Transcript JonDeTech Customer Presentation (power point)

Next generation infrared sensors
a versatile thermopile with the
smallest form factor available on
market
Company facts

Company was registered in 2008

Spin off from SenseAir AB (a gas sensor manufacturer in Sweden)

Develops and produces thermopile infrared sensors

Today 3 employees

Production facility Uppsala

Today more than 50 customers has evaluated our sensors.
Business model
JonDeTech AB
Management
LICENSED PARTNER,
production partner or
Joint Venture
Production Equipment.
Project management.
And support
Direct customer
or distributor.
Application Engineering.
PRODUCTION
Components.
Systems & foil.
R&D
Development - Core technology.
Production processes & equipment.
Joint Venture
JonDeTech &
Certified Equipment Subcontractors
JonDeTech mission
“Provide customers with sensors that observe what is
present and predict what is about to happen”.
JonDeTech will offer smart and low cost infrared sensors
for measuring heat, temperature and presence, for the
consumer- and industrial markets using our proprietary
technology.
We will mass produce these sensors.
Introduction
Key features of the JonDeTech thermopile*
*IR-sensor, heat flow- and T sensor

The sensor is extremely thin (<0.2 mm).

Robust and reliable (produced in a plastic foil material)

Surface mountable to most PCB carriers (e.g. flex-PCBs).

The thermopile is vertical configured (and can measure the true heat flux)

Can be glued to almost any geometrical (e.g. curved) surface

Position sensitive detectors and sensor arrays can easily be assembled on the
PCB board by the customer. The sensor can be mounted side-by-side.

Low cost for large volumes.

Large field of view possible

Custom made geometry and sensor area can be provided.
IR-sensor comparison
Benchmark of different IR-sensors
Property
JonDeTech’s
thermopile
Si-based
(metal container)
Si-based
(SMT container)
Thin (<1 mm)
Surface mountable
Mountable to flex-PCB
Low impedance (<10 kΩ)
Robust
Large Field of View (FOV)
Side-by-side array
Large area sensors
Heat flux mode
?
Technical specifications
Technical data JIRS sensors
The responsivity to irradiance are
3 Vmm2/W [JIRS3]
9 Vmm2/W [JIRS5]
The total thermopower are:
3 mV/K
[JIRS3]
40 mV/(cm2×K) [per cm2]
Specific detectivity is:
D* = 1.5×107 cm Hz /W [all]
Sensitivity
S40 = 12 µV/K
S100= 14 µV/K
[JIRS3]
(obj.temp. 40C/100C, amb. 25C)
Electrical resistance:
R <5 kΩ
[JIRS3]
R <15 kΩ
[JIRS5]
Application examples
Input devices




Wake up systems (proximity switch) for computers and mobile phone
applications.
Wake-up circuits (proximity switch) for general stand-by devices.
Input devices (general)
Touchless gesture devices?
Application examples
Preventive and predictive maintenance

Overheat control units for bearings,
transmission and gearboxes.

Overheat control units for motors.


Temperature control units for industrial
rollers.
Overheat protection for compressor units.
Application examples
Security and surveillance

Fire detection systems

Intrusion detection (safety bags, cold chain)

Proximity sensors for entrance detection

Presence detection systems (WSNs)

Wake-up circuits for electronic door locks

Gas alarm systems
Application examples
Residential control systems

Comfort sensors for HVAC technology
to monitor indoor climate.

Contactless light switch units

Indoor air quality control (CO2 gas
analysis units).
Possibilities
Array Possibilities
The sensor can be mounted
side-by-side on a PCB. The
spacing between the sensors
can be as small as 0.3 mm.
SMT asssembly
Surface mountable
The sensors can be surface mounted on rigid
PCBs (e.g. FR4) as well as flexible PCBs using
standard pick and place machines. Standard RoHS
compliant soldering techniques and capillary
underfill processes can be used. Underfill will
ensure good heat conduction to the PCB carrier
as well as mechanical robustness of the system.
Sensor principle
Measurement principle (thermopiles)
Right. A thermocouple (TC) is a circuit where
two different (thermoelectric) materials,
referred to as legs/leads, are joint together.
When a temperature difference is applied
between the solder junctions (joints), an
electrical voltage (signal) is produced.
T
U
(Volt)
Thermoelectric material A
Thermoelectric material B
T1
T2
Left. Thermopiles
consist of several
interconnected TC
forming an electrical
series of alternating
material. Thermally
however every TC is in
parallel.
The produced voltage U equals
U = N  (a-  b)  T
where N is the number of thermocouples,
a and b is the Seebeck coefficient of the
respective thermoelectric material and T
is the temperature difference.
Sensor principle
Cross section of JonDeTech thermopile
Sensor principle
JonDeTech’s vertical IR-sensor
IR-heat
P (W)
sensor*
absorber layer
T1 (K)
T
 signal
sensorlayer
thermal link
The incoming infrared (IR) energy heats
the absorption layer of the sensor
producing a small temperature
increase. This difference in
temperature across the sensor layer is
converted to an electrical signal.
This is in contrast to semiconductor
based photovoltaic detectors which
produce a direct signal from the
absorbed photons.
z
Thermal mass
T0 (K)
y
x
* In the JonDeTech sensor the
sensor thickness is just 0.2 mm
Traditional sensors
Traditional IR-sensors
Left. A traditional (horizontally
configured) thermopile on a
silicon membrane.
V
z
y
x
Traditional IR-sensors of today,
typically have to be protected in a
large size metal containers e.g. TO18
(~6x6 mm) or similar and attached to
an even bulkier PCB
In these kind of IR-sensors, the
hot and the cold junction are
placed beside each other in the
same horizontal plane. Hence
they cannot be used as true heat
flow sensors. In addition the thin
and fragile membrane requires a
protective encapsultation.
Size comparison
Size comparison
Right. JonDeTech sensors. Below,
conventional IR-sensor, left
surface mount package, to the
right leg mounted TO-can
package.
2-7 mm
2 mm
3-10 mm
5 mm
Nanowire technology
The JonDeTech thermopile
V
The response is directly
proportional to the surface
area of the detector
The green and blue pillars
in the images correspond
to the thermocouple
legs/leads of the
thermopile built from
“nanowire clusters”.
Hot junction (top side of foil)
Metal A
Metal B
T2
Metal A
Cold junction (bottom side of foil)
Fig. Cross-section of the thermopile
T1