NA Micro Report Jan 2016

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Transcript NA Micro Report Jan 2016

North America Microlithography
Technical Committee Chapter
Liaison Report
Jan. 2016
Meeting Information
• Last meeting
– SEMICON West
– July 14, 2015
• San Francisco Marriott Marquis Hotel
• Next meeting
– SPIE Advanced Lithography Conference
– San Jose, CA
– Wednesday, February 24, 2016
• 6:00 PM to 8:00 PM
NA Microlithography Report - Jan 2016
Task Force and Leadership Changes
• Task Force Change
– Standards for Scatterometry Task Force was
disbanded.
• Leadership Changes
– Rick Silver (NIST) stepped down as TC Chapter
cochair.
– Bryan Barnes (NIST) was appointed as TC Chapter
cochair serving with Wes Erck (Wes Erck &
Associates).
NA Microlithography Report - Jan 2016
Leadership
• N.A. Microlithography TC Chapter Co-chairs
– Wes Erck / Wes Erck & Associates
– Bryan Barnes / NIST
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Microlithography TC Chapter Structure
NA Microlithography Report - Jan 2016
Ballot Review Summary
• None.
NA Microlithography Report - Jan 2016
New SNARFs
• Doc. 5906 - Line Item Revision to SEMI P39, OASISTM Open Artwork System Interchange Standard (To correct
nonconforming title)
• Doc. 5907 - Revision to SEMI P5-0704 Specification for
Pellicles
• Doc. 5908 - Reapproval for SEMI P40-1109 Specification
for Mounting Requirements for Extreme Ultraviolet
Lithography Masks
• Doc. 5909 - Reapproval for SEMI P48-1110 Specification
of Fiducial Marks for EUV Mask Blank
NA Microlithography Report - Jan 2016
Ballots issued for cycle 9-15
• Doc. 5907 - Revision to SEMI P5-0704 Specification
for Pellicles
• Doc. 5908 - Reapproval for SEMI P40-1109
Specification for Mounting Requirements for
Extreme Ultraviolet Lithography Masks
• Doc. 5909 - Reapproval for SEMI P48-1110
Specification of Fiducial Marks for EUV Mask Blank
NA Microlithography Report - Jan 2016
Ballots issued for cycle 1-16
• Doc. 5906 - Line Item Revision to SEMI P39,
OASIS® - Open Artwork System Interchange
Standard (To correct nonconforming title)
NA Microlithography Report - Jan 2016
SNARFs Discontinued
• Revision of SEMI P10-1112, Specification of Data Structures
for Photomask Orders (SNARF # 5561)
– No additional document development activity planned.
• Reapproval of SEMI P35-1106, Terminology for
Microlithography Metrology (SNARF # 5145)
– SEMI P35 was reapproved via the Japan Micropatterning TC
Chapter in spring 2013.
• Revision to SEMI P25-94 (Reapproved 1104), Specification
for Measuring Depth of Focus and Best Focus (SNARF #
5271)
– SEMI P25 has already been moved into Inactive status.
NA Microlithography Report - Jan 2016
Inactive Standard
• The NA Microlithography Technical Committee
Chapter agreed to allow P10 to go into Inactive
Status.
– SEMI P10 (Specification of Data Structures for
Photomask Orders)
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Standards will go into Inactive status
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• Feedback Requested on NA Microlithography
TC Chapter-Originated Standards to go into
Inactive Status.
• If no inputs are received, these Standards will
go into Inactive status.
• See next two slides for full list
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Standards will go into Inactive status.
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P1-0708E, Specification for Hard Surface Photomask Substrates
P2-0308, Specification for Chrome Thin Films for Hard Surface Photomasks
P3-0308, Specification for Photoresist/E-Beam Resist for Hard Surface Photoplates
P6-88 (Reapproved 0707), Specification for Registration Marks for Photomasks
P12-0997, Determination of Iron, Zinc, Calcium, Magnesium, Copper, Boron,
Aluminum, Chromium, Manganese, and Nickel in Positive Photoresists by
Inductively Coupled Plasma Emission Spectroscopy (ICP)
P13-91 (Reapproved 1104), Determination of Sodium and Potassium in Positive
Photoresists by Atomic Absorption Spectroscopy
P14-0997, Determination of Tin in Positive Photoresists by Graphite Furnace
Atomic Absorption Spectroscopy
P15-92 (Reapproved 1104), Determination of Sodium and Potassium in Positive
Photoresist Metal Ion Free (MIF) Developers by Atomic Absorption Spectroscopy
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Standards will go into Inactive status.
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P16-92 (Reapproved 1104), Determination of Tin in Positive Photoresist Metal Ion
Free (MIF) Developers by Graphite Furnace Atomic Absorption Spectroscopy
P17-92 (Reapproved 0299), Determination of Iron, Zinc, Calcium, Magnesium,
Copper, Boron, Aluminum, Chromium, Manganese, and Nickel in Positive
Photoresist Metal Ion Free (MIF) Developers by Inductively Coupled Plasma
Emission Spectroscopy (ICP)
P18-92 (Reapproved 1104), Specification for Overlay Capabilities of Wafer
Steppers
P19-92 (Reapproved 0707), Specification for Metrology Pattern Cells for
Integrated Circuit Manufacture
P24-94 (Reapproved 1104), CD Metrology Procedures
P28-96 (Reapproved 0707), Specification for Overlay-Metrology Test Patterns for
Integrated-Circuit Manufacture
P34-0200 (Reapproved 0707), Specification for 230 mm Square Photomask
Substrates
P45-0211, Specification for Job Deck Data Format for Mask Tools
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Data Path TF
• Open Artwork Systems Interchange Standard
(OASIS®) is widely used in the semiconductor
industry
• No plan to materially change SEMI P39
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Extreme Ultraviolet (EUV) TF
• Doc. 5907, Revision to SEMI P5-0704, Specification for
Pellicles
– The proposed change is to bring the standard up to date
to include EUV pellicles. Paragraphs which will require
changes are
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2 Scope
4.1.2.2 Exposure Wavelength,
4.1.2.3 Optical Transmission,
4.1.2.4 Thickness
4.1.2.5 Mechanical Strength
5.2 Frame Adhesive
5.4 Light resistance
– Ballot will be reviewed at the next meeting
NA Microlithography Report - Jan 2016
Mask Orders (P10) TF
• Plans to add a new syntax to support both
“pre-order” and Foundry order mask making
instructions though no progress has been
made.
• No other activity is foreseen on P10 unless
something comes up.
NA Microlithography Report - Jan 2016
Terminology TF
• No activity.
• Will determine whether to disband the task
force at the next meeting.
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Extreme Ultraviolet (EUV) Fiducial
Mark TF
• No update
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Thank You!
For more information or to participate
in any N.A. Microlithography activities,
please contact Kevin Nguyen at SEMI
([email protected])
NA Microlithography Report - Jan 2016