Transcript Hilsmier_Stuart_PresentationFinalx - Purdue e-Pubs

Polymer-based Thermoelectric Devices
THOT
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TCOLD
Stuart W. A. Hilsmier, Edward P. Tomlinson,
and Bryan W. Boudouris
School of Chemical Engineering
Purdue University
Thursday August 7, 2014
Need for Waste Energy Recovery
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Introduction (1 of 4)
Methods
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Results
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Conclusion (1)
Source: Lawrence Livermore National Laboratory (www.llnl.gov)
Fundamentals of Thermoelectric Materials
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𝜎𝑆 2
𝑧𝑇 =
𝑇
𝜅
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Material Figure of Merit (zT)
Parameters
Used to compare efficiency of Electrical Conductivity (σ): Measure of the ability for
electrons to move through the material
materials
Seebeck Coefficient (S): Measures the amount of
energy an electron carries across the material
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Introduction (2 of 4)
Methods
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Thermal Conductivity (κ): Measures how easily heat can
move through the material
Uses of Thermoelectric Devices
Reliable
Reduce Weight
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Introduction (3 of 4)
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Improve efficiency
Organic Molecules in Thermoelectric Device
Poly(2,2,6,6-tetramethyl-1-piperidinyloxy-4-yl methacrylate)
 PTMA
Testing films doped with 4-ethylbenzenesulfonic acid
 EBSA
• PTMA previously used in solid-state[3]
• Has well-documented conductivity[1-2]
• Question: What effects will doping PTMA with
EBSA have on its conductivity, Seebeck
coefficient, and thermoelectric power factor?
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Introduction (4 of 4)
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From Solution to Device
Prepare solution
• Mass compounds
• Add solvent
Apply solution
to substrate
• Stir until dissolved
Paint silver contacts on
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Introduction (4)
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Heat to evaporate solvent
Conductivity and Seebeck Testing
Current
ΔT
40˚C
Voltage
Voltage
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TCold
Results
Mass Percent EBSA vs Conductivity
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Conclusions and Future Work
• Conductivity increases with larger mass percent of EBSA
• Seebeck data necessary to determine power factor of devices
Percent EBSA vs Seebeck and Power Factor
(Example Data)
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References
1. Rostro, L.; Baradwaj, A. G.; Boudouris, B. W. ACS Appl. Mater. Interfaces 2013, 5,
9896–9901.
2. Rostro, L.; Wong, S. H.; Boudouris, B. W. Macromolecules 2014, 47, 3713–3719.
3. Yonekuta, Y.; Susuki, K.; Oyaizu, K.; Honda, K.; Nishide, H. J. Am. Chem. Soc.
2007, 129, 14128–14129.
Acknowledgements