Transcript Filotec

Filotec
USPs
23.11.2012
BOPLA Product Marketing - M. Bünte
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FILOTEC - general features
 Functional, technically oriented design
 Modular conception
 78 different enclosure variants available in the standard product portfolio
 Variants with integrated cooling fins and mounting brackets
 Customer- and application specific adaptions available via BOPLA´s manufacturing services
23.11.2012
BOPLA Product Marketing - M. Bünte
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FILOTEC – external design features
Large-scale fontpanels and
surfaces provide lots of mounting
space for connectors, cable
glands operating elements, etc.
The technical design discretely
perfectly blends in any application.
Outside ribbing ensures an
improved heat dissipation even
without using heatsinks.
Full aluminium body:
 High mechanical strength
 Degree of protection IP40
 EMC shielding
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BOPLA Product Marketing - M. Bünte
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FILOTEC – the modular concept
The recessed, recatngular mounting area is
suitable for cost efficient rectangular
membrane keypads and decorative foils
which do not require special stamping tools.
Rectangular, flat surfaces ensure
precise and cost-efficient machining.
Conventional screws –
no special tools required for assembly.
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BOPLA Product Marketing - M. Bünte
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FILOTEC – the modular concept
Identical front and rear panels
as well as identical upper and
lower profiles help to
streamline logistics and to
keep stock-levels low.
Just in case…
The simple frontpanels
may be reproduced
easily with no need for
specialised tooling.
The split-profile enclosure concept
ensures convenient access to the
mounted PCBs during assembly
and maintenance.
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BOPLA Product Marketing - M. Bünte
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FILOTEC – the modular concept
An optional profile with integrated
heat sink keeps sensitive electronic
components cool without additional
time and effort.
An optional profile with integrated
wall mounting brackets simplifies
installation.
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BOPLA Product Marketing - M. Bünte
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FILOTEC – Internal mounting space
Optimum utilisation of the mounting
space and thus smaller overall
dimensions of the electronic device.
Suitable for cost efficient rectangular PCBs
with no need for complicated and expensive
machining.
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BOPLA Product Marketing - M. Bünte
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BOCUBE – Fields of application
FILOTEC
 Is suitable for use in „typical“ BOS-Ecoline and ALUBOS applications.
 While BOS-Ecoline and ALUBOS are mainly used in handheld applications and thus feature
an ergonomic design, FILOTEC focusses on a functional and reliable „packaging“ of the
electronics.
 Please note that due to the split-profile enclosure concept the degree of protection may not
be increased up to higher levels – IP 40 is the maximum.
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BOPLA Product Marketing - M. Bünte
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Thank you very much
for
your kind attention.
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BOPLA Product Marketing - M. Bünte
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