Transcript HPA_6_Thungsten

Pure Tungsten
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As a high performance materials, Pure Tungsten
has high melting temperature, high density, low
vapor pressure, low thermal expansion
combined with good thermal conductivity,
sufficient electrical resistance, high modulus of
elasticity. Tungsten sheets and disk are available
with alkali washed or ground finish. Depending
on thickness, sizes are up to 450 x 1000
mm. Thickness are from 0.1 to 15 mm.
Applications:
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Furnace parts, Semiconductor Base
Plates, Components for Electron Tubes,
Emission Cathodes for Electron Beam
Evaporation, Cathodes and Anodes for Ion
Implantation, Tubes / Boats for Sintering of
Capacitors, Targets for X-ray Diagnostics,
Crucibles, Heating Elements, X-ray
Radiation Shielding, Sputtering Targets,
Electrodes.
Bar and rod stock are available with ground surfaces and
as sintered or swaged condition. Diameters range from 1
to 30 mm and up to 2000 mm long depending on size and
conditioning. Large ranges of custom crucibles and single
crystal ingots are offered.
Tungsten product specifications
As high performance
materials, Tungsten-Copper
and Molybdenum-Copper
are characterized by
high thermal conductivity,
low thermal expansion and
high wear resistance
combined with excellent
electrical conductivity.
Description of
Tungsten-Copper Alloys
These composites are made by infiltrating
porous tungsten or molybdenum with
molten copper in a vacuum. Thus
providing a direct copper path for heat or
electrical conductivity.
Tungsten-Copper for Electrical Application
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Alloys and Properties: High Voltage Arc
Contacts, Vacuum Contacts, Electrodes for
Resistant Welding and Spark Erosion, Leaders for
Steel Rolling, Dies for Casting, Balance Weights,
Rocket Parts.
Tungsten-Copper for Electric Application
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Tungsten-Copper high performance composites
for electrical applications are made from
carefully controlled porous tungsten that is
vacuum infiltrated with molten copper. This
provides a superior electrical contact material
that combines the refractory, long lasting wear
resistant properties of tungsten with the high
thermal and electrical conductivity of copper.
Heat Sink
Applications
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Heat Sinks and Spreaders, Microwave
Carriers, Hermetic Package Bases and Housings,
Ceramic Substrate Carriers, GaAs and Silicon Device
Mounts, Laser Diode Mounts.
Tungsten-Copper for Heat Sinks
MIM Processing
Why we comment and
present MIM Processing?
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MIM is a fast growing manufacturing method that bridges
the manufacturing gap that other metal working
technologies and shaping processes cannot be fulfilled
because of technology or cost. MIM can be a very cost
effective method for producing large quantities of
precision parts.
MIM Advantages
High Shape Complexity: MIM process can produce
more complex parts than either investment casting or
traditional press and sinter techniques.
Low Cost: Machining operations can be eliminated.
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Tight Tolerances: Dimensions of parts produced with
our feedstock can be held to +/- 0.001~0.002" per inch.
High Density: MIM parts produced with our feedstock
will have density levels between 97.5-99.5%. These l
levels typically exceed traditional press and sinter
techniques.
High Performance: The tensile strengths, elongations
and hardness are superior to traditional press and sinter
techniques, and comparable to investment casting or
machine components.
MIM Typical Tungsten Materials
Tungsten Product Applications
Nuclear and medical radiation shielding for
x-ray
 Shields for radiation therapy and industrial
applications
 Aircraft and helicopter rotor balance
weights
 Instrument balance weight
 Weights for sport equipment
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