Transcript Final Presentation

Hardware-in-the-Loop
Testbed
Team 186
Project Collaborators
• Team Members:
o Aaron Eaddy – EE
o Ken Gobin – EE/COMPE
o Douglas Pence – ENGR PHYS/EE
• Team Advisor/Sponsor:
o Sung Yeul Park – Assistant Professor
Outline
• Background
• Components:
o Microcontroller
o Interface circuit
o Sensor circuits
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Design Updates
Circuitry
Timeline
Budget
Background
• Hardware-in-the-Loop:
o A simulation technique that is used in the development and testing of
complex real-time embedded system designs.
o Benefits:
• Function tests are able to be done at an early stage of development.
• Laboratory tests are cheaper, more flexible and highly controllable.
• No potential major risk of physically damaging test failures.
• Tests are easy to reproduce and provide highly consistent results.
• Improve battery operation and monitoring
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State of Health
State of Charge
Remaining useful life
Voltage, current, and temperature
Components
Design Updates
Initial Design:
• TI ezDSP® F28335
o 6 data/address lines, 59 GPIO, ADC
o MATLAB® Simulink, Code Composer Studio®
Updated Design – Rev 1:
• dSPACE® RTI-1104
o ADC ports, PWM CP-18 connector, embedded microcontroller
o MATLAB® Simulink software for digital signal processing and ease-of-use display
o Removed CCS as an “extra” middle software process. Less complicated and more robust.
Updated Design – Rev 2:
o Changed from ‘8’-channel design to hybrid ‘4+2’-channel design
o Changed from 1 to 2 PCB design – isolate analog from digital and provide safety barrier
o Simplified GPIO requirements with PWM MUX select
o Added scaling, filtering and digital isolator
dSPACE® Microcontroller
dSPACE® RTI-1104
dSPACE® ControlDesk
dSPACE® Limitations
• Maximum 8 ADC channels
• Maximum of 10-Volt ADC processing signal limit
• Maximum of 5-Volt system hardware limit
• Main reason for switching from ‘8’-channel design to ‘4+2’channel design was related to these limitations, specifically
the 8 ADC channel hardware limitation.
Sensors and Circuits
• Voltage Sensor
• Current Sensor
o Internal Impedance of each Cell.
• Temperature Sensor
o Ambient
o Battery Surface
• Amplification
o Integration with ADC
• Scaling for Multiple Cells
• Requirements
o 30V
o 4 Cells
• Integration
Voltage Sensing Circuit
Current Sensor
Current Sensing Circuit
Temperature Sensing Circuit
Interface Circuit
Printed Circuit Board Design
Timeline
Research Item
Schematics
+ Part List
PCB Layout
Design
Parts Order
PCB Order
Board
Testing
Jan
Feb
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Mar
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Apr
Board
Assembly
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Hardware
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DSP
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Power Test
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Budget
• Total Budget
• Current Expenditure Estimate:
$1,000
o Temperature Sensors and Initial Parts - $156
o PCB Order - $198
o Additional Parts and Expandable Testing Components - $492
• Budget Surplus Estimate
$154
Questions