbon Fiber/Graphite Frame are realized gluing back to back two single Silicon sidedSensors modules 13.09.2006 Carlo Civinini INFN-Firenze STD06 3 Sensors • p on n • 6” wafers • Inner region: low resistivity 1.5-3.5 kWcm, thin 320 mm • Outer region: higher resistivity 3.5-7.5 kWcm, thick 500 mm • Polysilicon resistor Biasing • AC-coupled Al readout strips • <100> Si orientation • Metal overhang on implant strips • Single sided This room is 180 m2 13.09.2006 6.136 Thin wafers 6.136 Thin detectors (1 sensor) 18.192 Thick wafers 9.096 Thick detectors (2 sensors) More than 200 m2 of Silicon Surface 16 Sensor Designs Carlo Civinini INFN-Firenze STD06 4 Front-end Electronics 12 hybrid designs 9.648.128 Strips electronics channels PLL75.376 APV chips 26.000.000 Bonds 37 000 analog optical links MUX 3000 km optical fibres APV25 Kapton Multilayer Hybrid circuit DCU 13.09.2006 Carlo Civinini INFN-Firenze STD06 5 Front-end Electronics • APV25 • Radiation tolerant 0.25 mm CMOS technology • Charge sensitive amplifier with t=50 ns, CR-RC shaper, 192 cell pipeline (4.8 ms deep) per channel • 128 channels multiplexed to 1 analog output • Operation modes: Peak mode (1 sample, t=50 ns); Deconvolution mode (weighted sum of 3 samples, t=25 ns) High Luminosity • MUX • 2 APV25 chips outputs onto a single differential line • PLL • Decodes clock & trigger signals + delay adjusts • DCU • Slow control data 12 bit ADC (onboard temperatures, leakage current, low voltages) • AOH • Analog opto-hybrid, converts the front-end analog output current to laser light • All functional parameters of these devices can be down/uploaded by mean of I2C bus 13.09.2006 Carlo Civinini INFN-Firenze STD06 6 Module Test • The 15232 (+spares) produced modules have been tested to spot possible problems and each strip has been characterized in term of noise, short, open, pinhole etc… • Information about module quality has been stored in a production database • A large fraction of production has been also thermally stressed before integration on the mechanical structures 13.09.2006 Carlo Civinini INFN-Firenze STD06 7 Module Test opens noisy TOB noise distribution for 4-chip and 6-chip modules 400V bias (30% production) 13.09.2006 Carlo Civinini INFN-Firenze STD06 C. Marchettini 8 Module Production Summary Modules produced Good after Bad* assembly* % good TIB/TID 3945 3810 135 97% TOB 5434 5348 86 98% TEC 7228 6761 467 94% Total 16607 15919 688 96% M. Krammer Percentage of bad strips on good modules at level of 0.05% - 0.1% * Sept. 4st 2006 (Includes also module repair) 13.09.2006 Carlo Civinini INFN-Firenze STD06 9 TIB Integration … how to assemble a piece of Tracker (16 half shells) 13.09.2006 Carlo Civinini INFN-Firenze STD06 10 TIB Integration • • • • Mechanical structure (with cooling pipes and precision ledges) Mount Analog OptoHybrids and Mother Cables Modules installation Tests 13.09.2006 Carlo Civinini INFN-Firenze STD06 11 Mechanical Structure Temporary fibre Holders Carbon fibre Structural part PT1000 Temperature Probes Cooling pipes Half shell of half barrel Cooling precisionTIB+ or TIBLedges Depending on the side of the interaction point 13.09.2006 Carlo Civinini INFN-Firenze STD06 12 AOH and MC Mounting Mother Cable: Kapton circuit which provides2 Modules withpigtail power,optical fibres meters long clock, trigger and I2C data Analog Optical Hybrid Analog electrical signals from the module 13.09.2006 Carlo Civinini INFN-Firenze STD06 13 Modules • • • • Each module has been mounted by hand on the mechanical structure Double sided modules, because of their complexity, need a simple mechanical tool to guide the operator’s hand The precision is anyway defined by the mechanics, no loss of precision or reproducibility in this operation Very rare accidents because of handling… Precision Insert 13.09.2006 Precision Insert Carlo Civinini INFN-Firenze STD06 14 Tests • After each single module has been mounted a fast connectivity test is done (I2C bus scan, module identity check) • When a string of modules (3) is mounted a deep test is performed: readout timing and optoelectronics optimization then pedestals and noise @ 400V bias 13.09.2006 Carlo Civinini INFN-Firenze STD06 15 Cumulative noise Layer 4 Backward up noise Distribution Deconvolution 400V bias 2.1 is the cut used During module production Test to flag a noisy strip Opens (0.03%) ADC Counts C. Genta 13.09.2006 Carlo Civinini INFN-Firenze STD06 16 Full of modules… 13.09.2006 Carlo Civinini INFN-Firenze STD06 17 Burn in • All TIB half shells and TID disks were checked for possible weak components fail and for temperatures and noise behaviour • A structure is fully powered and readout during this test. • Runs are taken both at room temperature and at cold (C6F14 @ -25oC and sensors @ -15oC), peak and deconvolution mode • Same sequence as integration: timing and optogain optimization then pedestals and noise run 13.09.2006 Carlo Civinini INFN-Firenze STD06 18 Burn-in Noise Noise distribution at Burn-in of Layer4 backward up Deconvolution 400V Bias A. Venturi M. Vos 13.09.2006 Carlo Civinini INFN-Firenze STD06 ADC counts 19 The TIB half shells are coupled together and then inserted one into the other (4,3,2,1 sequence) to form the barrel Building the TIB+ T. Lomtadze & A. Basti 13.09.2006 Carlo Civinini INFN-Firenze STD06 20 TIB+ Seen from the interaction point 13.09.2006 Carlo Civinini INFN-Firenze STD06 R. Dell’Orso 21 Conclusions • The CMS Silicon Strip Tracker Collaboration has finished the components production – O(105) complex objects (modules, electronics boards, mechanical parts, cables, fibres, etc.) tested • The integration phase is now well advanced (an O(105) pieces puzzle) and the different subdetectors (TIB/TID, TOB, TEC) will be joined together in the coming months • Then commissioning and finally Physics… 13.09.2006 Carlo Civinini INFN-Firenze STD06 22