Transcript Final Presentation

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D3 Engineering
Ruggedized Camera Module
P13571 Project Review
May 10, 2013
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D3 Engineering
Project Description
Design and develop a camera system that
can capture, package, and transmit image
data in a small form factor which may be
subjected to adverse conditions.
Mechanicals
Electrical
Computer
Jose Portugal
Stephen Brown
Stephen Goss
Cameron Staunch
Andy Anthony
Peter Hood
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Customer Needs
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Engineering Specifications
Spec. #
Importance
Source
S1
S2
S3
S4
3
3
2
2
CN1
CN2
CN2
CN17
S5
S16
2
Enclosure
The enclosure shall be a 1.2" x 1.2" x N package. Length of N is negotiable
The enclosure shall be water resistant. Connector and lens excluded.
The enclosure shall be impact resistant.
The enclosure shall be oil resistant.
The enclosure shall withstand temperatures relevant to the electronics.
S6
2
S17
S18
S7
3
3
CN8
CN18
CN9
S8
S9
S10
3
3
3
CN13
CN11
CN12
Camera needs to have front, back, and side-mount capabilities.
Connector
The connector shall be type that supports CoaXPress.
Lens
The system shall support an M12 lens.
The system shall support a C-mount lens.
The system shall support an M3F focus module.
Cable
The system shall use coaxial cable.
The cable shall be capable of reaching 3-6 meters in length.
The cable shall provide power to camera unit.
1
Implied
The cable should be flexible.
2
CN9
The cabling shall be ruggedized.
S13
2
CN15
Image Sensor
The system shall support the Omnivision OV14810 14MP image sensor.
S14
3
CN15
S15
3
CN13
S11
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Specification (metric)
CN19
S12
Interface Chipset
The interface shall support speeds of at least 2.1 Gbps.
The interface shall be capable of serializing 12-bit parallel data from image
sensor.
The system shall be capable of interfacing with MIPI-CSI2 data format of image
sensor.
Unit of
Measure
Marginal
Value
Inches
IP64
Drop Height 2 ft - 3 ft
UL Oil Res II
Co
-40 to 85
Ideal
Value
Comments/Status
1 in3
IP67
> 2ft
Beyond
range
max. temp inside 125 C
Yes/No
Yes/No
Yes/No
Yes/No
Yes/No
Yes/No
Meters
Volts
Bend Radius
2 to 5 IN
2 IN
(in)
Crush
Resistance 100 lbf/in >175 lbf/in
(lb/in)
Yes/No
bits/sec
Yes/No
Yes/No
2.1 Gbps
IP64
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Concept Summary
Mechanical
Engineers
• Heat Dissipation
• IP64 weatherproofing
• Ruggedized
Electrical
Engineers
• High-Speed Printed Circuit Board Design
• System Integration
• Physical Layer Implementation
Computer
Engineers
• FPGA Programming
• Frame Grabber
• CoaXPress Implementation
Power
•Power Management
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Electrical System Architecture
Image Sensor
•Image Data
Capture
Coax
•Data Transmitter
FPGA
•Transceiver Architecture
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Mechanical System Architecture
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Heat Dissipation
•Cold Finger
•Fins
•Aluminum Body
Ruggedized
•Anodized
•Gorilla® Glass
Water Tight Seal
•O-ring Seals
•Flat Gasket
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Software Architecture
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Synthetic Data Working
Pixel Capture
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Transmitter Working
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Future Stage 1 Implementation
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Electrical Design Summary
System Testing Results
• Voltage and Short Checks
• Short on FPGA-to-Power Board connector
• Power over CoaXPress
• JTAG functionality
• Flash programmable
• I2C communication with sensor
• I2C clock on input pin
• Transceiver signal integrity
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Mechanical Design Summary
Testing Results
Assembly
- Material Selection for high temperatures/oil temp.
- PCBs and Hardware assemble together without
interference.
- Thermal pads compress effectively reducing contact
resistance .
- Tolerance Analysis provided an effective connector
engagement.
Thermal
- Experimental Data was 20% lower than Simulated
- Factor of safety of 1.0
- Connecting to a stand of any type allows conduction
and only increases F.S.
Sealing
- Distributor provided CAD was not exact, o-rings
under compressed (Lens Holder)
- O-rings designed to 20 - 40% compression, difficult to
assembly
- Updated CAD provides up to 15% compression and
used measured dimensions from Lens Holder
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Software Design Summary
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Objective Project Evaluation
Successes
Remaining
 Assembly fits together
with no interference
 Properly sinks heat
 Imager works
 Programmed FPGA
 Transceiver works
 Image display
 Frame grabber
implementation
 Verification of transceiver
signal integrity
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Opportunities / Suggestions For Future Work
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Finish CoaXPress protocol
Design frame grabber system
Upgrade FPGA to Cyclone V GX
Auto-focus capability using M3F Focus Module
CNC current release of CAD with tighter tolerance
and modified O-ring grooves
• Different housing designs (UAV application)
• Incorporate video analytics
• Include image processing filter on FPGA
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D3 Engineering (sponsor)
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Acknowledgments
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Lightforce Technology
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Bill Jenkins
Bob Spurr
Arrow Electronics, Inc.
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Peter Hammond
Dr. Antonio Mondragon
Altera Corporation
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Scott Reardon
Jason Enslin
Jim McGarvey
Alex Sojda
Ben McGee
David Collins
Gary Fredericks
RIT Machine Shop Personnel