Transcript IEEE NSS-MIC 2011, Valencia, Spain

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IEEE NSS-MIC 2011, Valencia, Spain
Large Area Ultra-Thin Detector Ladders based on
CMOS Monolithic Pixel Sensors
Wojciech Dulinski
IPHC Strasbourg, France
on behalf of PLUME, SERVIETTE and CERNVIETTE Collaborations
Outline
 Short status of MAPS development at IPHC
 PLUME: the lightweight ladder based on standard flex PCB
 SERVIETTE and CERNVIETTE: ultra-thin chip
embedding in plastics project (two different process approach)
 Conclusions and prospects
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IEEE NSS-MIC 2011, Valencia, Spain
Monolithic Active Pixel Sensor: effective use of a thin
epitaxial layer (10 – 20 µm) for MIP tracking
R.T.
past
present
Industrial availability of high resistivity
substrate (epi) in a standard CMOS
process
Fast and more efficient charge collection
 radiation tolerant MAPS
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Present status of MAPS: just two examples of mature designs
Binary, sparsified readout sensor for EUDET beam telescope
> 2 cm2 active area, 0.7 Mpixel tracker
- Medium speed readout (100 µm integration 10 kFrame/s)
- Spatial resolution < 4 µm for a pitch of 18.4 µm
- Efficiency for MIP > 99.5 %
- Fake hit rate < 10-6
- Radiation hardness > 1013 n/cm2 (high resistivity epi substrate)
- Easy to use, “off-shell” product: used already in several application
Mimosa 26
Ultimate: 4 cm2 sensor for STAR Microvertex upgrade
- similar measured tracking performance as Mimosa26
- Radiation hardness >1014 n/cm2 with CMOS MAPS
attainable?
First indications: yes!
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One of the main feature of MAPS
Potentially extremely thin (~25 µm of
silicon in total, ~0.027 % X0), flexible (!)
and still fully efficient for MIP
tracking!
Problem: how to handle, interconnect and at the end built a low
mass ladder with such a thin device?
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First real scale exercise: new STAR Microvertex Detector
Data taking (1/4 of detector) expected in 2013, full detector installation in 2014
Estimated 0.37% X0/ladder. Can we do better?
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Three RD mini-collaborations initiated by IPHC ~2 years ago,
in order to develop new methods of ultra-thin ladders construction
PLUME, SERVIETTE and CERNVIETTE Collaborations
1IPHC/IN2P3
Strasbourg, France
5University of Bristol, UK
6DESY, Hamburg, Germany
7University of Oxford, UK
2IMEC, Leuven, Belgium
3CMST, University of Gent, Belgium
4IFK, Goethe University, Frankfurt/M, Germany
8CERN, Geneva
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IEEE NSS-MIC 2011, Valencia, Spain
PLUME concept: double-sided ladder (ILC compatible)
- 2x6 Mimosa26 sensors thinned down to 50 µm
- Standard double-side kapton PCB: Cu conductor (20 µm/layer)
- SiC foam (8%) for spacer between layers
- Estimated 0.6 % X0/two sensor layers
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PLUME prototype: assembling steps
bare low mass cable
module with 6 sensors
complete ladder
(2 modules)
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Heat dissipation: moderate air blow seems to solve a lot of
“hot spots” problems
Electrical parameters (threshold dispersion, fake hit rate) almost unchanged…
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Current status of PLUME prototype:
ready for beam tests next week!
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SERVIETTE project: use of UTCP by IMEC…
 Stands for :
ULTRA THIN FILM CHIP PACKAGING
 In short :
 Off-the-shelf die
 Thinned down to ± 20-30 µm
Polyimide 2
 Packaged between two polyimide foils
 Metallisation : fan-out
 Circuit contact through vias
Polyimide 1
 Result :
 Flexible package, no wire bonding
 Thin : 50-70 µm
 Embeddable in commercial
flexible PCB
- Partner restricted
PTW Oct. 2010 - HUMAN++
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UTCP flow: overview
• Chip
thinning
• Polyimide on
rigid carrier with
release layer (KCl)
• Dispense/spin
of BCB
•Placement (face up) of IC
60 mm
•Photo definable polyimide
spinning (20µm))
• Opening vias using lithography
• Cleaning of contact pads
• Metallization: TiW (50nm) + Cu(1µm)
• Electroplating : Cu (5µm)
• Lithography to pattern metal
• Encapsulation polyimide spinning
• Release from carrier
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First results: Mimosa18 mechanical grade sample
Submitted for fabrication more than
a year ago, very slow progress since, on stand-by
till thinned chip placement problems solved.
Aluminum conductor, multiple metal layers and
multiple chips still far ahead…
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CERNVIETTE: use of a “standard” flex PCB process for
chip embedding in plastic foils (Rui de Oliveira, Serge Ferry)
• Gluing between two kapton foils
• Opening vias using lithography
• Single module:
intermediate tests
• Metallization: Al (5-10 µm)
• Lithography to pattern metal
• Complete ladder assembling,
laser cut along sensor edges
• Gluing of another kapton foil for
deposition of second metal layer
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CERNVIETTE: stack formation
Copper
150 µm
Polyimide
Silicon
chip
Acrylic glue
Polyimide
Acrylic glue
Copper substrate 1.5mm
Thin layer of epoxy
glue 3 to 10 µm
acrylic glue 60 µm
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CERNVIETTE: processing steps
1-Gluing at 200 deg, 22kg/cm2 under vacuum
2-Photolithographic method and chemical etching by ethylene diamine to
create vias on top of bonding pads
3-Plasma etching of glue in vias
4-Aluminium coating by sputtering deposition in vacuum machine
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CERNVIETTE: processing steps
5-Photolithographic method and etching with phosphoric acid to pattern
aluminium layer (strip, pads).
Step 1 to 5 can be repeated to create more metal layers and interconnexions
6-Chemical Etching of copper substrate
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CERNVIETTE: solid state flexible sensor wrapped over
cylindrical shape (R=20 mm) and pretty well protected
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Major failure: too short plasma etching of glue layer,
no electrical contacts… But excellent metal adhesion
and thickness uniformity!
Second (corrected) iteration expected to be ready next week
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CERNVIETTE: details of 4 metal layer flex (~0.12% X0)
Impedance of readout lines (last metal, 100 µm width,
100 µm gap) as a function of kapton thickness: 100 Ω
for 60 µm thick kapton (last layer)
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IEEE NSS-MIC 2011, Valencia, Spain
Conclusions
-
Construction methods of ultra-light sensor ladders are progressing rapidly, embedding in
polymer seems to be a new interesting option
-
It is at present our preferred solution in order to take full profit from MAPS high precision
tracking performances AND to equip with a reasonable budget large area detectors
(replacement of silicon strips, tracking calorimeters…)
Outlook
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Double-sided PLUME module (0.6 % X0) fully operational, ready for beam tests starting next
month. The next version (Al instead of Cu conductor, less dense SiC foam  0.3 % X0) in
2012
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Second iteration of single Mimosa26 embedded in kapton (CERNVIETTE) next week, full
PLUME compatible ladder (six M26) planned for beginning of the next year
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CERNVIETTE process may by much less critical, if the last metal layer on the chip is used
for better (less dense) “bonding pads” distribution  7 metal CIS 0.18 µm process available!
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Start to think about stitching exercise: wafer scale, up to 10x10 cm2 monolithic sensor possible
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