Transcript Presentation Title

CAN FD in ST Powertrain
Microcontroller Products
Paul Fox
Automotive Microcontroller Marketing
Automotive Microcontroller Market Trend
Next generation MCU for Powertrain
Powertrain market trends are driving the MCU
• Segregation between developing and developed markets
• Increased diversity of powertrain configurations
• Gasoline PFI, GDI, Diesel DI, HCCI?
• Hybrid : is coming in addition to diesel/gasoline
• light hybrid (start/stop), mild hybrid till ability to run in zero emission mode.
• Exhaust post treatment, turbo technologies also increase the configurations
• Electric propulsion
• More scalable and standardized MCU products are needed from very
low end cost driven derivatives to super integrated performance
CAN FD Tech Day
17/07/2015
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Automotive Microcontroller Market Trend
Next generation MCU for Powertrain
Powertrain market trends are driving the MCU
• Increased number of sensors / actuators in combustion engines for
emission demanding countries
• New types of analog acquisitions :
• In-cylinder pressure, crank position sensor with higher precision and faster synchronization
• Different sensors / actuator interfaces
• SENT, PSI5, LIN
• I/O serialization is helping to reduce MCU package pin count
• Microsecond bus between MCU and ASSP
• New actuators
• Valve train electrification
CAN FD Tech Day
17/07/2015
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Microcontroller in Powertrain – Requirement Shift
Example: MCU requirement for 4Cylinder GDI Engine Management control
MCU in Y2005
MCU in Y2010
MCU in Y2015
McKinley
16Bit
64MHz ST10 Single CPU
MAC Unit
32Bit
80MHz PPC-Z3 Main CPU
Floating Point Unit
32Bit
2x200MHz Z4d Main CPU
Floating Point Unit
200MHZ Z4d IO CPU
832Kbyte Flash Memory
68k RAM
CAPCOM / PWM Module
Serial Interface: 2xUSART,
2xSPI, 2x I2C
QFP144
1.5Mbyte Flash Memory
94k RAM
eTPU Timer Module
Serial Interface: 2xSCI,
2xSPI, 2xCAN
QFP144/176
INNOVATION
Monaco
INNOVATION
ST10F276
4Mbyte Flash Memory
304k RAM
High-end GTM Module
Serial Interface: 2xFlexRay,
1xEthernet, 3xM-CAN,
1xTT-CAN, 5xLINFlex,
1xI2C, 7xDSPI,
10xSENT, 3xPSI5
eQFP176/BGA292
 ~40DMIPS Performance
 180nm Technology,
ST-Rousset 8”
 ~9Mio Transistors
 Users Manual: 230pages
 ~80DMIPS Performance
 90nm Technology,
ST-Rousset 8”
 ~28Mio Transistors
 Users Manual: 800pages
 ~500DMIPS Performance
 55nm Technology,
ST-Crolles 12”
 ~106Mio Transistors
 Users Manual: 5000pages
COMPLEXITY INCREASE
CAN FD Tech Day
17/07/2015
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Increased Device Complexity
Key drivers
• New market requirements
• Safety
• Security
• Multicore processing
• SW standardization
• New calibration concepts
• New Networking
• Legacy or customer specific requirements
• Peripherals / Interfaces
• Timer modules
CAN FD Tech Day
17/07/2015
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Example: McKinley – 4M SPC57EM80
6
Block Diagram
I/O
IEEE-ISTO
5001-2010
INTC
STM
SWT
64 eDMA
FlexRay
D-RAM
Ethernet
I-RAM
DigRF
INTC
STM
SWT
HSM
e200z4
8k-I
Cache
FPU
VLE
DSP
I-RAM
Power
Architecture™
Power
Architecture™
Power
e200z7
Architecture™
e200z4
8k-I/4k-D
Cache
FPU
VLE
e200z4
8k-I/4k-D
Cache
FPU
VLE
INTC
INTC
INTC
STM
SWT
I-RAM
D-RAM
D-RAM
Crossbar Switch
Crossbar Switch
Memory Protection Unit
Memory Protection Unit
256k Data
FLASH
16k
Overlay
RAM
128k
S-RAM
8x SAR ADC
6x Σ-Δ ADC
3x PSI5
10x SENT
1x I2C
5x LINFlex
Timer
7x DSPI
Memory
3x M-CAN
System Platform
1x TT-CAN
34k SRAM
GTM
(High-End Version)
4M
FLASH
Cal Bus
I/O
Bridge
2xTsens
I/O
Bridge
2x CRC
FCCU
8x PIT
FMPLL
• Most of the pripherals are small, but the
added device complexity results in large die
size
• Effort has to be standardized so not to add
additional device complexity when going for
higher performance
 FD CAN is a good example
Debug
JTAG
Nexus
Power
Architecture™
BAM
• Generic Timer Module (High-End Version)
• 32 Inputs, 88 Outputs
• Dual Channel FlexRay (10MB/s), 64 buffers
• 3 x M-CAN (with full FD CAN support)
• 1 x TT-CAN
• 5 x LINFlex
• 7 x DSPI including 2 x μSB
• 1 x Ethernet
• 1 x I2C
• 10 x SENT
• 3 x PSI5
• 1x LFAST (Interprocessor bus)
Available
Peripherals
CAN FD Tech Day
17/07/2015
FD CAN advantages
CAN Evolution
• Close the bandwidth gap between CAN and other high bandwidth IF‘s
• Avoid increased system cost
• Use existing network topologies on physical layer
• Provide an upgrade path so not a totally new protocol
CAN FD Tech Day
17/07/2015
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CAN improvements
• To overcome the current data rate limitation on classical CAN
networks the CAN spec can be changed in two directions:
• Increase the baud rate
• Increase the number of data bytes per CAN frame
• Stay compatible with today technology on CAN physical layer
• Existing CAN transceiver shall be compatible with future improvements on CAN
spec
The Robert Bosch GmbH has translated these requirements into the
new specification „CAN with Flexible Data-Rate “called CAN FD
CAN FD Tech Day
17/07/2015
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Conclusion
• CAN FD is a good approach to deal with increased bandwidth
requirements in Automotive networks while maintaining existing
protocols
• CAN FD could close the gap between standard CAN and higher
bandwidth protocols (e.g. FlexRay)
• Will depend on the overall device and tool availabilty
• Low effort to migrate to CAN FD, rather than implementing a new
standard
• STMicroelectronics has implemented CAN FD in new powertrain
devices
Presentation Title
17/07/2015
9
Thank You !