Transcript IPC-7095

Standards and Specifications
The Seven Wonders of Design Innovation
INTRODUCTION TO IPC &
STANDARDIZATION
Minimum Standards Tool Kit
Design
2221 Generic
2222 Rigid
2223 Flex
2224 PCMCIA
2225 MCM-L
2226 HDI
2227 Discrete wiring
Materials
SM-840 Solder mask
FD-2231 Flex material
FD-2232 Coated material
MF-150 Copper foil
CF-148 Coated copper foil
CC-830 Conformal coating
SM-817 Adhesive
4101 Rigid materials
4104 HDI materials
Minimum Tool Kit
Performance
6011 Generic
6012 Rigid
6013 Flex
6014 PCMCIA
6015 MCM-L
6016 HDI
6017 Discrete wiring
Component Mounting
7071 Generic
7072 Through-hole
7073 Standard SMT
7074 Fine pitch
7075 Array product
7076 Chip scale
7077 Chip wire bonding
7078 Flip chip
Workmanship
A-600 Printed board
A-610 Printed board assembly
R-700 Modification and repair
Quality Assessment
TM-650 Test methods
SPC 9190
9191 Generic
9192 Base materials
9193Board
9194 Assembly
Attachment
J-STD-001 Soldering requirements
J-STD-002 Solderability testing of parts
J-STD-003 Solderability of boards
J-STD-004 Solder Flux
J-STD-005 Solder paste
J-STD-006 Solid solder
Membership Development
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PCB Manufacturers
382
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EMS Companies
374
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Suppliers
636
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OEMs
753
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Government/Others
Total
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IPC Designers Council
_198__
2,343 Companies
1,100 Individuals
Major IPC Program Areas
•
•
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•
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Management Programs
Industry Programs
Technical Programs
Education, Training & Certification
Market Research/Statistical
Programs
Public Policy Advocacy
Technical Programs
•
Standards & Specifications
•
Technical Committees
•
Activities with Other Organizations
•
International Activities
•
Current Major Initiatives
Technical Programs
Standards & Specifications
•
Standards, specifications and guidelines
developed for PCB design, manufacture and
assembly
•
ANSI-Accredited Standards Developing
Organization (SDO)
•
Industry technology roadmaps
•
Software Code Standards for Interoperability
Technical Programs
Technical Committees
• 21 General Committees
• 160 Subcommittees and Task Groups
 Consist of industry peers
 Started writing standards in 1959 (46 years
ago)
 Responsible for round robin test programs
 Managed by Technical Activities Executive
Committee (TAEC)
Technical Programs
Activities with Other Organizations
Membership and Active Participation
National Electronics Manufacturing Initiative
(NEMI) now iNEMI
American National Standards Institute (ANSI)
Underwriters Laboratories (UL)
Technical Programs
Activities with Other Organizations
Joint Standards Activity
 Japan Printed Circuit Association (JPCA)
 Wiring and Harness Manufacturers
Association (WHMA)
 Electronic Industries Alliance (EIA)
 Joint Electron Device Engineering Council
(JEDEC)
 Jisso International Council (JIC)
Technical Programs
International Activities
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Liaison “D” Status to IEC TC91
U.S. Technical Advisor (TA) IEC TC91 on
SMT
Chairmanship of IEC TC91 on SMT
Secretary, US TAG on IEC TC93 on EDA
US TAG of ISO Task group on Solder
materials
IPC standards internationally recognized
Technical Programs
Current Major Initiatives
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Optoelectronics
Lead-Free & Halogen Free issues
Embedded components
Wire Harness workmanship
Electronics enclosures
2004/2005 International Technology
Roadmap
• Material Declaration
• Enterprise Communication Standards
004/2005
2004/2005
2002 - 2003
2004-2005
IPC Membership Location
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A Global Membership
+
+
+
+
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78%
11%
9%
2%
North America
Europe
Asia
Rest of World
Members in 47 Countries
How Does the
Standards Process Work?
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Task groups develop drafts of new standards and
resolve comments at IPC meetings
Participants represent their company
Four stages to get comments from industry
 Project Submission - TAEC approves form
 Working Draft - gets project started
 Proposal -solicits comments from industry
 Interim Final - resolves comments for
balloting
Standard Development
Cycle
Industry Needs
Working Drafts
Project Approval
Proposal
Expert review
Final Ballot
Distribution
Terms and Definitions
Terminology is the key to good
communication
 IPC-T-50 initial release in 1965

 Next
revision is “H” scheduled for 2007
Use of the Treutler Classification Code
 Builds on the standardization process
 Contains over 2000 terms
 Has international recognition

 IEC
60194 – identical except spelling
Classification Code
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1-Administration
2-Engineering and Design for elect. pkg
3-Components for electronic packaging
4-Materials for electronic packaging
5-Interconnect board fabrication processes
6-Types/performance for Interconnections
7-Assembly processes
8-Types/performance for assemblies
9-Quality/reliability for boards/assembly
Second Digit Family 6 ID
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60-General terms
61-Rigid printed boards (organic)
62-Flexible printed boards (organic)
63-Flex-rigid printed boards (organic)
64-Discrete wiring boards (organic)
65-Inorganic printed boards (ceramic etc.)
66-Molded structures (three dimensional)
67-Hybrid/Multichip module structures
68-(Reserved for future expansion)
69-Other interconnecting structure terms
CC Description Examples
22. PRINTED BOARD AND PRINTED BOARD ASSEMBLY DESIGN
Contains terms related to printed board and printed board assembly.
Includes, but is not limited to computer aided design (CAD) equipment
and software algorithms, such items as design rule checks, direct
input from CAE work stations, gate assignment or gate swapping,
fixed grid snap-in, force field component manipulation, heat sensitivity
analysis, multi-directional conductor routing etc.
77. REWORK, REPAIR AND MODIFICATION
Contains terms related to the techniques, tools, materials and
equipment used to remove, replace, or add components to an
interconnecting structure, or to correct/change a circuit feature in the
structure itself, and terms related to restoring the assembly to its
proper function.
IPC-T-50 Published

Embedded Component
30.0436
A discrete or active component that is
fabricated as an integral part of a printed
board. (See Figure E-1.)
IPC-T-50 Published
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Discrete Component
30.0392
A separate part of a printed board assembly that
performs a circuit function, e.g., a resistor, a capacitor,
a transistor,etc.
Active Device
30.0016
An electronic component whose basic character
changes while operating on an applied signal. (This
includes diodes, transistors, thyristors, and integrated
circuits that are used for the rectification, amplification,
switching, etc., of analog or digital circuits in either
monolithic or hybrid form.)
Passive Component (Element)
30.1468
A discrete electronic device whose basic character
does not change while it processes an applied signal.
(This includes components such as resistors,
capacitors, and inductors.)
Terms and Definitions
Terminology
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Blank *
41.1339
An unprocessed or partially processed piece of base material or
metal- clad base material, that has been cut from a sheet or panel,
that has the rough dimensions of a printed board. (See also
‘‘Panel.’’)
Panel *
41.1463
A rectangular sheet of base material or metal-clad material of
predetermined size that is used for the processing of one or more
printed boards and, when required, one or more test coupons.
(See also ‘‘Blank.’’)
Fabrication Panel
A rectangular sheet of base material or metal-clad material of
predetermined size that is used by a printed board manufacturer
for the processing of one or more printed boards and, when
required, one or more test coupons. (See also ‘‘Blank.’’)
Board *
60.0118
see ‘‘Printed Board,‘‘ and ‘‘Multilayer Printed Board.’’
Printed Board (PB) *
60.1485
The general term for completely processed printed circuit and
printed wiring configurations. (This includes single-sided, doublesided and multilayer boards with rigid, flexible, and rigid-flex base
materials.)
Terminology
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Multilayer Printed Board *
60.1227
The general term for a printed board that consist of rigid or flexible
insulation materials and three or more alternate printed wiring and/or
printed circuit layers that have been bonded together and electrically
interconnected.
Finished Board
see “Printed Board”
Finished Panel
A rectangular sheet of base material or metal-clad material of
predetermined size that is used for the processing of one or more
printed board designs and, when required, one or more test coupons
which is extracted from the fabrication panel to deliver to the customer
or to the next level of fabrication. (see Assembly Pallet)
Assembly*
80.1327
A number of parts, subassemblies or combinations thereof joined
together. (Note: This term can be used in conjunction with other terms
listed herein, e.g., ‘‘Printed Board Assembly’’)
Printed Board Assembly*
80.0911
The generic term for an assembly that uses a printed board for
component mounting and interconnecting purposes.
Array*
22.0049
A group of elements or circuits arranged in rows and columns on a
base material.
Terminology
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Printed Board Assembly Array
A group of assemblies, all of the same design, arranged in rows and
columns on a panel.
Assembly Pallet
The generic term for the assembly that uses a finished panel, as
delivered from the board fabricator, of the same or different designs, for
element and circuit component mounting and attachment to the board
interconnections layers. The board arrangement on the pallet may be
random or in the form of an array; the pallet may also include coupons
for testing.
Hierarchy of IPC Design
Standards
(2220 Series)
IPC-2220
IPC-2221
GENERIC
IPC-2222
RIGID
IPC-2223
FLEX
IPC-2224
PCMCIA
IPC-2225
MCM-L
IPC-2226
HDI
Hierarchy of Printed Board
Performance Standards
(6010 Series)
IPC-6010
IPC-6011
GENERIC
IPC-6012
RIGID
IPC-6013
FLEX
IPC-6014
PCMCIA
IPC-6015
MCM-L
IPC-6016
HDI
Applicable IPC Standards
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-SM-782; Land Pattern Considerations
-7095; BGA Process Implementation
-2315; HDI & Microvia Design Guide
-SM-785; SMT Reliability Testing
-D-279; Design for SMT Reliability
J-STD-001; Soldering Requirements
-A-610; Assembly Acceptability
-6010; Printed Board Series
J-STD-004/005; Solder Flux/Paste
Scope Example
(land patterns)
This standard provides information on
land pattern geometries used for surface
attachment of electronic components.
 The intent of the information presented
is to provide the appropriate size, shape
and tolerance of surface mount land
patterns to insure sufficient area for the
appropriate solder fillet or solder volume.
 Also to allow for inspection, testing,
and rework of those solder joints.

Scope (continued)
Land pattern geometry may be different
based on the type of soldering used to
attach the electronic part, however land
patterns are defined in such a manner
that they are transparent to the process.
 Standard configurations are for manual
designs & for computer-aided design.
 Parts are mounted on one or both
sides, subjected to wave, reflow, or other
type of soldering
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Scope (continued)
Although patterns are dimensionally
defined and since they are a part of the
printed board circuitry geometry, they are
subject to the producibility levels and
tolerances associated with plating,
etching, assembly or other conditions.
 The producibility aspects also pertain to
the use of solder mask and the
registration required between the solder
mask and the conductor patterns.
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Performance Classes
Three performance classes have been
established to reflect progressive
increases in sophistication, functional
performance requirements and testing/
inspection frequency.
 There may be an overlap of equipment
categories in different classes.
 The user is responsible to specify, in
the contract or purchase order, the
product performance class.

Class 1 - General
Electronic Products
Includes consumer products, some
computer and computer peripherals
suitable for applications where
cosmetic imperfections are not
important and the major requirement
is function of the completed printed
board.
Class 2 - Dedicated Service
Electronic Products
Includes communications
equipment, sophisticated business
machines, instruments where high
performance and extended life is
required and for which uninterrupted
service is desired but not critical.
Certain cosmetic imperfections are
allowed.
Class 3 - High Reliability
Electronic Products
Includes the equipment and products
where continued performance or
performance on demand is critical.
Equipment downtime cannot be
tolerated and must function when
required such as in life support items or
flight control systems. Applications
where high levels of assurance are
required and service is essential.
Interpretation
“Shall,” the emphatic form of the verb, is
used throughout this specification whenever a
requirement is intended to express a
provision that is binding. Deviation from a
“shall” requirement may be considered if
sufficient data is supplied to justify the
exception.
The words “should” and “may” are used
whenever it is necessary to express nonmandatory provisions.
“Will” is used to express a declaration of
purpose. To assist the reader, the word “shall”
is presented in bold characters.
Complexity Levels

Land pattern determination methods:

Exact details based on component
specifications, board manufacturing and
component placement accuracy. The
land patterns are restricted to a specific
component, and have an identifying land
pattern number
 Equations
used for new components or
to alter the given information to achieve
a more robust solder connection, when
used in particular situations
Level A: Maximum
For low-density product applications,
the 'maximum' land pattern condition
have been developed to accommodate
wave or flow solder of leadless chip
devices and leaded gull- wing devices.
 The geometry furnished for these
devices, as well as inward and “J”-formed
lead contact device families, may provide
a wider process window for reflow solder
processes as well.
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Level B: Median
Products with a moderate level of
component density should consider
adapting the 'median' land patterns.
 The median land patterns furnished for
all device families will provide a robust
solder attachment condition for reflow
solder processes.
 The condition should suitable for wave
or reflow soldering of leadless chip and
leaded gull-wing type devices.
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Level C: Minimum
High component density typical of
portable and hand-held product
applications may consider the 'minimum'
land pattern geometry variation.
 Selection of the minimum land pattern
geometry may not be suitable for all
product use categories.

Combination of Issues
Performance classes 1, 2, and 3 are
combined with that of complexity and density
levels A, B, and C in defining electronic
assembly conditions.
 As an example, combining the description
as Levels 1A or 3B or 2C, would indicate the
different combinations of performance and
component density to understand fabrication
and assembly requirements for
manufacturing and end use environment.
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Test Requirements
Prior to starting a design, a
testability review meeting should be
held with fabrication, assembly, and
testing.
 Testability concerns, such as circuit
visibility, density, operation, circuit
controllability, partitioning, and special
test requirements and specifications
are discussed as a part of the test
strategy
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Test Requirements
During the design testability review
meeting, tooling concepts are
established, and determinations are
made as to the most effective tool cost
versus board layout concept conditions.
 During the layout process, any circuit
board changes that impact the test
program, or the test tooling, should be
reported to determine the best
compromise.
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Board Test Requirements
The testing concept should develop
approaches that can check the board for
problems, and also detect fault locations
wherever possible.
 The test concept and requirements
should economically facilitate the
detection, isolation, and correction of
faults of the design verification,
manufacturing, and field support of the
printed board assembly life cycle.

Assembly Testability
The printed board assembly testability
philosophy also needs to be compatible
with the overall integration, testing and
maintenance plans. This includes:

 The
factory testers to be used
 How integration and test is planned
 When conformal coated is applied
 Depot & field test equipment capability
 Personnel skill level
Need for Automation
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Standards needed for design and assembly
New concepts in Business process
optimization for competitiveness
A need for lower operating costs in business and
Information Transfer (IT).
 Tight business alignment with IT is essential
 Development of internal and external Service
Oriented Architecture is needed in order to
manage the new culture change.
 Shorten product development cycles
 Increase product flexibility

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Solutions require continuous monitoring of
industry progress & infrastructure growth
IPC to IEC Deployment
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IPC-SM-782 provided by US to IEC
Countries agree to standardize
Japan found that one land pattern is
insufficient to design Sony Minicam™
assemblies
Discussions review principles of
mathematical model – tighten requirements
Three geometries proposed for future
IEC starts work on IEC-61188-5-1 thru -8
IPC supersedes SM-782A with IPC-7351
Computer model tested with PCB Libraries
IPC-7351 Land Pattern Variations
Density Level A: Maximum (Most) Land Protrusion - for
low component density applications and products
exposed to high shock or vibration. The solder
pattern is the most robust and can be easily reworked
if necessary.
Density Level B: Median (Nominal) Land Protrusion - for
products with a moderate level of component density
and providing a more robust solder attachment.
Density Level C: Minimum (Least) Land Protrusion - for
miniature devices where the land pattern has the
least amount of solder pattern to achieve the highest
component packing density.
IPC-7351 Land Pattern Variations for
Rectangular Two Terminal Devices
Density Level A
Density Level B
Density Level C
Very Robust
Solder Joint
General Purpose
Solder Joint
Minimal Solder Joint
for
High Density Applications
IPC-7351 Land Pattern Variations for
Flat Ribbon ‘L’ and Gull Wing Leads
Density Level A
Density Level B
Density Level C
Very Robust
Solder Joint
General Purpose
Solder Joint
Minimal Solder Joint
for
High Density Applications
Ribbon Leads
greater than
0.625
Ribbon Leads
less than 0.625
J Leaded
Parts
Rectangular
Square end
Terminations
Metal
Electrical
Face
Bottom
Only
Terminations
Leadless
Chip Carriers
Inward L
shaped
Leads
Flat Lug
Leads
Quad Flat No
Lead
Small
Outline No
Lead
Design Considerations
Land pattern concepts
 Component selection
 Mounting substrate design
 Assembly methods
 Method of test
 Phototool generation
 Meeting solder joint requirements
 Stencil fixture requirements
 Providing access for inspection
 Access for rework and repair
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Manufacturing Allowance
Manufacturing allowance must be
considered in the design process
 The courtyard represents the starting point
of the minimum area needed for the
component and the land pattern
 Manufacturing, assembly and testing
representatives should assist in determining
the additional room needed to accommodate
placement, testing, modification and repair
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IPC-7351 Land Pattern
Courtyard Determination
Component / pattern
(maximum boundary)
Courtyard
excess
Courtyard
(minimum area)
Manufacturing
allowance
Courtyard
manufacturing
zone
IPC-7351 Land Pattern Naming
Convention
The numbering convention used in IPC-SM782A was very basic

Fixed number range assigned to a specific
component family (prone to exhaustion)
 No intelligence embedded within them
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A new land pattern naming convention was
designed for IPC-7351 to convey a number of
attributes:
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Component family prefix
Component pin pitch
Component body dimensions
Component Pin Quantity
Land Pattern Geometry
IPC-7351 Land Pattern Naming
Convention Example
Using
an 0.80 mm pitch Quad Flat Package (QFP),
the IPC-7351 Land Pattern Naming Convention is as
follows:
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QFP80P+Lead Span L1 Nominal X Lead Span L2 Nominal
– Pin Qty
where the + (plus sign) stands for “in addition to” (no space
between the prefix and the body size),
the X (capital letter X) is used instead of the word “by” to
separate two numbers such as height X width,
the – (dash) is used to separate the pin quantity,
and the suffix letters “L”, “M” and “N” signify when the land
protrusion is at their minimum (least), maximum (most) or
median (nominal) geometry variation.
IPC-7351 Land Pattern Naming
Convention Example (cont’d)
QFP80P+1720 X 2320-80N
Therefore, the above land pattern name conveys the
following information:
The
component family prefix of QFP
The component pin pitch of 0.80 mm
The component lead span nominal X = 17.20 mm for
“1720”
The component lead span nominal Y = 23.20 mm for
“2320”
The total component pin quantity of 80 pins
Density Level B (Nominal) land pattern geometry
IPC-7351 Zero Component
Rotations

IPC-7351 provides zero component rotations
that are defined in terms of the standard CAD
component library with respect to a given PCB
design
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
Acknowledges that a single land pattern may be
used for the same component part from different
suppliers, all of whom may provide different
orientations for tape or reel
Eliminates scenarios where a PCB designer
loses the ability to reference a single land pattern
when the zero component rotation is according to
the method the component is delivered to the
assembly machine
IPC-7351 Zero Component
Rotations
IPC-7351 Land Pattern Software
Suite
Part Selection
Nominal Library Search
Component Descriptions
Land Patterns
Land Patterns and Courtyards
Density
Level B
Density
Level A
Density
Level C
Land Patterns and Courtyards
Density Level
A
Density
Level B
Density
Level C
IPC-7351 Land Pattern Viewer
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Shareware program included with IPC7351 standard and available at
www.ipc.org under “PCB Tools and
Caculators”
Portability – doesn’t require a Web
browser
Enhanced searching capabilities
1:1 relationship for components/graphics
Easily updated through free download of
.p library files and program revisions
Building on the Standards
IPC website and listservs will
provide feedback point for new land
pattern generation
 Developing CAD interfaces
 Incorporating the Concepts into
OffSpring (the child of GenCAM and
ODB++) IPC-2581 (IEC 61182-2)
 Beta testing to start end of 2005
 Many CAD CAM companies
committed

IPC-2581 Beta Testing
Data extraction from CAD
 CAM step and repeat plus process
tolerance inclusion
 Design file review (Pad Stacks)
versus layered data
 Assembly information tied to CAD
libraries
 Provide updated viewer to industry
 Provide Gerber to 2581 converter

Function Mode
Name
Full
Design
Fabrication
Assembly
Test
1
2
3
1
2
3
1
2
3
1
2
3
Hierarchical layer/stack instance files
Y
N
Y
N
N
N
N
N
N
N
N
N
N
Hierarchical conductor routing files
Y
N
Y
N
N
N
N
N
N
N
N
N
N
BOM (Components and Materials)
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
N
Y
Y
AVL (Components and Materials)
Y
N
Y
Y
N
Y
Y
Y
Y
Y
N
N
Y
Component Packages
Y
Y
Y
Y
N
N
Y
Y
Y
Y
N
Y
Y
Land Patterns
Y
N
Y
Y
N
N
Y
N
Y
Y
N
Y
Y
Device Descriptions
Y
Y
Y
Y
N
N
N
N
N
Y
N
N
Y
Component Descriptions
Y
Y
Y
Y
N
N
N
Y
Y
Y
N
Y
Y
Soldermask; Solder Paste Legend
Layers
Y
N
N
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Drilling and Routing Layers
Y
N
N
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Documentation Layers
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Net List
Y
Y
Y
Y
N
Y
Y
N
Y
Y
Y
N
Y
Outer Copper Layers
Y
N
N
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Inner Layers
Y
N
N
Y
Y
Y
Y
N
Y
Y
N
N
Y
Miscellaneous Image Layers
Y
N
Y
Y
N
Y
Y
N
Y
Y
N
Y
Y
DFX Analysis
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Logistic Header
Indicates file owner as well as Approved Vendors
History Record
Configuration Management Section
Bill of Materials
One to many BOMs including one for Board Material
Approve Vendor List
One master list referenced to BOM item & enterprise
The Heart and Stamina
The Information Vessels
Step
Description
Mandatory Requirements
CAD
Library
The step functions
define the details
of the electronic
assembly. This
includes the parts,
conductors, net list,
and DFX analysis.
The individual features
Home for
Land
Patterns
Detail Descriptions
LayerDesc includes:
BOARD BOARDPANEL
ASSEMBLY
ASSEMBLYARRAY
COUPON
DOCUMENTATION
TOOLING
MISCELLANEOUS
NIST Viewer
Gerber Conversion Evaluation
Original File
NIST Viewer
Next is conversion of Gerber Macros in “read me” file
IPC-25XX Certification
Develop concept for matrix
 Examine D-350 and GenCAM test
plans
 Keep it simple
 Build on self declaration principles
 Establish legal documents for details
 Ask NIST software engineering for help
with portal development
 Examine using 3rd party consultants

Conclusions
The standard is Alive and Well
 The cooperative efforts are winning
 New parts require continuous
monitoring
 The IPC/PCB Libraries
arrangement is a major benefit to
the design community
 The IPC list servers are a way to
keep in touch
