Transcript Silicon strips readout using Deep Sub

130nm Digital Sampler chip
New results
Jean-François Genat
on behalf of
D. Fougeron, 1 R. Hermel 1, H. Lebbolo 2, T.H. Pham 2, R. Sefri,
and
A. Savoy-Navarro 2
1 LAPP
Annecy,
2 LPNHE
Paris
5th SiLC Meeting, April 25-27th 2007, Prague
2
Outline
•
Goals
•
Last results
•
New results
•
Further tests
•
Next chip
J-F Genat, 5th SiLC meeting,
Prague, April 25-27th 2007
Goals
This chip
Full readout chain integration in a single chip
-
Preamp-shaper
Trigger decision (analog sums)
Pulse Sampling: Analog pipe-lines
On-chip digitization: ADC
Buffering and pre-processing:
Centroids, Least square fits,
- Lossless compression and error codes
- Calibration and calibration management
- Power switching (ILC timing)
•
•
•
CMOS 130nm
CMOS 90nm
512-1024 channels envisaged
J-F Genat, 5th SiLC meeting,
2006
2007
Prague, April 25-27th 2007
yes
yes
yes
yes
yes
no
no
no
no
yes
no
4 channels
Front-end in 130nm
130nm CMOS:
Smaller
Faster
More radiation tolerant
Lower power
Will be (is) dominant in industry
Drawbacks:
-
J-F Genat, 5th SiLC meeting,
Reduced voltage swing (Electric field constant)
Leaks (gate/subthreshold channel)
Models more complex, not always up to date
Crosstalk (digital-analog)
Prague, April 25-27th 2007
2006 Chips Summary
130nm
Chip #1
Under tests
-
Preamp-shapers + Sparsifier
Pipeline 1
ADC
Digital
Chip #2
J-F Genat, 5th SiLC meeting,
(4 channels)
(One channel)
Preamp-shapers + Sparsifier
DC servo
Pipeline 2
DAC
Test structures: MOSFETS, passive
Prague, April 25-27th 2007
4-channel chip
Channel n+1
Sparsifier
Can be used for
a “trigger”
S aiVi > th
Time tag
Channel n-1
reset
reset
Analog samplers, (slow)
Wilkinson
ADC
Strip
Ch #
Preamp +
Shapers
Waveforms
Counter
UMC
CMOS 130nm
Clock 3-96 MHz
J-F Genat, 5th SiLC meeting,
Prague, April 25-27th 2007
Targeted
Amplifier:
Shaper:
Sparsifier:
Sampler:
ADC:
20 mV/MIP gain
threshold on analog sum
16-deep
10-bit
Noise:
Measured with 180nm CMOS:
375 + 10.5 e-/pF @ 3 ms shaping, 90mW power
J-F Genat, 5th SiLC meeting,
Prague, April 25-27th 2007
Outline
•
130 nm chip goals
•
February results
•
Present results
•
Further tests
•
Next chip
J-F Genat, 5th SiLC meeting,
Prague, April 25-27th 2007
Silicon
180nm 130nm
Picture
J-F Genat, 5th SiLC meeting,
Prague, April 25-27th 2007
130nm chip noise results (2/’07)
Gain OK:
Dynamics:
Peaking time:
30 mV/MIP
30 MIPs @ 5%
.8 – 2ms
OK
OK
.7 - 3 ms
Power (Preamp+ Shaper) = 290 mW
Noise:
130nm @ 0.8 ms : 850 + 14 e-/pF
130nm @ 2 ms :
625 + 9
e-/pF
180nm @ 3 ms :
375 + 10.5 e-/pF
J-F Genat, 5th SiLC meeting,
Prague, April 25-27th 2007
625*sqrt(2/3 ms)=510 e-/pF
Outline
•
130 nm chip goals
•
Last results
•
Present results
•
Further tests
•
Next chip
J-F Genat, 5th SiLC meeting,
Prague, April 25-27th 2007
Analog pipeline output
Simulation of the analog pipeline
J-F Genat, 5th SiLC meeting,
Prague, April 25-27th 2007
Measured output of the ADC
ADC
J-F Genat, 5th SiLC meeting,
Prague, April 25-27th 2007
Sampler + ADC
Waveform biased by the output pad parasitic capacitance (~ 1pF)
Chip130-2 under tests: buffer between sampler and ADC
J-F Genat, 5th SiLC meeting,
Prague, April 25-27th 2007
Outline
•
130 nm chip goals
•
Last results
•
Present results
•
Further tests
•
Next chip
J-F Genat, 5th SiLC meeting,
Prague, April 25-27th 2007
130-1 next tests
Measure ADC extensively
Linearities
integral, differential
Noise
fixed pattern, random
Speed
maximum clock rate
Effective number of bits (ENOB)
J-F Genat, 5th SiLC meeting,
Prague, April 25-27th 2007
130nm
Chip 2
DC Servo
Sparsifier
Channel n-1
S ai Vi > th
ADC
Channel n+1
ramp
Analog Pipe-line
Preamp and
Shapers
J-F Genat, 5th SiLC meeting,
Prague, April 25-27th 2007
130-2 tests (LAPP Annecy)
Measure improved pipeline extensively
Denis Fougeron’s (LAPP) design
Linearities
integral, differential
Noise
fixed pattern, random
Speed
maximum clock rate
Droop
Hold data for 1ms at ILC
J-F Genat, 5th SiLC meeting,
Prague, April 25-27th 2007
Outline
•
130 nm chip goals
•
Last results
•
Present results
•
Further tests
•
Next chip
J-F Genat, 5th SiLC meeting,
Prague, April 25-27th 2007
Next chip
Equip a detector:
Lab test bench and 2007 beam-tests
130nm chips 1 + 2
128 channels
-
J-F Genat, 5th SiLC meeting,
Preamp-shapers + sparsifier
Pipeline
ADC
Digital
Calibration
Power cycling
Prague, April 25-27th 2007
Power cycling
Switch the current sources between zero and a small fraction (10-2 to 10-3 )
This option switches the current source
feeding both the preamplifier & shaper
between 2 values to be determined by
simulation.
Zero or a small fraction (0.1% - 1%)
of biasing current is held during
« power off ».
Zero-power option tested on 180nm chip with 2 ms recover time constant
J-F Genat, 5th SiLC meeting,
Prague, April 25-27th 2007
Planned Digital Front-End
Chip control
Buffer memory
Processing for
- Calibrations
- Amplitude and time least squares estimation, centroids
- Raw data lossless compression
Tools
- Digital libraries in 130nm CMOS available
- Synthesis from VHDL/Verilog
- SRAM
- Some IPs: PLLs
- Need for a mixed-mode simulator
J-F Genat, 5th SiLC meeting,
Prague, April 25-27th 2007
Some issues with 130nm design
Noise likely not model pessimistic, but measured acceptable
Design rules more constraining
Some (via densities) not available under Cadence
Calibre (Mentor) required
Lower power supplies voltages
Low Vt transistors leaky (Low leakage option available)
J-F Genat, 5th SiLC meeting,
Prague, April 25-27th 2007
The End
…
Backup
Jean-François Genat
3d SiLC Workshop, June 13-14th 2006, Liverpool
Possible issues: noise:
130nm vs 180nm (simulation)
PMOS:
130nm
W/L = 2mm/0.5u
Ids = 38.79u,Vgs=-190mV,Vds=-600mV
gm=815.245u,gms=354.118u
1MHz  7.16nV/sqrt(Hz)
Thermal noise hand calculation = 3.68nV/sqrt(Hz)
Jean-François Genat
180nm
gm=944.4uS,gms=203.1uS
1MHz  3.508nV/sqrt(Hz)
Thermal noise hand calculation = 3.42nV/sqrt(Hz)
3d SiLC Workshop, June 13-14th 2006, Liverpool
Noise: 130nm vs 180nm
(simulation)
NMOS :
130nm
W/L = 50u/0.5u
Ids=48.0505u,Vgs=260mV,Vds=1.2V
gm=772.031uS,gms=245.341uS,gds=6.3575uS
180nm
W/L=50u/0.5u
Ids=47uA,Vgs=300mV,Vds=1.2V
gm=842.8uS,gms=141.2uS,gds=16.05uS
1MHz --> 24.65nV/sqrt(Hz)
1MHz --> 4nV/sqrt(Hz)
100MHz --> 5nV/sqrt(Hz)
Thermal noise hand calculation = 3.78nV/sqrt(Hz)
10MHz --> 3.49nV/sqrt(Hz)
Thermal noise hand calculation = 3.62nV/sqrt(Hz)
Jean-François Genat
3d SiLC Workshop, June 13-14th 2006, Liverpool
Preamp CR RC Shaper
Follower
Comparator
130-90nm noise evaluation (STM process)
L. Ratti et al
FE2006 Perugia
1 MHz
100 mA
J-F Genat
4th SiLC Workshop
1mA
Dec 18th – 20th 2006
Barcelone
Noise origin
Thermal noise white 4 kT/gm
Excess noise: not so white…
due to process features (?)
1/f noise due to:
- Traps at the gate dielectrics interfaces
- Mobility fluctuations in the channel
UMC models and measurements:
- The gate dielectric in 130nm induces more traps compared to 180nm
degrading 1/f noise. No more SiO2 in 90nm next generation CMOS
-> hi-k dielectrics (Hf, Zr …)
- Some thermal excess noise shows up
Ratti et al. (Pavia, Bergamo), CERN:
- Both ST90nm and IBM 130nm show better 1/f noise performance
To be looked at : UMC 90nm simulations
J-F Genat
4th SiLC Workshop
Dec 18th – 20th 2006
Barcelone
Backup
Silicon strips readout using CMOS
Deep Sub-Micron Technologies
Jean-Francois Genat
Leuven, Feb 26th 2007
J. David, 2 M. Dellhot, D. Fougeron, 1 R. Hermel 1,
H. Lebbolo2 , T.H. Pham 2, F. Rossel 2, A. Savoy-Navarro 2,
R. Sefri 2 , S. Vilalte 1
2
1 LAPP
Annecy,
2 LPNHE
Paris
Help from IMEC-Leuven (Europractice)
C. Das, E. Deumens, P Malisse
Outline
•
Detector data
•
Technologies
•
Front-End Electronics
•
180nm chip
•
130nm chips
•
Future plans
Silicon strips parameters
4-5 106 Silicon strips
10 - 60 cm long
Thickness Inner : 150 -200mm
Outer :
-400mm
Strip pitch
50 mm
Inner :
Outer :
Double sided AC coupled
Single sided DC coupled
Silicon strips data at the ILC
Pulse height: Cluster centroid to get a few µm position resolution
Detector pulse analog sampling to get accurate charge
estimation
Time:
Two scales:
Coarse : 150-300 ns for BC identification, 80ns sampling
Shaping time of the order of the microsecond
Fine:
nanosecond timing for the coordinate along the strip
10ns sampling
Not to replace another layer or double sided
Position estimation to a few cm using pulse reconstruction
from samples
Shaping time: 20-50 ns
Coordinate along the strip
SPICE
L =28nH
R =5 W
Ci=500 fF
15 ns
90cm
V = 6 107 m/s= c/5
Cs= 100 fF
V  1 / LC
1 ns time resolution is 6 cm
Measured Pulse Velocity
Measured velocity: 5.5cm/ns Measured moving a laser diode along 24 cm
Outline
•
Detector data
•
Technologies
•
Front-End Electronics
•
180nm chip
•
130nm chips
•
Future plans
Technologies
Silicon detector and VLSI technologies allow to improve detector and front-end
electronics integration
Front-end chips:
Thinner CMOS processes 250, 180, 130, 90 nm
now available from UMC, TSMC
SiGe, less 1/f noise, faster
Chip thinning down to 50 mm ?
More channels on a chip, more functionalities, less power
Connectivity:
3D ? On detector bump-bonding ? Stud bonding ?
Stud bonding sufficient if pitch more than 50mm
Smaller pitch detectors, better position and time resolution.
Less material
Outline
•
Detector data
•
Technologies
•
Front-End Electronics
•
180nm chip
•
130nm chips
•
Future plans
Integrated functionalities
Full readout chain integration in a single chip
- Preamp-shaper
- Trigger decision (analog sums) :
compact data
- Sampling: Analog pipe-lines
- On-chip digitization
- Buffering
- Digital Processing: Centroids and Least Squares time/amplitude
estimation
- Calibration and calibration management
- Power switching
Presently 128 channels (APV, SVX) chips, 256-1024 envisaged
Front-End Chip
Integrate 512-1024 channels in 90nm CMOS:
 Charge Amplifiers:
20-30 mV/MIP over 30 MIP
 Shapers:
- slow 500 ns – 1 ms
- fast 20-50 ns
 Zero-suppression: threshold the sum of adjacent channels
 2D analog memory: - 8-16 samples
80 ns and 10 ns sampling clocks
- Event buffer 16-deep




ILC timing:
ADC:
10 bits
Buffering
Calibration
Power switching saves a factor 100-200
1 ms: ~ 3-6000 trains @150-300ns / BC
200ms in between
Foreseen Front-end architecture
Channel n+1
‘trigger’
Sparsifier
S aiVi > th
Time tag
Channel n-1
reset
Strip
Wilkinson
ADC
Calibration
Control
reset
Analog samplers, slow, fast
Ch #
Waveforms
Preamp +
Shapers
Counter
Charge 1-40 MIP, Time resolution: BC tagging 150-300ns,
Technologies:
Future:
Storage
Deep Sub-Micron CMOS 180-130nm
SiGe &/or deeper DSM
fine: ~ 1ns
Outline
•
Detector data
•
Technologies
•
Front-End Electronics
•
180nm chip
•
130nm chips
•
Future plans
J-F Genat, LECC06,
Valencia, Sept 25-29th 2006
Silicon 2005
- Preamp
- Shaper
- Sample & Hold
- Comparator
16 + 1 channel UMC 180nm chip
3mm
(layout and picture)
Process spreads
Process spreads: 3.3 %
(same wafer)
Preamp gains statistics (same wafer)
Shaper output noise
375 e- RMS
375 e- +10.4 e-/pF input noise with chip-on-board wiring
275 + 8.9/pFsimulated
Linearities 180nm chip
+/-1.5% +/-0.5% expected
+/-6% +/-1.5% expected
Tests conclusions on UMC 180 nm chips
12 chips tested (end 2005)
The UMC CMOS 180nm process is mature and reliable:
- Models mainly OK
- Only one transistor failure over 12 chips
- Process spreads of a few %
90Sr
Source tests with 180nm chip connected to a Si detector and
compared with VA1 chip from Ideas (see test bench section)
S/N ~ 10 still system noise dominating
Outline
•
Detector data
•
Technologies
•
Front-End Electronics
•
180nm chip
•
130nm chips
•
Future plans
Front-end in CMOS 130nm
2006-2007
130nm CMOS motivations:
Benefits
-
Smaller
Faster
More radiation tolerant
Less power
Presently dominant in the IC industry
Issues:
-
Design more constraining (Design rules)
Reduced voltage swing (Electric field constant)
Leaks
(gate/subthreshold channel)
Models more complex, sometimes still not accurate
UMC Technology parameters
•
•
•
•
•
3.3V transistors
Logic supply
Metals layers
MIM capacitors
Transistors
180 nm
130nm
yes
1.8V
6 Al
1fF/mm²
Three Vt options
yes
1.2V
8 Cu
1.5 fF/mm2
Low leakage option
Useful for analog storage during < 1 ms
130nm 4-channel test chip
Channel n+1
Zero-suppression
Can be used for
a “trigger”
S aiVi > th
Time tag
Channel n-1
reset
reset
Analog samplers, (slow)
Ramp
ADC
Strip
Ch #
Preamp + Shaper
DC servo implemented for DC coupled detectors
UMC
CMOS 130nm
Received in 2006
Being tested: Analog OK, Digital under tests
Waveforms
Counter
Clock 3-96 MHz
Analog pipeline simulation
Silicon
180nm 130nm
Picture
Noise
130nm vs 180nm (simulation)
PMOS:
180nm
130nm
gm=944.4uS
Id = 30 uA
Weak inversion
1MHz  3.508nV/sqrt(Hz)
gm=815.245uS
Id =60 uA
Moderate inversion
1MHz  7.16nV/sqrt(Hz)
Thermal noise hand calculation = 3.42nV/sqrt(Hz)
Thermal noise hand calculation = 3.68nV/sqrt(Hz)
Measurements on 130nm show 2 x better results !
130nm-1
design
Noise models pessimistic ? 130nm CMOS Silicon actually 2x better !
Design rules more constraining
Post layout simulations at Leuven (Mentor)
Some design rules (via densities) not available under Cadence
Calibre (Mentor) required
130nm-1 conclusions
Good matching wrt simulation
Except noise which is…
much better !
-
Still lot to test: pipe-line and digital
-
Statistics available from two wafers (70 chips)
Very encouraging results
Go to 90 nm ?
130nm-2 design
One channel version with
- Servo DC
- Improved pipe-line
- Calibration DAC
Layout
Picture
One channel 1.5 x 1.5 mm2
130nm-2 architecture
DC servo to accommodate DC coupled detectors,
DAC + calibration,
Improved pipe-line
Preamp
Shaper
DC reference
Received January 5th 2007
Test card under wiring
Test stand under work
Analog sampler
Planned on-chip digital
Chip control
Buffer memory
Processing for
- Calibrations
- Amplitude and time least squares estimation, centroids
Tools
- Digital libraries in 130nm CMOS available (VST)
- Place & Route tools: Cadence + design kits
from Europractice (Leuven, Belgium)
Mixed mode needed
- Synthesis from VHDL/Verilog
- Some IPs: PLLs, SRAM
Wiring Detector to FE Chips
Wire bonding
Flip Chip Technology
Courtesy: Marty Breidenbach (Cal SiD)
OR (later)
Wiring Detector to FE Chips
Courtesy: Ray Yarema,
FEE 2006, Perugia
3D Wiring
Courtesy: Ray Yarema,
FEE 2006, Perugia
Manuel Lozano
(CNM Barcelona)
Chip connection
• Wire bonding
– Only periphery of chip available for IO
connections
– Mechanical bonding of one pin at a time
(sequential)
– Cooling from back of chip
– High inductance (~1nH)
– Mechanical breakage risk (i.e. CMS, CDF)
• Flip-chip
– Whole chip area available for IO connections
– Automatic alignment
– One step process (parallel)
– Cooling via balls (front) and back if required
– Thermal matching between chip and substrate
required
– Low inductance (~0.1nH)
J-F Genat, LECC06,
Valencia, Sept 25-29th 2006
Manuel Lozano
(CNM Barcelona)
Bump bonding flip chip technology
• Electrical connection of chip to
substrate or chip to chip face to face
flip chip
• Use of small metal bumps
bump bonding
CNM
• Process steps:
– Pad metal conditioning:
Under Bump Metallisation (UBM)
– Bump growing in one or two of the
elements
– Flip chip and alignment
– Reflow
– Optionally underfilling
Manuel Lozano
(CNM Barcelona)
Bump bonding flip chip technology
• Bumping technologies
– Evaporation through metallic
• Expensive technology
mask
– Especially for small quantities
– Evaporation with thick
(as in HEP)
photoresist
– Big overhead of NRE costs
– Screen printing
• Minimal pitch reported: 18 µm but ...
– Stud bumping (SBB)
• Few commercial companies for fine
– Electroplating
pitch applications (< 75 µm)
– Electroless plating
– Conductive Polymer Bumps
– Indium evaporation
The End
…
The SiTR-130_1 chip
180nm 130nm
Picture
Possible issues: noise:
130nm vs 180nm (simulation)
PMOS:
180nm
130nm
gm=944.4uS
1MHz  3.508nV/sqrt(Hz)
gm=815.245uS
1MHz  7.16nV/sqrt(Hz)
Thermal noise hand calculation = 3.42nV/sqrt(Hz)
Thermal noise hand calculation = 3.68nV/sqrt(Hz)
Measurements show 2 times better results
SiTR-130_1 tests results
Gain OK:
30 mV/MIP
Dynamics:
30 MIPs @ 5%
Peaking time: 0.8 – 2ms
OK
OK
0.7 - 3 ms
Power (Preamp+ Shaper) = 300 mW
Noise comparative
130nm @ 0.8 ms : 850 + 14e-/pF
130nm @ 2 ms :
625 + 9e-/pF
180nm @ 3 ms :
360 + 10.5 e-/pF
Some issues with 130nm design
Noise models pessimistic, Silicon actually much better !
Design rules more constraining
Some design kits are not fully developed and thus
additional effort needed
Power dissipation budget
(measured)
Preamp
Shaper
180nm/ch
90
180
130nm/ch
148
148
Common
Zero
suppr.
Pipeline
Total
Analog
ADC
Logic
Total
Digital
270
198
10
100
575
66
5
96
101
Final goal: ≤ 1 mWatt/channel all included (looks achievable)
Next developments
Implement the fast (20-50ns shaping) version in Silicon-Germanium
including:
- Preamp + Shaper (20-100ns)
- Fast sampling
Submit a full 128 channel version in 130nm CMOS including
slow and fast analog processing, power cycling, digital
Planned on-chip digital
Chip control
Buffer memory
Processing for
- Calibrations
- Amplitude and time least squares estimation, centroids
Tools
- Digital libraries in 130nm CMOS available (VST)
- Place & Route tools: Cadence + design kits
from Europractice (Leuven, Belgium)
- Synthesis from VHDL/Verilog
- Some IPs: PLLs, SRAM
Chip connection on µstrips
• Wire bonding
– Only periphery of chip available for IO
connections
– Mechanical bonding of one pin at a time
(sequential)
– Cooling from back of chip
– High inductance (~1nH)
– Mechanical breakage risk
• Flip-chip
– Whole chip area available for IO connections
– Automatic alignment
– One step process (parallel)
– Cooling via balls (front) and back if required
– Thermal matching between chip and substrate
required
– Low inductance (~0.1nH)
Next developments
Implement the fast (20-50ns shaping) version in Silicon-Germanium
including:
- Preamp + Shaper (20-100ns)
- Fast sampling
Submit a full 128 channel version in 130nm CMOS including
slow and fast analog processing, power cycling, digital
Planned on-chip digital
Chip control
Buffer memory
Processing for
- Calibrations
- Amplitude and time least squares estimation, centroids
Tools
- Digital libraries in 130nm CMOS available (VST)
- Place & Route tools: Cadence + design kits
from Europractice (Leuven, Belgium)
- Synthesis from VHDL/Verilog
- Some IPs: PLLs, SRAM
Chip connection on µstrips
• Wire bonding
– Only periphery of chip available for IO
connections
– Mechanical bonding of one pin at a time
(sequential)
– Cooling from back of chip
– High inductance (~1nH)
– Mechanical breakage risk
• Flip-chip
– Whole chip area available for IO connections
– Automatic alignment
– One step process (parallel)
– Cooling via balls (front) and back if required
– Thermal matching between chip and substrate
required
– Low inductance (~0.1nH)
1st step: bump bonding FE on detector
Studying flip-chip FEE chips on strips
IMB-CNM, VTT, HIP, LPNHE, Liverpool
(firms)
• Design of the fan-in fan-out on the µstrip sensor
1st case: 128 ch
2nd case: 1024 channel
The design is starting
have a foundry or a firm ready to implement it on the
sensor
• Bump bonding of the FEE chip
crucial issue here: have a working chip
with the required nb of channels
(by end 2007)
2nd step: cabling => use:
Tape Automated Bonding (TAB)
or????????
Don’t forget auxiliary electronics
that degrade any fancy solution on
paper
ex: decoupling capacitors
A few words about cabling and connection to
the overall DAQ system: preliminary thoughts
• A preparer…
Chip connection on µstrips
• Wire bonding
– Only periphery of chip available for IO
connections
– Mechanical bonding of one pin at a time
(sequential)
– Cooling from back of chip
– High inductance (~1nH)
– Mechanical breakage risk
• Flip-chip
– Whole chip area available for IO connections
– Automatic alignment
– One step process (parallel)
– Cooling via balls (front) and back if required
– Thermal matching between chip and substrate
required
– Low inductance (~0.1nH)
1st step: bump bonding FE on detector
Studying flip-chip FEE chips on strips
IMB-CNM, VTT, HIP, LPNHE, Liverpool
(firms)
• Design of the fan-in fan-out on the µstrip sensor
1st case: 128 ch
2nd case: 1024 channel
The design is starting
have a foundry or a firm ready to implement it on the
sensor
• Bump bonding of the FEE chip
crucial issue here: have a working chip
with the required nb of channels
(by end 2007)
2nd step: cabling => use:
Tape Automated Bonding (TAB)
or????????
Don’t forget auxiliary electronics
that degrade any fancy solution on
paper
ex: decoupling capacitors
Next developments
Implement the fast (20-50ns shaping) version in Silicon-Germanium
including:
- Preamp + Shaper (20-100ns)
- Fast sampling
Submit a full 128 channel version in 130nm CMOS including
slow and fast analog processing, power cycling, digital
Planned on-chip digital
Chip control
Buffer memory
Processing for
- Calibrations
- Amplitude and time least squares estimation, centroids
Tools
- Digital libraries in 130nm CMOS available (VST)
- Place & Route tools: Cadence + design kits
from Europractice (Leuven, Belgium)
- Synthesis from VHDL/Verilog
- Some IPs: PLLs, SRAM
Chip connection on µstrips
• Wire bonding
– Only periphery of chip available for IO
connections
– Mechanical bonding of one pin at a time
(sequential)
– Cooling from back of chip
– High inductance (~1nH)
– Mechanical breakage risk
• Flip-chip
– Whole chip area available for IO connections
– Automatic alignment
– One step process (parallel)
– Cooling via balls (front) and back if required
– Thermal matching between chip and substrate
required
– Low inductance (~0.1nH)
1st step: bump bonding FE on detector
Studying flip-chip FEE chips on strips
IMB-CNM, VTT, HIP, LPNHE, Liverpool
(firms)
• Design of the fan-in fan-out on the µstrip sensor
1st case: 128 ch
2nd case: 1024 channel
The design is starting
have a foundry or a firm ready to implement it on the
sensor
• Bump bonding of the FEE chip
crucial issue here: have a working chip
with the required nb of channels
(by end 2007)
2nd step: cabling => use:
Tape Automated Bonding (TAB)
or????????
Don’t forget auxiliary electronics
that degrade any fancy solution on
paper
ex: decoupling capacitors
backup
J-F Genat, LECC06,
Valencia, Sept 25-29th 2006
Beam-tests at DESY
October 2006
J-F Genat, LECC06,
Valencia, Sept 25-29th 2006
Wiring Detector to FE Chips
Wire bonding
Flip Chip Technology
Courtesy: Marty Breidenbach (Cal SiD)
OR (later)
J-F Genat, LECC06,
Valencia, Sept 25-29th 2006
Wiring Detector to FE Chips
Courtesy: Ray Yarema,
FEE 2006, Perugia
J-F Genat, LECC06,
Valencia, Sept 25-29th 2006
3D Wiring
Courtesy: Ray Yarema,
FEE 2006, Perugia
J-F Genat, LECC06,
Valencia, Sept 25-29th 2006
Manuel Lozano
(CNM Barcelona)
Chip connection
• Wire bonding
– Only periphery of chip available for IO
connections
– Mechanical bonding of one pin at a time
(sequential)
– Cooling from back of chip
– High inductance (~1nH)
– Mechanical breakage risk (i.e. CMS, CDF)
• Flip-chip
– Whole chip area available for IO connections
– Automatic alignment
– One step process (parallel)
– Cooling via balls (front) and back if required
– Thermal matching between chip and substrate
required
– Low inductance (~0.1nH)
J-F Genat, LECC06,
Valencia, Sept 25-29th 2006
Manuel Lozano
(CNM Barcelona)
Bump bonding flip chip technology
• Electrical connection of chip to
substrate or chip to chip face to face
flip chip
• Use of small metal bumps
bump bonding
CNM
• Process steps:
– Pad metal conditioning:
Under Bump Metallisation (UBM)
– Bump growing in one or two of the
elements
– Flip chip and alignment
– Reflow
– Optionally underfilling
J-F Genat, LECC06,
Valencia, Sept 25-29th 2006
Manuel Lozano
(CNM Barcelona)
Bump bonding flip chip technology
• Bumping technologies
– Evaporation through metallic
• Expensive technology
mask
– Especially for small quantities
– Evaporation with thick
(as in HEP)
photoresist
– Big overhead of NRE costs
– Screen printing
• Minimal pitch reported: 18 µm but ...
– Stud bumping (SBB)
• Few commercial companies for fine
– Electroplating
pitch applications (< 75 µm)
– Electroless plating
– Conductive Polymer Bumps
– Indium evaporation
J-F Genat, LECC06,
Valencia, Sept 25-29th 2006
Noise: 130nm vs 180nm
(simulation)
NMOS :
130nm
W/L = 50u/0.5u
Ids=48.0505u,Vgs=260mV,Vds=1.2V
gm=772.031uS,gms=245.341uS,gds=6.3575uS
180nm
W/L=50u/0.5u
Ids=47uA,Vgs=300mV,Vds=1.2V
gm=842.8uS,gms=141.2uS,gds=16.05uS
1MHz --> 24.65nV/sqrt(Hz)
1MHz --> 4nV/sqrt(Hz)
100MHz --> 5nV/sqrt(Hz)
Thermal noise hand calculation = 3.78nV/sqrt(Hz)
10MHz --> 3.49nV/sqrt(Hz)
Thermal noise hand calculation = 3.62nV/sqrt(Hz)
J-F Genat, LECC06,
Valencia, Sept 25-29th 2006
Noise: 130nm vs 180nm (UMC)
Models
1/f
NMOS
Thermal
130/180:
factor 6 worse
130/180:
factor 1.4 worse
130nm
W/L = 50/0.5 Ids=48 uA gm=770uS
180nm
W/L=50/0.5 Ids=47uA gm=840uS
1MHz --> 24 nV/sqrt(Hz)
1MHz --> 4 nV/sqrt(Hz)
100MHz -->
5nV/sqrt(Hz)
Calculation = 3.8nV/sqrt(Hz)
10MHz --> 3.5nV/sqrt(Hz)
Calcualtion= 3.6nV/sqrt(Hz)
Measurements give an overall factor of 1.5 between 130 and 180nm
at 800 ns and 3ms shaping time (look at 130nm at 2 ms)
J-F Genat
4th SiLC Workshop
Dec 18th – 20th 2006
Barcelone
Manuel Lozano
(CNM Barcelona)
Chip connection
• Wire bonding
– Only periphery of chip available for IO
connections
– Mechanical bonding of one pin at a time
(sequential)
– Cooling from back of chip
– High inductance (~1nH)
– Mechanical breakage risk (i.e. CMS, CDF)
• Flip-chip
– Whole chip area available for IO connections
– Automatic alignment
– One step process (parallel)
– Cooling via balls (front) and back if required
– Thermal matching between chip and substrate
required
– Low inductance (~0.1nH)
Manuel Lozano
(CNM Barcelona)
Bump bonding flip chip technology
• Electrical connection of chip to
substrate or chip to chip face to face
flip chip
• Use of small metal bumps
bump bonding
CNM
• Process steps:
– Pad metal conditioning:
Under Bump Metallisation (UBM)
– Bump growing in one or two of the
elements
– Flip chip and alignment
– Reflow
– Optionally underfilling
Manuel Lozano
(CNM Barcelona)
Bump bonding flip chip technology
• Bumping technologies
– Evaporation through metallic
• Expensive technology
mask
– Especially for small quantities
– Evaporation with thick
(as in HEP)
photoresist
– Big overhead of NRE costs
– Screen printing
• Minimal pitch reported: 18 µm but ...
– Stud bumping (SBB)
• Few commercial companies for fine
– Electroplating
pitch applications (< 75 µm)
– Electroless plating
– Conductive Polymer Bumps
– Indium evaporation
0.18 mm chip
PREAMPLIFIER
Reset FET
Gain: 8mV/MIP
3.3V input trans
2000/0.5
gm = 0.69 mS
40 mA (Weak inversion
IC ~= 0.01)
Tests results :
Gain
OK
Linearity : +/-1.5% +/-0.5% expected
Noise 3ms-20ms rise-fall,
40 mA : 498 + 16.5 e-/pF
OK
Dynamic range : 60 MIPs
OK
Jean-François Genat
3d SiLC Workshop, June 13-14th 2006, Liverpool
0.18 mm chip
SHAPER
RC-CR
Peaking time
ajustable :1ms -> 5ms
Tests:
1.5 - 6 ms rise/fall
Linearity: +/- 6% +/- 1% expected
Noise @ 3 ms 140mW power :
375 + 10.4 e-/pF 274 + 8.9 e-/pF
expected
Jean-François Genat
3d SiLC Workshop, June 13-14th 2006, Liverpool
Circuit en 0.13 mm
PREAMPLIFIER
Gain: 28.5mV/MIP
3.3V transistor d’entrée 1.5m/0.5mm
gm = 1.5 mS/ ~70 mA
Capacité de charge = 133 fF
Plage de dynamique : 17MIPs
(linearité = 1% a 17MIPs)
Bruit@70 mA = 1000e- + 25e-/pF
SHAPER
Filtre RC-CR
Temps adjusté :0.7ms -> 3ms
bruit@700ns = 335+22e-/pF
bruit@3ms = 305+16e-/pF
Plage de dynamique : 17MIPS
Jean-François Genat
3d SiLC Workshop, June 13-14th 2006, Liverpool
0.13 mm Chip Sparsifier
SPARSIFICATION
+ Sum of3 adjacent channels
+ Résolution ~ 0.1mV
+ Response time = 186ns
Sommateur
Offset
cancel
Ref
Jean-François Genat
Comparateur
3d SiLC Workshop, June 13-14th 2006, Liverpool
0.13 mm Chip Simulations
SIMULATIONS :
Preamps linearity
Shaper linearity
Sparsifier response
Jean-François Genat
3d SiLC Workshop, June 13-14th 2006, Liverpool
Possible issues: Transistors leaks
Two situations:
- Gate-channel due to tunnel effect (can affect noise performances)
- Through channel when transistor switched-off (only affects large digital
designs)
Sub-threshold current
Nano-CMOS Circuit and Physical design
B.P Wong, A. Mittal, Y. Cao, G. Starr,
2005, Wiley
130 nm
180 nm
Gate leakage
Jean-François Genat
90 nm
- 180nm chip OK
- 130nm, no gate
leakage expected, but
sub-threshold
- 90nm, important
gate leakage
Scale:
1 nA/mm = 8000 e- noise
in FE
3d SiLC Workshop, June 13-14th 2006, Liverpool
Possible issues: noise:
130nm vs 180nm (simulation)
PMOS:
130nm
W/L = 2mm/0.5u
Ids = 38.79u,Vgs=-190mV,Vds=-600mV
gm=815.245u,gms=354.118u
1MHz  7.16nV/sqrt(Hz)
Thermal noise hand calculation = 3.68nV/sqrt(Hz)
Jean-François Genat
180nm
gm=944.4uS,gms=203.1uS
1MHz  3.508nV/sqrt(Hz)
Thermal noise hand calculation = 3.42nV/sqrt(Hz)
3d SiLC Workshop, June 13-14th 2006, Liverpool
Noise: 130nm vs 180nm
(simulation)
NMOS :
130nm
W/L = 50u/0.5u
Ids=48.0505u,Vgs=260mV,Vds=1.2V
gm=772.031uS,gms=245.341uS,gds=6.3575uS
180nm
W/L=50u/0.5u
Ids=47uA,Vgs=300mV,Vds=1.2V
gm=842.8uS,gms=141.2uS,gds=16.05uS
1MHz --> 24.65nV/sqrt(Hz)
1MHz --> 4nV/sqrt(Hz)
100MHz --> 5nV/sqrt(Hz)
Thermal noise hand calculation = 3.78nV/sqrt(Hz)
10MHz --> 3.49nV/sqrt(Hz)
Thermal noise hand calculation = 3.62nV/sqrt(Hz)
Jean-François Genat
3d SiLC Workshop, June 13-14th 2006, Liverpool