W A T K I N S - J O H N S O N C O M P A N Y Semiconductor
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Transcript W A T K I N S - J O H N S O N C O M P A N Y Semiconductor
Engineering 45
Electrical
Properties-2
Bruce Mayer, PE
Licensed Electrical & Mechanical Engineer
[email protected]
Engineering-45: Materials of Engineering
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Bruce Mayer, PE
[email protected] • ENGR-45_Lec-09_ElectProp-Semi.ppt
Learning Goals – Electrical Props
How Are Electrical Conductance And
Resistance Characterized
What Are The Physical Phenomena That
Distinguish Conductors, Semiconductors,
and Insulators?
For Metals, How Is Conductivity Affected By
Imperfections, Temp, And Deformation?
For Semiconductors, How is Conductivity
Affected By Impurities (Doping) And Temp?
Engineering-45: Materials of Engineering
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Bruce Mayer, PE
[email protected] • ENGR-45_Lec-09_ElectProp-Semi.ppt
SemiConductivity
Materials of Valence
4 (Grp IVA in the
Periodic Table)
Exhibit the property
of Semiconductivity
• Si, Ge in Particular
• C, Sn to a
Lesser Extent
Also Observed in
Compounds
Engineering-45: Materials of Engineering
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• III-V → GaAs
• II-VI → InP
Semiconductivity
Characterized by
• Insulative Behavior at
Room Temperature
– 106-1012 times LESS
conductive than metals
• INCREASING
Conductivity with
Increasing Temp
– Opposite of
Metal Behavior
Bruce Mayer, PE
[email protected] • ENGR-45_Lec-09_ElectProp-Semi.ppt
Carriers in Semiconductors
Conduction band (at T = 0 K
unpopulated with electrons)
Energy gap, Eg
Valence band (at T = 0 K
totally filled with electrons)
At non-zero temperatures, electrons are
thermally excited from the valence band to the
conduction band.
The activated “free electrons” and the remaining
“holes” left behind act as two ideal gases!!
Certain types of impurities that are grown or
implanted into the semiconductor crystal produce
extra free electrons or holes.
Engineering-45: Materials of Engineering
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Bruce Mayer, PE
[email protected] • ENGR-45_Lec-09_ElectProp-Semi.ppt
Intrinsic (Pure) Semiconductors
Why This Temp
Behavior?
Data for
Pure Silicon
• Note ↑ as T↑
Si electrical conductivity,
(S/m)
10 4
10 3
pure
(undoped)
10 -2
50 100
Engineering-45: Materials of Engineering
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– Thermal Energy
Can Allow the eto jump the
“Forbidden” Gap
between the
“Valence” Band
and the
“Conduction”
Band
10 2
10 1
10 0
10 -1
• Semiconductor eBand Structure
1000
T(K)
Bruce Mayer, PE
[email protected] • ENGR-45_Lec-09_ElectProp-Semi.ppt
Intrinsic (Pure) Carrier Concen
Note the Exponential
Recall Conductivity
Increase in the
Eqn from the Metals
Intrinsic carrier
Dicussion nq
Concentration, ni or
ni e
E g kT
Since µ Does Not
change nearly as
much as ni with T
e
Engineering-45: Materials of Engineering
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E g kT
Bruce Mayer, PE
[email protected] • ENGR-45_Lec-09_ElectProp-Semi.ppt
InSb
0.17 eV
Ge
0.67 eV
InN
0.7 eV
HgCdTe
0.0 - 1.5 eV
InGaAs
0.4 - 1.4 eV
Silicon
1.14 eV
InP
1.34 eV
GaAs
1.42 eV
CdTe
1.56 eV
AlGaAs
1.42 – 2.16 eV
InGaP2
1.8 eV
GaAsP
1.42-2.26eV
InGaN
0.7 - 3.4 eV
AlAs
2.16 eV
GaP
2.26 eV
AlGaInP
1.91 - 2.52 eV
ZnSe
2.7 eV
SiC 6H
3.03 eV
SiC 4H
3.28 eV
GaN
3.37 eV
Diamond
5.46 - 6.4 eV
Engineering-45: Materials of Engineering
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Some BandGaps
Bruce Mayer, PE
[email protected] • ENGR-45_Lec-09_ElectProp-Semi.ppt
Conduction by e- & h+ Migration
Concept of Electrons (e-) & Holes (h+)
• When e- moves to the Conduction Band it leaves Its Parent
Atom Core, and Moves Freely
• This Leaves behind an electron “HOLE” Which Results in a
POSITIVELY Charged Atom/Ion Core
• This Positive Charge can Attract an e- from an ADJACENT
Atom, Thus the hole, h+, can move Left↔Right or Up↔Down
– This Transfers the POSITIVE Charge-Center to the
Adjacent Atom-Core
– From an electrical current perspective, the Step-by-Step
movement of the hole appears as the movement of a
POSITIVELY Charged Particle; some Analogies
A bubble in a Liquid moves to the high side of a sealed tube
One open Spot in A parking Lots Moves Further from the Bldg
as the cars move into the Close spot in Step-By-Step Fashion
Engineering-45: Materials of Engineering
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Bruce Mayer, PE
[email protected] • ENGR-45_Lec-09_ElectProp-Semi.ppt
e- & h+ Electrical Conduction
Schematically
valence
electron
Si atom
electron hole
pair creation
no applied
electric field
electron hole
pair migration
+ applied
electric field
- +
+
applied
electric field
- +
In Metals, only e- Participate in Electrical
Conduction (e- “sea”), But in Semiconductors
HOLES also aid conduction
Engineering-45: Materials of Engineering
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Bruce Mayer, PE
[email protected] • ENGR-45_Lec-09_ElectProp-Semi.ppt
SemiConductor Conductivity
– µe electron mobility,
m2/V-s
– µh hole mobility,
m2/V-s
With the
Participation of
Electrons and Holes
semi nqe pqh
• Where
– q electronic charge,
1.6x10-19 Coulomb
per e- or h+
– n electron
concentration, e-/m3
– p hole
concentration, h+/m3
Engineering-45: Materials of Engineering
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Qty
Si
GaAs
CdTe
InP
µe
(m2/V-s)
0.19
0.88
0.105
0.470
µh
(m2/V-s)
0.05
0.04
0.008
0.018
µe (4-30) times
Greater Than µh
• Why?
– Parking Garage
Analogy
Bruce Mayer, PE
[email protected] • ENGR-45_Lec-09_ElectProp-Semi.ppt
h+ & eParking Garage
Analogy
n-Type
Semiconductor
illustrated in (a) & (c)
p-Type
Semiconductor
illustrated in (b) & (d)
Thus µe >µh
Engineering-45: Materials of Engineering
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Bruce Mayer, PE
[email protected] • ENGR-45_Lec-09_ElectProp-Semi.ppt
Intrinsic vs. Extrinsic Conduction
INtrinsic SemiConductors → n = p
• Case for “pure” Semiconductors; e.g., Si
EXtrinsic SemiConductors → n p
• occurs when impurities are added with a different
no. of valence e-’s than the host (e.g., Si atoms)
N-type EXtrinsic: (n>>p)
P-type EXtrinsic: (p>>n)
Phosphorus atom
nqe
4+ 4+ 4+ 4+
4+ 5+ 4+ 4+
4+ 4+ 4+ 4+
no applied
electric field
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Boron atom
hole
conduction
electron
4+ 4+ 4+ 4+
valence
electron
4+ 4+ 4+ 4+
Si atom
4+ 3+ 4+ 4+
pqh
no applied
electric field
Bruce Mayer, PE
[email protected] • ENGR-45_Lec-09_ElectProp-Semi.ppt
Doped SemiConductors - vs T
10 4
10 3
(S/m)
electrical conductivity,
increases w/ Doping
10 2
10 1
10 0
10-1
0.0052at%B
nd = 1021/m3
doped
0.0013at%B
pure
(undoped)
10-2
50 100
1000
T(K)
Reason: imperfection
sites lower the activation
energy needed to
produce mobile e- or h+
Engineering-45: Materials of Engineering
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N-Type Si, n vs T
– FreezeOut → Not Sufficient
Thermal Energy to ionize
Dopant or Si
– Extrinsic → n = doping
– Instrinsic → ni > doping
Bruce Mayer, PE
[email protected] • ENGR-45_Lec-09_ElectProp-Semi.ppt
FreezeOut etc.
nd = 1015/cc
Recall Reln for ni
ni e
E g kT
Si Dopant Ionization (eV)
The similar Reln for
(N-Type) dopant
Concentrations
nd e
E d kT
Impurity
Donor
Ed
P
0.044
As
0.049
Sb
0.039
Acceptor
Ed
Neither Si or Dopants are Ionized
– Extrinsic → Ed < kT < Eg
Only Dopants are (Singly)
ionized and nd >> ni
B
0.045
Al
0.057
EgapMaterials 1.1
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of Engineering
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– FreezeOut → kT << [Eg or Ed]
1.1
– Intrinsic kT>> [Ed or Eg]
nd fixed at dopant at%,
ni continues to Rise
Bruce Mayer, PE
[email protected] • ENGR-45_Lec-09_ElectProp-Semi.ppt
p-n Junction Physics
P and N Type Semi
Matls Brought
Together to form a
METALLURICAL
(seamless) Junction
The HUGE
MisMatch in Carrier
Concentrations
Results in e- & h+
DIFFUSION
Carrier Diffusion
• e- Diffuse in to the
P-Type Material
• h+ Diffuse in to the
N-Type Material
• Remember that?
Engineering-45: Materials of Engineering
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Bruce Mayer, PE
[email protected] • ENGR-45_Lec-09_ElectProp-Semi.ppt
p-n Junction Physics cont.
In a p-n Jcn Carrier
Cross-Diffusion is
SELF-LIMITING
• The e-/h+ Diffusion
leaves Behind
IONIZED Atom
Cores of the
OPPOSITE Charge
• The Ion Cores set up
an ELECTRIC FIELD
that COUNTERS the
Diffusion Gradient
Engineering-45: Materials of Engineering
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E-Field
For Si the Field-Filled
Depletion Region
• E-Field 1 MV/m
• Depl Reg Width,
xd = 1-10 µm
• E-fld•dx 0.6-0.7 V
– “built-in” Potential
Bruce Mayer, PE
[email protected] • ENGR-45_Lec-09_ElectProp-Semi.ppt
p-n Junction Rectifier
A Rectifier is a
“Check Valve” for
Current flow
E-Field
• Current Allowed in
ONE Direction but
NOT the other
Side Issue →
“Bias” Voltage
• A “Bias” Voltage is
just Another name
for EXTERNALLY
APPLIED Voltage
Engineering-45: Materials of Engineering
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Bruce Mayer, PE
[email protected] • ENGR-45_Lec-09_ElectProp-Semi.ppt
p-n Junction Rectifier cont
p-n junction
Rectification
• A small “Forward
Bias” Voltage results
in Large currents
• Any level of
“Reverse” Bias
results in almost NO
current flow
Class Q:
• For Fwd Bias, Which
End is +; P or N???
Engineering-45: Materials of Engineering
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E-Field
A: the P end
• The Applied Voltage
REDUCES the
internal E-Field; This
“Biases” The Junction
in Favor of
DIFFUSION
Bruce Mayer, PE
[email protected] • ENGR-45_Lec-09_ElectProp-Semi.ppt
p-n Junction Rectifier cont.2
p-n junction
No Applied Voltage
Xd
• Diffusion & E-Field in
Balance, No Current
Flows
Reverse Biased
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• Internal Field
ENHANCED
– Carriers Pulled AWAY
from Jcn; xd grows
Forward Bias
• Internal Field
REDUCED
– Carriers PUSHED and
Diffuse to the Jcn
where they are
“injected” into the other
side; xd Contracts
Bruce Mayer, PE
[email protected] • ENGR-45_Lec-09_ElectProp-Semi.ppt
Properties of Rectifying Junction
Reverse
Forward
IN914 PN Diode
• IF = 75 000 µA
• IR = 0.025-50 µA
Engineering-45: Materials of Engineering
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Bruce Mayer, PE
[email protected] • ENGR-45_Lec-09_ElectProp-Semi.ppt
Transistors
Transistors are
“Transfer Resistors”
Xsistors Have Three
Connections
• Input
• Output
• Control
In Electronic
Applications
Transistors have
TWO Basic Fcns
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• Amplification – Both
Current & Voltage
• On/Off Switching
Two Main Types
• BiPolar Junction
Transistor (BJT)
– Good Amps
• Field Effect Transistor
(FET)
– Depletion Mode
Good Amps
– Enhancement Mode
Good Switches
Bruce Mayer, PE
[email protected] • ENGR-45_Lec-09_ElectProp-Semi.ppt
BJT
The Classic pnp or
npn configurations
• Basically Two pn
jcns back-to-Back
c
b
e
c
b
e
Engineering-45: Materials of Engineering
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npn In “ForwardActive” mode
• b-e pn jcn
FORWARD Biased
• b-c pn jcn
REVERSE Biased
Very Little “base”
Current
Large emitter &
collector currents
• Good Current-Driving
Amplifier
Bruce Mayer, PE
[email protected] • ENGR-45_Lec-09_ElectProp-Semi.ppt
Depletion Mode - JFET
JFETs are “Normally
On” Transistors
OPEN “Channel”
Between the
“source” and “drain”
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Reverse Bias on the
“gate” expands the
NonConducting
depletion region Until
the channel is
“Pinched Off” and no
longer conducts
• Gate is Reverse
Biased → little
Control-Current
• Good Depl Region
modulation →
good I/V amp
Bruce Mayer, PE
[email protected] • ENGR-45_Lec-09_ElectProp-Semi.ppt
Enhancement Mode - IGFET
Insulated Gate Field
Effect Transistors
are Normally-Off
devices
Applying a Positive
Voltage to the Gate
will attract e- to the
Channel
Back-to-Back pn
Jcns Between
“source” & “drain”
IGFETs are Great
Switches
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• This will eventually
“invert” a thin region
below the gate to
N-type, creating a
conducting channel
between S & D
• Used in almost all
digital IC’s
Bruce Mayer, PE
[email protected] • ENGR-45_Lec-09_ElectProp-Semi.ppt
Ionic Materials
In Metals and
Semiconductors, the
atomic Ion-cores are
fixed in the crystal
Lattice
• Although they have
the same charge as
a “hole” they have
almost NO “Mobility”
– Thus They do NOT
contribute to Electrical
Conduction
Engineering-45: Materials of Engineering
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Some Small Atomic
Radii impurities can
be CHARGED (ionic)
and MOBILE within
another material
• e.g., Na+ can move
fairly easily thru
GLASS (SiO2)
The Total σ for
Ionic Materials
tot eletronic ionic
Bruce Mayer, PE
[email protected] • ENGR-45_Lec-09_ElectProp-Semi.ppt
Ionic Mobility
As in the Electronic
case
ionic N I q I
• Where
– NI Ion Concen,
Ions/m3
– q electronic Charge
– µI Ionic Mobility,
m2/V-s
Two Forces move
The Ions
Engineering-45: Materials of Engineering
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• Diffusion
• E-Field
Combine These two
effects into Mobility
nI qDI
I
kT
• Where
– nI Ion Valence
– DI Ion Mass
Diffusion Coeff, m2/s
– q, k, T as Before
• Exercise → Find
units for nBruce
I Mayer, PE
[email protected] • ENGR-45_Lec-09_ElectProp-Semi.ppt
Energy
Most Ceramics have
WIDE BandGaps
Conductio
n
Band
• SiO2 9 eV
• Si3N4 4.7eV
Thus Ceramics Tend to be Very
Good Electrical INSULATORS
GAP
filled states
Ceramics
empty
band
But as with SemiConductors. for Ceramics
nintrinsic Increases with Temperature
• Thus Insulative Capacity DEGRADES at Hi-T
– e.g; mullite = 3Al2O3•2SiO2
(25°C) 1012 Ω-m; (500°C) 106 Ω-m
Engineering-45: Materials of Engineering
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Bruce Mayer, PE
[email protected] • ENGR-45_Lec-09_ElectProp-Semi.ppt
filled
Valence
band
filled
band
Most “Standard” Plastics are Good Insulators
• c.f. Their use as insulation on metal WIRES
• Conduction Mechanism Not well understood
– Believed to be More Electronic than Ionic
A Few Polymers are Good Conductors,
with σ 107 S/m
• About 2X HIGHER than Cu for Conductivity/lb
• Mechanism appears to be SemiConductor-like
with a doping Requirement
• Discovery of these “synthetic metals” Resulted in
the 2000 Chem Nobel for Heeger, MacDiarmid
and Shirakawa
Engineering-45: Materials of Engineering
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Bruce Mayer, PE
[email protected] • ENGR-45_Lec-09_ElectProp-Semi.ppt
http://webpages.charter.net/dmarin/coat/#history
Polymers
Piezoelectric Materials
Piezoelectricity – application of pressure
produces Electrical Potential
at rest
compression
induces voltage
Engineering-45: Materials of Engineering
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applied voltage
induces
expansion
Bruce Mayer, PE
[email protected] • ENGR-45_Lec-09_ElectProp-Semi.ppt
WhiteBoard Work
Problem 18.30
• Arsenic Doped
Germanium
Engineering-45: Materials of Engineering
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Bruce Mayer, PE
[email protected] • ENGR-45_Lec-09_ElectProp-Semi.ppt