Transcript Software and Computing Board -- MB Mar14

US CMS Silicon Tracker
Project
Regina Demina
KSU
Florida State University
May 11, 2002
A bit of history
 End of 1999 – CDF and DØ silicon
 December 1999 – CMS made a decision
detectors (~10 m2 of silicon, ~2M
to go with all silicon tracker =
channels) out of SiDet to be installed  68m2(inner barrel and disks) +
in collision halls
164m2(outer barrel and disks) = 232m2
 5.1 M + 5.6 M = 10.7 M channels
A natural decision for US institutions to join the silicon effort.
CDF SVX installation
Si Tracker Group
Fermilab
 B. Flaugher, R. Lipton, P. Rapidis, L. Spiegel, S. Tkaczyk
Kansas State University
 T.Bolton,R.Demina,W.Kahl,S.Korjenevski,
 W.Reay, R.Sidwell, N.Stanton
Two new groups
Northwestern University
Will provide
 D. Buchholz
Texas Tech University
important
 A. Sill
support for the
University of California, Riverside
UCSB production
 Gail Hanson
line
University of California, Santa Barbara
 C.Campagnari, D. Hale, J.Incandela
University of Illinois, Chicago
 L. Chabalina, C. Gerber
University of Kansas
 P. Baringer, A. Bean, L. Christofek, X. Zhao
University of Rochester
 R. Eusebi, E. Halkiadakis, A. Hocker, P. Tipton
Silicon tracker in Spring 2000
 Single sided, low resistivity silicon sensors as a baseline technology
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 extensively tested by RD20 – rad hard to >10 Mrad
 Several vendor qualified (6” production lines)
Working front end chip – APV25, some issues to be resolved with
multiplexer chip – MUX PLL
Hybrids – two technologies considered
Mechanics in excellent state – a lot inherited from MSGC’s
Plan to start production in fall 2001
Outer Barrel Space Frame
Spring 2000
Outer Barrel Rods
Spring 2000
Silicon modules
Automated assembly
3 TOB modules/ 30 min
Gantry at CERN
Spring 2000
SiTrkr Organization
Schedule Issues
Schedule slipped by ~ a year
Hybrid schedule is a concern
Decision on technology was made in September 2000  prototyping was semisuccessful  might change the technology
FEDs
Initial models for testing of large quantities of FE hybrids and modules
expected to be ready in late 2002
Optical models for rod testing will be available 6/03
Optical hybrids for assembly of modules into Rods will be
available in late 2002
Other critical items are performing better
Gantries
PC based test stands
Probe stations
Sensors
FE Hybrid status
• Industrial hybrid (V0 – unpackaged chips on ceramics)
production started with 1st Producer. 160 Hybrids delivered
(yield 65%) They also say that “the feature size” of hybrid is
too small for mass production.
• The 2nd producer has still problems with shorts.
• Design of the V1 version of the hybrid (packaged chips on
ceramic- easier to produce) done. Send order to 1st producer.
• 40 substrates hybrids V2 (packaged chips on FR4) received,
some 10 populated. Hybrids and substrates distributed for
mechanical and electrical tests. They look ok. Likely change
in technology choice.
HIP and pinhole effects on
APV25
 Highly Ionizing Particles
 produced in nuclear interactions, a rare
phenomenon)
 can saturate entire APV for ~200 ns
 Results in inefficiency of ~1.3%
 Pinholes
 Leakage current directly into APV25
 Typically disconnected from readout
 Signal inefficiency of >=2 connected
pinholes/APV
 Rate of new pinhole development <10/(few
100 wafers=1000 APV’s)
 Fixes
 Change resistor value on hybrid (100W
50W)
 APV inverter off – reduces dynamic range
PSI test beam planned
at the end of May to
further study the effect
US to provide modules
TOB Module
2 sensors bonded together  PA hybrid (4 APV25 chips)
~20 cm
Build 6,000 TOB modules
Current plan 2/3:1/3 at FNAL:UCSB
CMS module production
 Sensors probed at K-State
 Automated module assembly system – Gantry - is fully
commissioned at Fermilab
 Placement accuracy <5um
 4 (+3) fully functional modules were delivered to CERN for test
beam studies at PSI.
 3m
Module Testing at FNAL
ARCS
CMS DAQ
Two test systems are now in operation at SiDet
From R&D to Production
R&D
production