Transcript Q4 Objectives

Telecosm 2004
John Trezza
© 2004 Xanoptix, Inc
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Xanoptix Purpose
Xanoptix exists to permit the concept of a “Chip”
to transcend materials, technologies and distances.
Xanoptix will enable a world free of hardware bottlenecks by allowing
unimpeded communication between integrated circuits
Many data paths,
Unrestricted speed, and
Vast reach (microns to kilometers).
By doing so, we will
Radically improve the price/performance electronics,
Merge ‘chips’ and ‘the network’, and
Move the IC industry from a ‘mainframe-like’ model to a ‘PC-like’ model.
© 2004 Xanoptix, Inc
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Bit Rate (Megabits/second)
More Complex Chips with More I/O
1.E+15
1.E+14
1.E+13
1.E+12
1.E+11
1.E+10
1.E+09
1.E+08
1.E+07
1.E+06
1.E+05
1.E+04
1.E+03
1.E+02
1.E+01
1.E+00
1970
10,000 x
\
1980
1990
2000
2010
Year
© 2004 Xanoptix, Inc
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Industry Problems
ICs: Poor Communication & Performance
•IN SYSTEM: Can send 0.01% of Desired CHIP Data
•BY USING 10% to 50% of CHIP POWER AND AREA
•IN NETWORK: 0.0001%
ICs:complex to design & Limited In Roadmap & Expensive
•Material Choices Like the Model-T Colors
•IP sharing hard
•$1million & Months of Design for Each Attempt
•No Upgradability
•Large chips = “wafers-per-chip” Yields
•Million costs when 90% of chip needs Inexpensive
•Chips not expected to grow in next 10 years!
© 2004 Xanoptix, Inc
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What we do –
3D Integrated Circuits
Material-Neutral, Chip-level, direct
die-to-die interconnection
THE XANOPTIX DIFFERENCE
Integrate
3D
Wafer
MILLIONS of Connections per cm2
Daughter Wafers
Mother Wafer
(e.g. CMOS)
Electronic Passive Optical
ANY Material / Process / Fab
Stack
Semiconductor Economies of Scale.
GaAs
Si GaAs, InP
Ceramic
Si
Si
Si Si
Multi-Vertical-Stack
Silicon CMOS, Bi-CMOS, GaAs IC, etc.
1000s Optical Connections
Electronic
Connections
(um sized)
© 2004 Xanoptix, Inc
(Chips kilometers Apart Act as 1 Chip)
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Process
Base Process
Electrical, Mechanical,
Thermal Connection
4 to 14um
Daughter IC
I/O Pad
Openings
<5um
Mother Wafer
7 to 50um
Multi-Stacking
Chips w/ vias
© 2004 Xanoptix, Inc
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What we are working to achieve
Repeat the IC Revolution
Transform
Boards of Chips & Modules
Into
Individual Stacked Chips
PROCSSOR
WLAN
USB/Audio
USB/
HDD
Audio/HDD
OPTICAL
GRAPHICS
DRAM
© 2004 Xanoptix, Inc
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What we are working to achieve
Move the IC Industry from
a ‘mainframe-like’ to
a ‘PC-like’ model
Transform
Large, Complex Chips
Into
Modular Stacked Chips
PC-Like
Mainframe-Like
Processor
Core
L2
Cache Bus
Logic
L3
Cache
© 2004 Xanoptix, Inc
L3
Cache
L3
Cache
L3
Cache
Bus
Logic
L2
Cache
Processor
Core
Bus
Logic
Processor
L3
L3
L3
L2
Cache
Cache
Core
Cache Cache
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What we are working to achieve
Remove I/O Bottlenecks
over Any Distance.
Transform
Many ICs & the network
Into
One Big ‘Chip’
Kilometers
Transceiver
Microns
DRAM
Optical I/O
SRAM
Mixed Signal IC
RF Chip
Silicon CMOS IC
(e.g. Microprocessor)
© 2004 Xanoptix, Inc
DRAM
Optical I/O
SRAM
Mixed Signal IC
RF Chip
Silicon CMOS IC
(e.g. Microprocessor)
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3D Stacked ICs:
ICs are Dramatically Improved in Performance
•ALL Data Available over ANY distance (The
chip =network)
•90% Less I/O Power
•99% Less I/O Space
ICs are Unlimited in Flexibility & Decreased in Cost
•Mix & Match Processes & Material From Best Suppliers
•The chip IS the board
•Days of Design for new version of a chip
•Customize & Upgrade your chip just a PC.
•Several Smaller chips each with very high yield
•Cost is on function-by Function basis
•‘Unlimited’ chip size
© 2004 Xanoptix, Inc
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Key Capabilities
ELECTRONICS
Mixed Signal
IC Design
3-D Folded
Packaging Design
© 2004 Xanoptix, Inc
3D Stacked IC
OPTICS
Optical Device
Design
& Fabrication
Optical
Packaging Design
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Xanoptix Has Advanced 3D Capabilities
Electrical Chips
Demonstrated
Chips for
Products
Capability
~ 600
10,000
Million
Million+
14 um
7 um
4 um
2 um
40,000/cm2
160,000 / cm2
1,000,000/cm2
1,000,000+/ cm2
216
N/A
~ 300,000
> 300,000
1st Optical
Product
#
contacts/chip
Contact Size
Contact
Density
# Optical
devices
Contact yields 99.9995%
© 2004 Xanoptix, Inc
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First Commercial Application
Combines active optics and electronics into single chips
Single Chip Optoelectronic Transceiver
250 Gb/s
(equivalent to 1,250 Ethernet Cards)
© 2004 Xanoptix, Inc
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Para-Optix Product Line
Xanoptix Component
Xanoptix
IC
•15x number of optical devices
•3:1 Laser redundancy
•Programmable
Chip
Optical
Connector
Heat Sink
Xanoptix
3-D
Packaging
Optical Output
Electrical
Connector
1cm
P R O G R A M MING
XTM-12
XTM-16
5Gb/s
© 2004 Xanoptix, Inc
XTM-24
XTM-32
XTM-48
XTM-72
400Gb/s
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PARA-OPTIX VS. LC SFF
IP Routers
Core Switching
CATV/Metro Switching
Storage/Data Switching
Computing & Server
© 2004 Xanoptix, Inc
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Next Generation:
Fiber Cables
NEXT GENERATION PASSIVE
OPTICAL CABLING
“100,000 points of light”
100,000 fibers
3mm
100,000s of fibers
1000s Optical I/O
© 2004 Xanoptix, Inc
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Future Development Roadmaps
Intelligence
Tx / Rx
Transceiver
Backup/redundancy
Power monitoring
Pre-Emphasis
Equalization SERDES
Clock Recovery
Microprocessor
FPGA
Graphics
Network Processors
SRAM &DRAM
BIOS Chipsets
Memory controllers
Drive controllers
Data aggregators
Microprocessors
GbE / FibCh codec
SONET scrambling
Crossbar Switching
Drop/Add
ECC & CRC
Regenerators Framing
Header Decoding
Digital Crossconnect
WDM Crossconnecct
Clocking distribution
Bus Controller
© 2004 Xanoptix, Inc
Speed/I/O
640 Mb/s/ch
1 Gb/s/ch
1.25 Gb/s/ch
2.5 Gb/s/ch
3.125 Gb/s/ch
5.5 Gb/s/ch
6.25 Gb/s/ch
10 Gb/s/ch
12.5 Gb/s/ch
40 Gb/s/ch
# optical I/O
1
2
4
8
12
16
24
32
48
72
96
128
144
256
288
576
9216
36864
589824
Wavelength(s)
850nm VCSEL
1310nm DFB
Single Mode devices
CWDM (2-16 l)
1550nm DFB
DWDM(16-256+ l)
600nm VCSEL
1310nm VCSEL
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Example: Communication Systems
Expensive
Monolithic
Routers, Servers,
DWDM systems
$1 Million ; 6ft System.
Commodity
Systems
• 1000s of Optical I/O channels
• Hundreds of wavelengths
$1,000 ; 1in System.
Microprocessor, Router,
DWDM System
© 2004 Xanoptix, Inc
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Kilometers
Transceiver
Microns
DRAM
Optical I/O
SRAM
Mixed Signal IC
RF Chip
Silicon CMOS IC
(e.g. Microprocessor)
© 2004 Xanoptix, Inc
DRAM
Optical I/O
SRAM
Mixed Signal IC
RF Chip
Silicon CMOS IC
(e.g. Microprocessor)
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Computing, Storage, Office, and
Consumer Opportunities
Single Chip Digital Cameras
(Sensor, Logic, Memory, display, and Network in one)
Highly Parallel Communication
For storage systems
Other Consumer Electronics
•Single Chip DVD Recorder (read the disk in one rotation)
•Memory Stacks
•Single chip “Xbox in a wristwatch”
•Printer/Scanner/Copier Chip
© 2004 Xanoptix, Inc
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Next Generation:
Telecom & Communications Products
WLAN on a Chip
Cell Phone / Base Station “on a Chip”
LNB devices/Modules for Satellite TV
Single-Chip, Ultra Redundant Undersea Repeaters
Single Chip Fiber to The Home ‘box’
Modular ASICs
© 2004 Xanoptix, Inc
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Next Generation:
Consumer, Industrial, Military, and Commercial
Active printed circuit boards, Cables & IC sockets
The Connector/Cable *IS* the
Electronics/Optics/network
In-Flight Networking & Entertainment Chips
Single Chip High-Temp Industrial Control Sytems
Avionics & Space
© 2004 Xanoptix, Inc
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Next Generation:
Automotive Products
Active Auto Fiber Harness
(embedded Electronics and/or optics in cables/connectors)
Drive by Wire; In Car network.
Sensor Modules / Engine Control Modules
On Board Computer Networks
Silicon
GaAs / InP
MEMS
© 2004 Xanoptix, Inc
GaN
RF
Optics
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Summary:
Performance, Functionality, Yield, Cost
•A Chip combines the best of all technologies.
•Merge ‘chips’ and the ‘network’
•Increased Communication Bandwidth & Functionality (millions / cm2)
•Extended communication distance (1um kms)
•Lower communication power
•Upgradability: Treat ICs like PCs
•Eliminate the need for entire classes of other components
•1st Commerical Chips:
245 Gb/s in 1 square centimeter --more bandwidth than 1000 Ethernet cards
•Huge opportunities throughout the industry.
© 2004 Xanoptix, Inc
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The Vision
Event
Integrated
Circuits
Developed (1961)
Significance
First Product
Market Result
Revolutionized
Electronics
Hearing Aid
$100s
Billions
Electronics
industry
now
(TI & Fairchild)
3D and
OPTICALLY
Revolutionizes
ENABLED
Electronics &
Integrated
The Network
Circuits
Developed (2001)
Intelligent
Transceiver
$
(Xanoptix)
© 2004 Xanoptix, Inc
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