Atomistic Mechanisms of rf Breakdown in high
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Transcript Atomistic Mechanisms of rf Breakdown in high
Atomistic Mechanisms
of rf Breakdown in highgradient linacs
Z. Insepov, J. Norem,
Argonne National Laboratory
S. Veitzer
Tech-X Inc
Muon Cooling RF Workshop, 7-8 July, 2009
Outlook
Unipolar Arc plasma models in various systems
Plasma-surface interactions
Plasma model development by MD
Self-sputtering of copper surface
Taylor cone formation
Coulomb explosion
Summary
2
Unipolar Arc model in tokamaks
Heating occurs via ion bombardment.
Plasma fueling:
Evaporation of surface atoms
Tip explosion by high electric field
Tokamak Plasma
n ~ 1022 m-3
Plasma potential
+
-
kT
M
,
U f e ln i
2e
2me
D 0 kTe
Ef
Uf
D
+
,
2ne e 2
-
+
+
ne kTe 5.12
+
-
+
+
+
e
+
+
e
D~0.1 mm
+
D 1.6 107 m,
D
-
e
+
kTe 18 eV , U f 26.4 V
Uf
+
12
ne 4 1022 m -3
Ef
-
+
3.6 1010 V
m
12
D 2 M i eU
f
hot spot
~ 1 ps
surface
Y~10
[Schwirzke, JNM 1984]
3
Unipolar Arc in glow discharge
Typical parameters for self-sustained self-sputtering
Superdense glow discharge in pseudospark
(hollow Mo cathode filled with H2)
Heating occurs via ion bombardment.
Plasma fueling:
Evaporation of surface atoms
Tip explosion by high electric field
nc ~ 1021 m 3 ,
Jc
vc
Y ji
vc Ze
~ 1025 m 3 ,
i ne 1 1 mm
d c 2 0U c ene ~ 50mm,
12
12
~ 10 V
9
2
E ccr
,
E ccr 10 GV/m, necr 5 1019 m 3
2
ne n 0
eU c
Heating via ion bombardment.
Plasma fueling:
Evaporation of surface atoms
Tip explosion by high electric field
nc
1
ve e sec 1m m
j
e
en U
U
Ec c e c
dc
2 0
~ 20, U c ~ 2 keV
RF breakdown on Copper surface
cr
e
m
,
( i ~ 10-19 m 2 )
D 2 nm, d c 1.5D .
d c 2 0U c ene ~ 1 3 nm,
12
Ec
Uc
5 1010 V .
m
dc
[Insepov, Norem CAARI (2008)]
[A. Anders et al, J. Appl. Phys. (1994)]
4
Unipolar Arc model for rf linacs
0
j jFN
jChild
jtherm
J Sputt
,
1.541 106 E 2 t 2 ( y )
j
(1) FN
3
2
7
exp 6.831 10
v y , E E0
E
(2) j Langmuir Child
(1) Fowler-Nordheim equation for electrons,
(2) Langmuir-Child equation for ion current
from plasma to the tip,
(3) Richardson-Dushman equation for thermal
emission of electrons from the tip,
(4) Sputtering Flux by plasma ions – Bohm
current
The temperature rise depends on the total
current, k – thermal conductivity.
Thermoioni c
(3) j
4
0
9
3
2e V 2
,
2
mi d
e
A0T exp
,
k
T
B
2
12
2kTe
,
j
0
.
43
e
n
0 i
(4) Bohm
mi
T
cv
j 2 kT ,
t
5
Plasma model of RF breakdown
(1) Fowler-Nordheim equation
for electrons ( = 100, 200)
(2) Langmuir-Child equation for
ion current from plasma to the
tip (d=1 mm)
(3) Richardson-Dushman
equation for thermionic emission
of electrons from liquid Cu
(T=1300K)
(4) Sputtering Flux was
calculated from Bohm current
(plasma ion fluxes) times the
sputtering yield at 1300K
6
Plasma-surface interactions
Radiation-induced mechanisms: Implantation (fast particles, light, impurities and highly-charged ions)
can contribute to effects on sputtering, preferential sputtering, recoil implantation, cascade mixing,
diffusion, gibssian adsorption (surface segregation), and radiation-enhanced segregation.
Optical surfaces will be exposed to an expanding post-discharge EUV source plasma.
Sputter fluxes depend on incident particle fluxes and energy determined by sheath field.
Potential sputtering due to collisions of Highly Charged Ions (Xe+10 etc).
The net sputter erosion via balance between erosion and redeposition.
7
Bridging the scales
Time, s
Wien2k, Abinit, AMBER
ART
CG-MD
COGNAC
Kinetic models
DSMC
Continuum
Gas-, hydro-, hemodynamics
1
Microstructure
Thermo-chemistry
Mesoscale
Accelerated MD
Hybrid MD/MC
10-3
Kinetic MC
Radiation defects
and damages
10-6
Atom. simulations
Molecular Dynamics/
Monte-Carlo
10-12 El. structure
Ab initio Quant.
Mechanics
1
102
Thermodynamics
Chemical reactions
TST
MD: HyDyn-scale: from nm to tens of mm
MC: Penelope, MC SEE
Length, [Ǻ]
104
Understanding/prediction
106
108
1010
Engineering applications
8
Plasma-model development
plasma
Coulomb explosion
of tips and fragments
d ~ 1.5D
OOPIC and Vorpal need the self-sputtering data as an input
9
Sputtering Yield models
Sigmund’s theory – linear cascades, not good
for heavy ions and low energies
Monte Carlo codes: binary collisions, not
accurate at low energies
Empirical models based on MC – suitable for
the known materials
Molecular dynamics developed at Argonne –
time consuming but no limit for energies, ion
masses, temperatures, dense cascades,
thermal properties - can verify OOPIC and
VORPAL
10
Sputtering theory and models
Sigmund’s theory
Y ( E ) FD E ,
3
1
0.0420
,
2
4 NC0U s
NU s
FD E M 2 M 1 NS n E
FD E deposit edenergy,
N at omicdensit y,
U s - surface binding energy,
S n E nuclear st oppingpower,
Eckstein-Bohdansky’s model
Eth 2 3 Eth 2
Y ( E ) Qsn 1
1
,
E E
Q, Eth adjustable paramet ers,
E
M2
aL
, ( - reduced energy)
M 1 M 2 Z1 Z 2 e 2
aL 0.4685 Z 12 3 Z 22 3
snTF
1 2
A
3.441 ln1 1.2288
.
0.1728 6.882 1.708
C 0 coefficient .
Not applicable for heavy ions
C0, Us - adjustable parameter.
[P. Sigmund, Phys. Rev. B (1969)]
Not applicable for light ion, high energy ions
(no electronic stopping power).
Needs adjustable parameters.
[Bohdansky, NIMB B (1984)]
11
Yamamura’s empirical model
Yamamura’s interpolation model based on Monte-Carlo code
Y ( E ) 0.042
Eth
FD E
1
NU s
E
M 2 M 1 S n E
Eth
1
NU s
E
N atomicdensity,U s - surface binding energy,
0.042
S n E nuclear stoppingpower,
adjustable parameter,
Eth
M 2 M 1 S n E sn
Y ( E ) 0.042
1
,
Us
sn S n E
E
s
6.7
,
Eth
1 5.7M 1 M 2
,
M1 M 2 ,
M1 M 2.
4 M 1M 2
.
M 1 M 2 2
No temperature dependence
12
Why atomistic simulation?
Atomistic simulations of breakdown triggers: progress report
Flyura Djurabekova and Kai Nordlund, University of Helsinki
1.5
3.6
Background 2
Argonne showed that nanobump +
high electric field can lead to the
cluster evaporation
6
[Insepov et al, PRST-AB 7 (2004)]
CLIC RF Breakdown Workshop, CERN 2008
13
MD model for energetic collisions
Cu+
v
Central red area are evaluated by atomistic
MD simulation method.
Thermal balance is maintained by finitedifference method: elasticity & thermal
diffusivity equations.
Copper ion interacts with target via
ZBL-potential
Copper atoms interact via N-body
potentials
Copper target bombarded by Cu ions
with E = 50 ev – 100 keV
14
MD model of Cu self-sputtering
Sputtering Model
MD simulations T=300-1300K
Plasma
Lattice parameter depends on T
Energy absorbing boundaries
The number of ions: 102-106
Yield
N atoms
N ions
MD gives the positions, energies and the
probabilities of various processes: sticking,
sputtering, back-scattering, energies.
15
MD movies
Ei=170 eV, T=300K
Ei=100 keV, T=300K, Yield=9
Ei=8 keV, T=300K
16
Comparison of yield data @ RT
Results
Monte-Carlo data are 6
times lower than MD at
E=100 ev
Empirical models should
be evaluated based on MD
data
Two EAM MD potentials
give comparable results
Sigmund’s theory is not
good for self-sputtering of
Copper
Yamamura’s model is
systematically lower than
MD
17
T-dependence of Sputter Yield
Ei=50 ev
Ei=100 ev
Ei=150 ev
18
Cu self-sputtering Yield: T=300-1300K
This plot shows that
surface self-sputtering
by plasma ions can be
an efficient plasma
fueling mechanism for
target temperatures
T > 900K
19
Taylor Cone formation
In a high electric field, surface atoms
are field evaporated. This effect is
used in Field Ion Microscope (FIM)
[E. Müller, 1951]
Dyke-Herring’s model
Herring’s theory of transport phenomena was applied
to a tip in field-emission experiments and surface tension
and migration coefficients were obtained for a W tip.
Microchannel Plate
Polarized gas atom
[C. Herring, J. Appl. Phys. 1952]
Phosphor screen
Taylor model
FIM tip
cooled
to 20100K
Gas ion
≈ 98.6
jet
HV
FIM
[G. Taylor, Proc.R.Soc.1964]
20
Comparison with experiment
time: 1ps
Em=10GV/m
f=1.25 GHz
T=800K
time: 185 ps
21
Coulomb explosion (CE) model
A bell-shaped Cu tip on the surface and a cubic fragment in vacuum
Charge density defined from ~ 200
E0 = 10 GV/m; D = 55 - 125Å
S = D2/4 = (0.2-1.2)×10-16
m2
N+ = S/e = 0 E S/e
Nq 10 - 100
22
Energies of exploded atoms
time=0
time=200 ps
time=0
time=40 ps
23
Summary
A unipolar arc plasma model is used to understand self-sustained and
self-sputtered plasma formation and RF high-gradient breakdown
An MD model was developed and self-sputtering yields of Cu-ions
were calculated for a wide region of ion energies and surface
temperatures and compared to experiment and other models.
Sputtering yield was calculated for solid and liquid surfaces for and
T=300-1300K and E=50–150 eV - typical for Unipolar Arc.
Coulomb explosion mechanisms were simulated and the energies of
Cu atoms were calculated.
A Taylor cone formation in a high-electric field was simulated for the
first time. The simulated apex angle of 104.3 is close to the
experimental value of 98.6.
We are close to understanding of the whole plasmasurface interaction in rf linacs and we can mitigate the RF
breakdown.
24