Transcript I+D en el CNM/IMB para futuros aceleradores Manuel Lozano

I+D en el CNM/IMB para
futuros aceleradores
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Update from Santiago meeting, October 2008
Manuel Lozano
ILC Meeting. Barcelona, May 2008
CNM Clean Room expansion
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From 1000 to 1500 m2
Still waiting for some equipments relevant for advanced
packaging
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IFCA
Wafer grinder
CMP
Wafer alignment and bonding system (3D packaging)
Not
ready
yet
Clean room operational, but not 100%
Manuel Lozano
I+D en el CNM/IMB para futuros aceleradores
ILC Meeting. Barcelona, May 2008
New equipment:
Plastic Laser-sintering system
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EOS FORMIGA P 100 (Germany)
Very fast prototyping
From CAD to piece in a couple of
hours
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Effective building volume:
20 cm x 25 cm x 33 cm
Resolution ~0.1 mm
20 mm height/hr
Very interesting to test new
ideas either at reduced scale or
actual size or to make
functional pieces
Manuel Lozano
I+D en el CNM/IMB para futuros aceleradores
ILC Meeting. Barcelona, May 2008
New equipment:
Plastic Laser-sintering system
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Examples:
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Very complex pieces
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Springs
Nut and bolts
Hinges
Micropipes
Only limitation, no
closed cavities
Different materials
available
Manuel Lozano
I+D en el CNM/IMB para futuros aceleradores
ILC Meeting. Barcelona, May 2008
IR transparent detectors
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In collaboration with IFCA
Mask finalized
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Manuel Lozano
IFCA
12 different detectors
Common parameters:
active area= 1.2x1.5 cm2
circular window in the back
metal (r=0.5 cm)
256 readout strips with 1.5 cm
length
9 guard rings and scribe line
with n-well
6 detectors have been
completed with floating
intermediate strips in order to
improve spatial resolution
using the capacitive charge
division principle.
I+D en el CNM/IMB para futuros aceleradores
ILC Meeting. Barcelona, May 2008
IFCA
IR transparent detectors
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Processing run started
p+
p+
p+
p+
p+
Si
n+
15 μm strip width
5 μm metal width
Intermediate strip
Manuel Lozano
p+ strip width
Metal width
Intermediate strips
1
15um
15um
1
2
15um
10um
1
3
15um
5um
1
4
15um
3um
1
5
12.5um
5um
1
6
17.5um
5um
1
7
15um
15um
no
8
15um
10um
no
9
15um
5um
no
10
15um
3um
no
11
12.5um
5um
no
12
17.5um
5um
no
I+D en el CNM/IMB para futuros aceleradores
ILC Meeting. Barcelona, May 2008
IR transparent detectors
p+
I0
p+
Will be tested at IFCA using
ALIBAVA System with laser
p+
p+
p+
Si
n+
Si
p+
p+
n+
Si
n+
34% I0
p+
49% I0
p+
p+
70% I0
p+
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IFCA
IR light is partially absorbed by silicon detectors
p+
IR Laser
pseudo track
Ф≈1mm open in the Al allows beam-through
Partially funded by Spanish Acces to
Large Facilities: GICSERV
Manuel Lozano
I+D en el CNM/IMB para futuros aceleradores
ILC Meeting. Barcelona, May 2008
3D detector technology
spreading
Diodes 2D
3x3 matrix
Medipix2
Test structures
Atlas pixel
3d pads
strips
Test for SEM
Long strip
MOS
10x10 matrix
Pilatus
Manuel Lozano
I+D en el CNM/IMB para futuros aceleradores
ILC Meeting. Barcelona, May 2008
3D detector technology
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Success with Medipix type pixel sensors
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Now we are designing of a new mask set for ATLAS pixel
sensors
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Work done in the framework of RD50 collaboration.
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Possibility of developing a prototype of B-layer for ATLAS
upgrade with 3D pixels
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0.5 m2, 2500 chips, 250 wafers
CNM will try to get the contract
Partially funded by Spanish Acces to
Large Facilities: GICSERV
Manuel Lozano
I+D en el CNM/IMB para futuros aceleradores
ILC Meeting. Barcelona, May 2008
ALIBAVA: A readout system for microstrip
silicon sensors
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System finished
20 units already distributed
New fabrication batch will start soon
Upgrade for test beam telescope
Upgrade for ethernet connectivity
Manuel Lozano
I+D en el CNM/IMB para futuros aceleradores
ILC Meeting. Barcelona, May 2008
Bump Bonding
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In collaboration with IFAE
Bump bonding already
working
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Medipix and ATLAS pixels
successfully bonded
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Now working to increase yield
and qualify the technology
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SET/Süss FC150 machine
1 micron placing accuracy
In-situ reflow
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Manuel Lozano
I+D en el CNM/IMB para futuros aceleradores
ILC Meeting. Barcelona, May 2008
Trenched detectors
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Work started in collaboration with IFAE (Cristobal
Padilla)
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Trenches used to reduce the dead area at the
edge of the sensor
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(also named edgeless, slim-edge, ...)
First application for ATLAS pixels
Can be extended to strips
Manuel Lozano
I+D en el CNM/IMB para futuros aceleradores
ILC Meeting. Barcelona, May 2008
Trenched detectors
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Initial configuration
UBM
30 um 6um
50 um
80um
Δ
10um 30um
SiO2
n+
n+
p+
Al
guard
p-stop
p+
150um
300um
Pixels
p+
n+
poly
p
p+
Side cut
(DRIE or Diamond saw)
Si3N4
•High resistivity polysilicon used to fill the trenches to assure mechanical strength
•Thermal oxide inside trenches to assure insulation.
Manuel Lozano
I+D en el CNM/IMB para futuros aceleradores
ILC Meeting. Barcelona, May 2008
Simulation
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The
trench
isolates
the
depletion
area
from
the
damaged cut.
The
equipotential
lines
accumulates at the implant
decreasing
the
breakdown
voltage.
However, it is still possible to
over deplete the detector.
Accumulation of equipotential lines
Manuel Lozano
I+D en el CNM/IMB para futuros aceleradores
ILC Meeting. Barcelona, May 2008
Trench + diamond saw cut
Manuel Lozano
I+D en el CNM/IMB para futuros aceleradores
ILC Meeting. Barcelona, May 2008
Trench filled with polysilicon
Manuel Lozano
I+D en el CNM/IMB para futuros aceleradores
ILC Meeting. Barcelona, May 2008
ATLAS upgrade readout electronics
Study of 3 tecnologies 0.25 μm SiGe
BiCMOS from IHP (Germany)
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KEY PARAMETERS
TECHNOLOGIES
FEATURES
SGB25VD
Low cost
SG25H1
SG25H3
fT
(GHz)
MAIN
TECHNOLOGY
Alternative
β
(target)
VCE0
(V)
50
190
4.5
190
200
1.9
120
150
2.3
3 transistor types from SGB25VD
technology (30, 50, 80 GHz)
 Minimum transistor in tech.
SG25H1 (0.17 μm2)
 2 different transistors from tech.
SG25H3 (0.17μm2 & 0.35μm2)
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Manuel Lozano
I+D en el CNM/IMB para futuros aceleradores
ILC Meeting. Barcelona, May 2008
GICSERV
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Easy access through the Spanish “Access to Large
Facilities” Program: ICTS GICSERV
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Last call January 2009
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7 projects approved (1 rejected) in detector technology
for HEP
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70 applications, 50 accesses
3D medipix-type detectors. Diamond (UK)
Stripixels. Laaperanta and BNL (Finland and USA)
Thin pixel detectors. Univ. Santiago
Thin strip detectors. IFCA
Atlas pixels with slim edge. IFAE
Increased efficiency detectors. Univ. Liverpool (UK)
Bump bonding for DEPFETS. MPI Halbleiterlabor (Germany)
5 projects in 2008, and 3 in 2007
Manuel Lozano
I+D en el CNM/IMB para futuros aceleradores
ILC Meeting. Barcelona, May 2008
Conlusions
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Transparent detectors processing.
Bump bonding working
Started activity in pixel and strip slim-edge
detectors
ALIBAVA system finished and distributed
Activity in ATLAS upgrade evaluating BiCMOS
technologies
GICSERV working satisfactory
Manuel Lozano
I+D en el CNM/IMB para futuros aceleradores