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Personal and Portable: The technology that is making it happen Gene A Frantz Principal Fellow Texas Instruments Decades of Digital Signal Processing Decade Characteristic $/MIPS ’60s University Curiosity $100 - $1,000 ’70s Military Advantage $10 - $100 ’80s Commercial Success $1- $10 ’90s Consumer Enabler 10¢ - $1 Beyond Expected Part of Daily Life 1¢ - 10¢ Generations of DSP Processing Processors 1980 1990 Technology Product Technology What is DSP? How do I create a product? How do I solve problems? Early DSP’ing Milestones Before 1965: First tentative steps 1965: Rediscovery of the FFT 1965 to 1970: The potential becomes clear 1970 to 1980: Tools are developed 1980: VLSI makes it practical Now: Incredible computational power opens up many new applications Courtesy of Ron Schafer Some Early Contributors Bishnu Atal John Markel, Steen Gray John Makhoul Manfred Schroeder Courtesy of Ron Schafer The TX-2 Computer, Circa 1967 Courtesy of Ron Schafer Another Contributor Jack Kilby 1st Integrated Circuit One View of DSP, Circa 1976 “That discipline which has allowed us to replace a circuit previously composed of a capacitor and a resistor with two anti-aliasing filters, an A-to-D and a Dto-A converter, and a general purpose computer (or array processor) so long as the signal we are interested in does not vary too quickly.” Thomas P. Barnwell, III = IN Filter A/D DSP D/A $50 $50 $500 $50 Filter OUT $50 Courtesy of Ron Schafer Early DSP’or Milestones 1978: TI “Speak and Spell” DSP synthesizer 1979: Intel 2920 “Analog Signal Processor” 1979: American Microsystems International S28211 1980: NEC µPD7720 1980: AT&T Bell Labs DSP-1 (captive) 1982: TI TMS32010 Courtesy of Will Strauss The Key Drivers “Smaller Features Lower Cost/Function Larger Market” 1000 Plotted Annually 10 100 History 1 Forecast 10 0.1 0.01 1960 1970 1980 1990 2000 1 2010 Global IC Sales ($B) "Minimum Feature Size" (µm) 100 Lithography Advancements Fuel Growth Nanometer 400nm 350nm 250nm 180nm 130nm 90nm 6" 6" 6" 8" 12" 12" Die size (mm2) 80.7 46.6 19.2 10.7 6.7 4.2 Dies per wafer 310 558 1435 2626 12,186 18,667 5922% increase in dpw Shrinking Process: The Benefits Device Year Transistors Process 32010 1983 50,000 3.0um NMOS 32020 1984 100,000 2.4um NMOS 320C30 1988 500,000 1.0um CMOS 320C50 1990 1,200,000 0.8um 320C5510 2000 22,000,000 0.18um 320C556x 2002 180,000,000 0.13um Wafer Fabs Wafer size: 300mm Final capacity: 35K+ wafers/ month Technology: 130nm copper 90nm copper # Tools on floor: 320 1st full flow silicon: 2-15-01 130nm qualification: 2Q02 90nm customer prototypes: 2H02 90nm qualification: 2H03 Fab Space Greater than 10K wafers per month Waffle table: Total mfg: 118K sq. ft. 150K sq. ft. 130 nm Copper Technology Today Wireless Infrastructure Wired WiredInfrastructure Infrastructure Performance Audio Digital Still Client Camera Wireless Wireless Infrastructure 6 DSP CPU 600 MHz Viterbi Viterbi and Turbo and Turbo hardware hardware accelerators accelerators Wireless Client @ 300MHz 6225 DSPMHz CPU DSP+GPP 3MB 24Mb DSP+GPP @ 300MHz integrated Imaging 600 MHz memory Floating Low power 3MB integrated accelerators 180M point consumption memory transistors DSP+GPP Low power consumption Voice, data, video Viterbi Voice, 180Mdata, transistors TMS320C6416 TMS320C5561and Turbo OMAP5910 video hardware acceleratorsAudio Digital Still Camera Performance DSP+GPP Imaging TMS320C5561 accelerators TMS320DM310 TMS320DA610 OMAP5910 TMS320C6416 TMS320DM310 225 MHz Floating point TMS320DA610 90 nm Transistor Over 400 million transistors on a single chip Functional integration to create entire system on one chip 37 nm Delivery Initial test chips in 90 nm process – 1H02 First device – 2H02 Fully qualified production – 2H03 Result Cost-effective, system-on-a-chip Unprecedented performance levels Significant power savings 12" 6" What will it cost? 100 1000 450 ? 300-mm 100 200-mm 10 150-mm 100-mm 1 1975 1980 1985 1990 1995 2000 2005 Exposure Tool Cost [$M] Polished Wafer Cost [$] 10000 i-line g-line 1x scan 1980 1985 1990 1995 2000 2005 2010 100 Transistor Cost [m¢] Wafer Fab Cost [$B] 1 0.1 1975 2010 100 10 1 0.1 0.01 1975 EUV 157-nm 193-nm 248-nm 10 1980 1985 1990 1995 2000 2005 2010 10 ? 1 0.1 0.01 0.001 1980 1985 1990 1995 2000 2005 2010 The Future of Integration DEVICE CAPABILITIES 1982 1992 2002 2012 Technology (uM) 3 0.8 0.1 0.02 Transistors 50K 500K 180M 1B MIPS 5 40 5,000 50,000 RAM (bytes) 256 2K 3M 20M Power (mW/MIPS) 250 12.5 0.1 0.001 Price/MIPS $30.00 $0.38 $0.02 $0.003 The Greatest DSP Products Haven’t Been Invented Yet Trends In Technology Transistors moving from microns to nanometers Gates per square millimeter going from tens of thousands to hundreds of thousands Die sizes shrinking from tens of square millimeters to units of square millimeters Wafer size moving to 300 millimeter Dies per wafer increasing from thousands per wafer to tens of thousands per wafer Tooling costs going from hundreds of thousands of dollars to millions of dollars Fab cycles increasing from weeks to months The Age of Computing ???? TAM Internet $500B DSP & Analog PC $100B Microprocessor $10B Minicomputer TTL/Logic $1B Mainframe Transistors 1960s 1970s 1980s 1990s 2000s 2010s The Perfect Roadmap One Device Even Fewer Devices Fewer Devices Lots of Devices Time Quiz Who is the only DSP Guru with their picture on a Nation’s Currency? Quiz Who is the only DSP Guru with their picture on a Nation’s Currency?