Transcript Diamond Chip Ppt3 - Latest Seminar Topics

Electronics without silicon is unbelievable.
 Today, we are using silicon for the
manufacturing of Electronic Chip's.
 But, it has many disadvantages , when it is
used in power electronic applications, such
as bulk in size, slow operating speed etc.
 Silicon chip, which has supplied several
decades’ worth of remarkable increases in
computing power and speed, looks unlikely
to be capable of sustaining this pace for
more than another decade .


Carbon, Silicon and Germanium belong to
the same group in the periodic table.

They have four valance electrons in their
outer shell.

Pure Silicon and Germanium are
semiconductors in normal temperature.

So in earlier days they were used widely for
the manufacturing of electronic components.
But later it was found that Germanium has
many disadvantages compared to silicon,
such as large reverse current, less stability
towards temperature etc.
 So the industry focused in developing
electronic components using silicon wafers.

Now research people found that Carbon has
more advantages than Silicon.
 By using carbon as the manufacturing
material, we can achieve smaller, faster and
stronger chips.

In single definition, Diamond Chip or
carbon Chip is an Electronic Chip
manufactured on a Diamond structural
Carbon wafer.
OR

It can also be defined as the Electronic
Chip manufactured using carbon as the
wafer.

Firstly, diamond structural carbon is nonconducting in nature.
 To make it conducting - doping process is
performed.
 Boron--as the p-type doping Agent
 Nitrogen--as the n-type doping agent.
 This process is similar to Silicon chip
manufacturing.
 But this process will take more time
compared with that of silicon because it is
very difficult to diffuse through strongly
bonded diamond structure.

A diamond semiconductor
operates on 81 GHz
frequency, and is more than
twice the speed of earlier
devices.
Developed by the Nippon
Telegraph and Telephone
Corporation (NTT), Japan.
According to NTT, this latest
development will allow
amplification in the
millimeter-wave band from
30 to 300 GHz possible for
the first time.
 Smaller
 It
Components Are Possible
Works At Higher Temperature
 Faster
Than Silicon Chip
 Larger
Power Handling Capacity
 Smaller
Components Are Possible
 As
the size is smaller -- it is possible to cut
very smaller lines through diamond
structural carbon.

We can imagine a transistor whose size is
one-hundredth of silicon transistor.
 It
Works At Higher Temperature
 At
very high temperature, crystal structure of
the silicon will collapse.
 But
diamond chip can function well in these
elevated temperatures.
 Diamond
has an extremely high thermal
conductivity, can withstand high electric
fields, and can be made into a semiconductor
-- ideal for power devices.
 It
Works At Higher Temperature (contd..)

They can work at a temperature of up to
1000 degrees Celsius, while silicon chips stop
working above 150 degrees Celsius

Diamond can also resist voltages up to
around 200 volts, compared to around 20
volts for a silicon chip.

Due to this power electronics, such as an
inverter, can become made much smaller in
size.
 Faster
Than Silicon Chip
 Mobility
of the electrons inside the doped
diamond structural carbon is higher than
that of in the silicon structure.
 As
the size of the silicon is higher than that
of carbon, the chance of collision
of electrons, with larger silicon atoms
increases as compared to carbon chip.
 Larger
Power Handling Capacity
 Diamond
has a strongly bonded crystal
structure. So carbon chip can work under
high power environment.
 It
is assumed that a carbon transistor will
deliver one watt of power at rate of 100 GHZ.
 The
inter phase between low power control
circuit with a high power circuit will not be
needed as we can directly connect high
power circuits with a diamond chip.

Much more expensive than silicon
 A four-millimeter-square diamond substrate
costs several tens of thousands of yen
compared to virtually nothing for silicon.

Electricity cannot travel smoothly
through diamond
 Researches
are seeking impurities that can be
added to aid electricity flow.

The chip would be most useful in devices
located near hot-burning engines.

Thus Diamond Chip replaces the need of
silicon chip in every aspect in future
generations