Transcript TRR - University of Colorado Boulder

Test Readiness Review
March 5, 2015
Project Manager:
Gabrielle Massone
Systems Engineer:
Jesse Ellison
Deputy Project Manager
Financial Lead
Tanya Hardon
Software Lead:
Cy Parker
Optics Lead:
Jon Stewart
Mechanical Lead
Jake Broadway
Customers:
Brian Sanders
Colorado Space Grant (COSGC)
JB Young and Keith Morris
Lockheed Martin (LMCO)
Test and Safety Lead:
Franklin Hinckley
Thermal Lead:
Brenden Hogan
Faculty Advisor:
Dr. Xinlin Li
Dept. Aerospace Engineering
Laboratory for Atmospheric and
Space Physics (LASP)
Electrical Lead:
Logan Smith
Purpose and Objectives
Testing Readiness
Schedule
Budget
1
Presentation Overview
 Project Purpose and Objectives
 Schedule
 Test Readiness
•
•
•
•
System Test Plan
Optical and Mechanical
Thermal
Electronics and Software
 Budget
 Concluding Statements
Purpose and Objectives
Testing Readiness
Schedule
Budget
2
PROJECT PURPOSE AND
OBJECTIVES
Purpose and Objectives
Testing Readiness
Schedule
Budget
3
Phoenix Mission Objective
Develop a proto-flight, angular-velocity sensor payload that
can observe an object in mid-wave infrared and determine the
angular velocity of the object in the field of view
Proto-flight Unit:
Defined as hardware that is designed to flight form-factor, but will be tested
exclusively on the ground and is not required to undergo environmental testing.
Purpose and Objectives
Testing Readiness
Schedule
Budget
4
Mission Concept
Example angular velocity sensor concept
ω
6U CubeSat with
Rate Sensor Payload
Observing asteroid in FOV
Bennu 101955
Asteroid
Characterize rotation of asteroid for
rendezvous operations
Video courtesy of www.asteroidmission.org
Purpose and Objectives
Testing Readiness
Schedule
Budget
5
Mission Concept
Use this sequence of images to determine the object’s
angular velocity vector in the camera FOV
Report this observed rate to
the bus
Effectively an infrared
angular velocity sensor
Purpose and Objectives
Testing Readiness
Schedule
Budget
6
Design Overview
Phoenix Interfaces with the 6U LMCO Bus
•
Inhabits 1/3 of spacecraft volume
Phoenix CPE’s:
1. Optics and Mid Wave IR
Imaging system
2. Thermal Control System
3. Supporting Electronics
4. Software Angular
Velocity Determination
Algorithm
10 cm
Purpose and Objectives
Testing Readiness
Schedule
Budget
7
Functional
Block
Diagram
Purpose and Objectives
Testing Readiness
Schedule
Budget
8
Levels of Success
Level 1
1. Capture a mid-wave infrared image with a spot size of 1.3 cm
and read all pixel values in software
2. All measured temperatures match thermal model within 5K.
Level 2
1. Capture MWIR image with a spot-size of TBD
2. Determine observed ω within ±10% in software
3. Maintain critical components at a temperature below passive
steady-state temperature
4. Integrate all optics and support structure into 2U form-factor
Level 3
1. Successful optics integrated test
2. Determine the observed angular rate to ±10% and observed
axis of rotation to ± 10◦ of known values in software
3. Control and monitor all thermal hardware
4. Integrate all components into 2U payload form-factor
Level 4
1. Successful optics and thermal integrated test
2. Determine the observed ω to ±5% and the observed axis of
rotation to ±5◦ of known values in software
3. Satifsy 6U Bus mass, power, data, and thermal requirements
Purpose and Objectives
Testing Readiness
Schedule
Budget
9
Critical Project Elements
Critical Element
Subsystem Driving Requirements
Capture Mid Wave
Infrared (MWIR) image
Optical
The payload shall determine the angular
velocity and axis of rotation of an observed
object (O.2), The payload shall use the 3.5 µm
mid-wave infrared (MWIR) wavelength (O.3)
Control focalplane to
operating temperature
of ≤ 150 K
Thermal
The payload shall maintain all components in
their operating temperature ranges (O.4)
Determine angular
velocity vector of object
in sensor field of view
Software
The payload shall determine the angular
velocity and axis of rotation of an observed
object (O.2)
Provide a hardware
platform for the
software
Electrical
The payload shall determine the angular
velocity and axis of rotation of an observed
object (O.2)
Purpose and Objectives
Testing Readiness
Schedule
Budget
10
SYSTEM
Purpose and Objectives
Testing Readiness
Schedule
Budget
11
System Testing Flow-down
Integrated System
Optics Test
Subsystem
Component Tests
Subsystem
Integration Tests
Integrated System
Thermal Test
Component Tests
Tests requiring a
single subsystem.
(optical flow module,
power regulator
output)
Purpose and Objectives
Subsystem Verification
Tests involving multiple
subsystems but short of
full system testing.
(e.g. testing software on
electronics instead of
host computer)
Testing Readiness
Schedule
System Verification
Full system testing,
requires integration of all
subsystems
Budget
12
Integrated System Fit Check
Verify all components correctly integrate into system
as they are machined or procured
 Allows time to fix issues prior to additional dev.
Purpose and Objectives
Testing Readiness
Schedule
Budget
13
Integrated System Optics Test
Test Objectives
1.
2.
Requirements Verified
Verify Image Capture from nBn
1.SYS.2 - Capture MWIR 3.5 µm Image
Sensor
1.SYS.3 - Determine ω of target
Verify Software Image Processing
Level of Success Achieved
Algorithms able to determine
angular velocity vector of target
Level 3: Successful Demonstration of
Test
Level 4: Test Completed with Required
Accuracy of ω
Test Target located at
“eye-piece”
Telescope as Collimated Light Source
Purpose and Objectives
Testing Readiness
Schedule
Budget
14
Integrated System Optics Test



Test Setup
Cooling Jacket: Steel structure filled
with dry ice/methanol mixture
Atmosphere: Argon or Nitrogen
purge for low-humidity, no carbon
dioxide (deposition at 195K)
Clean Environment: clean-room not
required
Purpose and Objectives
Testing Readiness
1.
2.
3.
4.
Test Procedure
Capture first image
Rotate target known amount
Capture second image
Compute vector field and
angular velocity vector
1
2
3
4
Schedule
Budget
Vector Field
Output
15
Integrated Thermal Test
LMCO TVAC Chamber
Thermal-Vacuum Chamber Coordinated
with LMCO for April
Test Objectives
1.
2.
Verify Thermal Monitoring
Verify Thermal Control
Requirements Verified
1.SYS.4 – Maintain Operating
Temperatures (esp. nBn sensor)
Level of Success Achieved
Bus Heat Sim
Ethernet
Voltage
12V/3.3V/Bat
Bus Simulator
Purpose and Objectives
Testing Readiness
Level 1: Measured Steady-State
Temperatures Match Model ±5K
Level 2: Monitor and control all thermal
hardware
Level 3: Thermal control reduces steadystate temperatures
Level 4: Maintain all operating
temperatures
Schedule
Budget
16
Integrated Thermal Test
Test Setup

LMCO TVAC Chamber
Thermal Vacuum Chamber: Provides
cold surroundings, solely radiative heat
transfer
Test Procedure
Bus Heat Sim
Ethernet
Voltage
12V/3.3V/Bat
Bus Simulator
Purpose and Objectives
Testing Readiness
1. Provide power to payload, verify only
electronics heaters are running
2. Once operating temperature is reached
verify power board starts up
3. Start image processing board
4. Read out and record all temperatures
5. Start active thermal control
6. Read out and record all temperatures until
steady state is reached
7. Start bus simulator heaters
8. Read out and record all temperatures until
steady state is reached
Schedule
Budget
17
Integrated Thermal Test
Temperature (K)
Anticipated TVAC Test Profile
Phase Durations
Purpose and Objectives
Testing Readiness
Schedule
Budget
18
ELECTRONICS
Purpose and Objectives
Testing Readiness
Schedule
Budget
19
Electronics Overview
Bus
Simulator
Phoenix Avionics Stack
TEC Control
Battery
PSU
PC
(7.4V nom.)
Ethernet
RTD
RTD
RTD
Reg.
Power
Power and
Thermal
Board
Image
Processing
Board
Spi,I2C,GigE
( PTB )
Sensor
Module
Proprietary
( IPB )
JTAG, Reset
JTAG
HDMI
USB Debug
Debug
Programmers




Display
Terminal
2.ELEC.1 The electrical system shall interface with the LMCO 6U CubeSat Bus
2.ELEC.2 The electrical system shall interface with the MWIR Image Sensor
2.ELEC.3 The electrical system shall provide a hardware platform for the flight software
2.ELEC.4 The electrical system shall provide all hardware necessary for thermal
monitoring and control
Purpose and Objectives
Testing Readiness
Schedule
Budget
20
Power and Thermal Board Test Flow
Digital Rails
(1.0V, 1.35V, 1.8V, 3.3V, 5.0V)
Power Regulation
Image Sensor Rails
(0.9V, 1.6V, 3.3V)
Under Voltage Lockout
(ULVO)
Protection Circuity
Overcurrent Protection
(OCP)
Integrated Optics
Test
Heaters
Thermal Electric Coolers
(TEC)
Thermal Control
Temperature Sensors
(RTDs)
Under Thermal Lockout
(UTLO)
Purpose and Objectives
Testing Readiness
Schedule
Budget
21
Power and Thermal Board
Purpose and Objectives
Testing Readiness
Schedule
Budget
22
Power and Thermal Board
Temp Sensors
Heaters
TEC
Digital Power
OCP
UTLO
Sensor Power
Purpose and Objectives
Testing Readiness
Schedule
Budget
23
Power and Thermal Board Tests
 Power Regulation (3.ELEC.4)
• Verify all rails are within tolerances under
nominal and high-load cases
 Protection Circuitry (3.ELEC.4)
• Apply high current load to check response of protection
• Verify out-of-range voltages never seen on IPB rails
 Thermal Control (3.ELEC.7, 3.ELEC.8, 3.ELEC.9)
• Control TECs to 150k using dry-ice cooled heat-sink
• Cold start of electronics to show UTLO and heaters work
• Read thermal sensors to 2 degC accuracy
The electrical system shall guarantee all power provided to the sensitive hardware is within
specifications
The electrical system shall be able to convert thermal readings into engineering units with an
3.ELEC.7
uncertainty less than 2 degC
3.ELEC.8 The electrical system shall provide hardware to control a heater
3.ELEC.9 The electrical system shall provide hardware to control two thermal electric coolers
3.ELEC.4
Purpose and Objectives
Testing Readiness
Schedule
Budget
2.ELEC.2
2.ELEC.4
2.ELEC.4
2.ELEC.4
24
Image Processing Board Test Flow
HDMI Test
(draw test pattern)
Video Streaming
Sensor Readout
(read test pattern)
Ethernet
(Ping Device)
Power & Thermal Board
Communication
(I2C Read/Write)
Bus Communication
Integrated Optics
Test
SPI
(Fallback for Ethernet)
DDR3
(MemTest)
Image Capture
Video DMA Engine
(Read sensor data from CPU)
Purpose and Objectives
Testing Readiness
Schedule
Budget
25
Image Processing Board
Purpose and Objectives
Testing Readiness
Schedule
Budget
26
Image Processing Board
Boot
Flash
Ethernet
Sensor
Interface
SD Card
Purpose and Objectives
Processor
& FPGA
HDMI
Transmitter
Testing Readiness
DDR3L
RAM
USB
Debug
Schedule
Budget
27
Image Processing Board Tests
 Video Streaming (3.ELEC.3)
• Validates sensor interface
• Stream the image sensor’s test pattern
out through HDMI
 Image Capture (3.ELEC.6)
• Store a frame from input video stream to RAM
 Bus Communication (3.ELEC.5)
• Verify the communication interfaces required by the
Bus
• Ethernet - Ping the Device
• I2C / SPI - Read and Write Test via BusPirate
The electrical system shall utilize an FPGA to house the image sensor module interface IP
core
3.ELEC.5 The electrical system shall utilize the I2C, SPI, and Ethernet specifications.
The electrical system shall be capable of at least a 280Mbps transfer rate for the image
3.ELEC.6
sensor interface core.
3.ELEC.3
Purpose and Objectives
Testing Readiness
Schedule
Budget
2.ELEC.2
2.ELEC.1
2.ELEC.2
28
SOFTWARE
Purpose and Objectives
Testing Readiness
Schedule
Budget
29
Testing Flowdown
Bus Communication Module
Functional Testing
Integrated Communication
Test
(Testing Hardware)
Thermal Control Module
Functional Test
Integrated Thermal Control
Test
Level 2 Success
(Software Only)
Image Processing Test
Level 3,4 Success
Image Interface Module
Functional Testing
(Software Only)
Purpose and Objectives
Integrated Optics Test
Level 4
(Software Only)
Schedule
Test Readiness
Budget
30
Integrated Communication Test
 Test communication between Phoenix and Bus
Response to op-code with data
Preformatted packets with commands and data
Integrated Phoenix
Software +
Electronics
Bus Simulator W/
Test Program
Success: All op-codes return correct return data
2.SFW.1 The software shall communicate with the LMCO 6U CubeSat Bus
Purpose and Objectives
Testing Readiness
Schedule
Budget
31
Integrated Thermal Control Test
 Verify ability to control the thermal environment, this
includes reading RTDs and controlling TECs
Integrated Phoenix
Software + Electronics
Payload RTDS
Temperature
Measurement
Device
TECs
Success: Temperature data read from the RTDs matches the data from the external device.
When commanded the TECs changed temperature.
2.SFW.3 The software shall monitor the thermal state of the Phoenix payload
Purpose and Objectives
Testing Readiness
Schedule
Budget
32
Image Processing Verification
Initial Image
Rotated 2 Degrees
Image Gradient: 𝐼𝑥 , 𝐼𝑦
Time Gradient: 𝐼𝑡
Motion Vectors (unknown):
𝑉𝑥 , 𝑉𝑦
Solve system of equations
for the unknowns 𝑉𝑥 , 𝑉𝑦
𝐼 𝑥, 𝑦, 𝑡
𝐼 𝑥, 𝑦, 𝑡 = 𝐼(𝑥 + 𝑑𝑥, 𝑦 + 𝑑𝑦, 𝑡 + 𝑑𝑡)
2.SFW.2 The software shall determine the angular velocity vector of a target object
utilizing an image captured by the Phoenix payload.
Purpose and Objectives
Testing Readiness
Schedule
Budget
33
Image Processing Verification
Final Result:
Zoomed In Part
Of Vector Field
2.SFW.2 The software shall determine the angular velocity vector of a target object
utilizing an image captured by the Phoenix payload.
Purpose and Objectives
Testing Readiness
Schedule
Budget
34
Optically Induced Error
For an f-number of 4.2 (i.e. Phoenix
optics), must have a gradient of at
least 2 LSB for one pixel movement
With current design, optical
errors can be neglected
When ratio of red section
to orange section is > 5/3,
a feature translation can
be detected
Purpose and Objectives
Testing Readiness
Schedule
Budget
35
Solution Errors
 Worst case rate error is within bounds when 100
vectors are averaged
• According to equation 𝑒𝑟𝑟𝑜𝑟 =
1
𝑁
• Occurs with very gradual gradient
 Worst case axis knowledge: 8.9°
2𝑑
• According to equation 𝑒𝑟𝑟𝑜𝑟 = sin−1 (
1− 𝐷
2𝑑 2
+1
𝐷
)
where 𝑑 = 𝑝𝑖𝑥𝑒𝑙 𝑠𝑖𝑧𝑒 and 𝐷 = 𝑡𝑎𝑟𝑔𝑒𝑡 𝑑𝑖𝑎𝑚𝑒𝑡𝑒𝑟
• Slightly higher than required 7.2°
Purpose and Objectives
Testing Readiness
Schedule
Budget
36
Image Processing Test
 Verify our angular velocity determination algorithm.
• Check this against the expected value to get error
• Is this error bounded by our error model?
• Can be performed with or without the hardware
Angular Rate
Determination
Algorithm
Test Images
Observed Angular
Velocity
Success Determine the magnitude of the observed angular velocity vector to
Level 2 within ± 10% in software
Success Determine the observed angular velocity to ± 10% and observed axis of
Level 3 rotation to ± 10% in software
Success Determine the observed angular velocity to ± 5% and observed axis of
Level 4 rotation to ± 5% in software
Purpose and Objectives
Testing Readiness
Schedule
Budget
37
OPTICAL AND MECHANICAL
Purpose and Objectives
Testing Readiness
Schedule
Budget
38
Optics Testing Plan
Visible
Wavefront Test
IR Collimation
Test
Visible Focal
Length Test
Purpose and Objectives
Testing Readiness
Optical PSF
Test
Schedule
Integrated
Optics Test
Budget
39
PSF Test Overview
 Test Objective
• To compare actual optics system (aberrations and spot size)
with Zemax model
 Expected Results
• Obtain pictures of the Point Spread Function (PSF) across
entire field of view
 Targetted Requirements
• 2.OPT.1 – Optics shall have a spot size less than 20 𝜇m
• 2.OPT.3 – Optics shall image at 3.5 𝜇m wavelength
• 2.OPT.4 – Tolerances shall not change spot size by more than 15%
 Level of Success Targets
• Level 1 – Capture image with 1.3 cm spot size
• Level 2 – Capture image with 20 𝜇m spot size.
Integrate optics & support structure into the 2U form-factor
Purpose and Objectives
Testing Readiness
Schedule
Budget
40
PSF Test Overview
Optical Bench
3.39 µm HeNe Laser
Beam
Expander
(10.5x Mag)
Spatial Filter
Including
Telescope
(6x Mag)
Phoenix Camera
Telescope/Collimator
Purpose and Objectives
Testing Readiness
Schedule
Budget
41
Mirror Manufacturing Update
 Manufacturing 3 sets of primary and secondary
mirrors
 Plating of mirrors by North American EN
• Finish date: March 6th
 Diamond turning of mirrors by Nanophorm LLC
• Finish date: March 13th
Nickel Coating Thickness: 0.010”
After DiamondBefore
DiamondTurning
Turning
Nickel Deposit
Aluminum Substrate
Purpose and Objectives
Testing Readiness
Schedule
Required Surface
Roughness:
120 Angstroms
(5e-7 inches)
Budget
42
THERMAL
Purpose and Objectives
Testing Readiness
Schedule
Budget
43
Thermal Testing Flowdown
Substitute TEC
Test
TEC Test
RTD
Characterization
Integrated
Thermal Vacuum
Test
TEC Cold Image
Warm use of
Image Sensor
LN2 Assisted Cold
Image
Electronics
Ambient Thermal
Test
Purpose and Objectives
Testing Readiness
Schedule
Budget
44
TEC Test
•
•
•
Overview:
• Using final configuration TEC’s a 5/2 stack is
created.
• This stack is placed between two plates and
then the PTB executes control of the TEC’s
Verifies
• TEC control and algorithm feedback
• Functionality of 5/2 stage TEC stack up
• Accuracy of TEC calculations
Products
• Gains for controller to effectively achieve
temperature in a timely manner.
• DeltaT achieved at room temperature
Hot
TEC’s x2
RTD’s x4
Requirements
Description
1.SYS.4
Maintain all components in operating range
2.THM.7
Maintain nBn sensor at or below 150K ± 5K
3.THM.2
Utilizing an active thermal mechanism to cool sensor
3.ELEC.9
Controlling two TEC’s
Purpose and Objectives
Testing Readiness
Cold
Schedule
Budget
45
Thermal Verification
• Thermal Desktop model
• Controlled environment
Test Cases
data(TVAC) will be used to
All off
improve the model
• Verified within ±5 K of test data Bus Simulator
Full System
TVAC Cases
Description
Steady state when everything off
Steady state with bus heater on
Steady state with bus heater and
electronics on
Verification Locations
Sense Location
Relevant Node
Structural Panel
STRUCTURE.12
Primary Mirror
PRIMARY.20
Focal Plane
FOCALPLANE.5
IPB
ELEC.5
PTB
ELEC.17
TEC1
TEC.2
TEC2
TEC.7
Purpose and Objectives
Testing Readiness
Schedule
Budget
46
SCHEDULE
Purpose and Objectives
Testing Readiness
Schedule
Budget
47
Schedule
Today
Major Milestones:
Finished Mirrors – 3/20
Manufactured Structure – 3/16
Thermal Desktop Model Validation Complete – 4/23
Purpose and Objectives
Testing Readiness
Schedule
Budget
48
Schedule
Today
Major Milestones:
Electronic Board Bring Completion – 3/30
Integrated Software Test Completion – 3/20
Phoenix subsystems ready for integrated tests – 3/31
Integrated subsystem test complete – 4/20
Purpose and Objectives
Testing Readiness
Schedule
Budget
49
BUDGET
Purpose and Objectives
Testing Readiness
Schedule
Budget
50
Budget Status
Current vs. Projected Project Cost
Subsystem
Current Cost
Electronics
$ 4,330.77
Optics
$ 5,045.00
Thermal
$ 1,111.71
Structures
$ 1,080
Miscellaneous
$ 479.27
Testing
$ 242.38
Total
$ 12,289.13
Budget
$ 20,000.00
Budget
Remaining
$ 7,710.87
Percentages show the cumulative subsystem cost out of the $20,000 budget
Purpose and Objectives
Testing Readiness
Schedule
Budget
51
Cost Plan
Component
Cost
Contingency
Total
Lead Time
Gold Plating for Mirrors
$ 300
100%
$ 600
5 days
Patch Heaters
$ 30
60%
$ 50
3-5 days
Dry Ice/LN2
$ 90
100%
$ 180
1 day
Isopropyl Alcohol
$ 150
33%
$ 200
3-5 days
Thermal Paint
$ 350
0%
$ 350
Thermal Epoxy
$ 150.98
50%
$226.47
3-5 days
Symposium Supplies
$ 50
100%
$ 100
1 day
Binding - SFR
$ 50
0%
$ 50
1 day
Miscellaneous (Shipping)
$ 200
50%
$ 300
N/A
HeNe Laser
$ 2,790
0%
$ 2,790
~ 10 days
Optics Testing Equipment
$ 669.18
0%
$ 669.18
3-10 days
Total
$ 5,515.65
Budget Remaining
$ 7,710.87
Final
$ 2,195.22
Margin
10.9%
Purpose and Objectives
Testing Readiness
Schedule
Budget
52
CONCLUDING STATEMENTS
53
Conclusions
Thank you for your time
Acknowledgements
 PAB Faculty and Staff
 Faculty Advisor
• Dr. Xinlin Li
 Our customers
• Brian Sanders (COSGC)
• JB Young (LMCO)
• Keith Morris (LMCO)
54
References
[1] Adams, Arn. "ADVANCES IN DETECTORS: HOT IR Sensors Improve IR Camera Size, Weight, and
Power." Laser Focus World. PennWell Corporation, 17 Jan. 2014. Web. 13 Sept. 2014.
[2] "An Introduction to the NBn Photodetector." UR Research. University of Rochester, 2011. Web. 12 Sept. 2014.
[3] "ARCTIC: A CubeSat Thermal Infrared Camera." TU Delft. Delft University of Technology, 2013. Web. 13 Sept.
2014.
[4] Cantella, Michael J. "Space Surveillance with Infrared Sensors." The Lincoln Laboratory Journal 1.1 (1989): n.
pag.Lincoln Laboratory. MIT, June 2010. Web. 9 Sept. 2014.
[5] Cleve, Jeffrey V., and Doug Caldwel. "Kepler: A Search for Extraterrestrial Planets." Kepler Instrument
Handbook (2009): n. pag. 15 July 2009. Web. 12 Sept. 2014.
[6] "James Webb Space Telescope - Integrated Science Instrument Module."ISIM. Space Telescope Science Institute,
n.d. Web. 13 Sept. 2014.
[7] "NBn Technology." IR Cameras. IRC LLC, n.d. Web. 13 Sept. 2014.
[8] Nolan, M.C. et al, “Shape model and surface properties of the OSIRIS-Rex target Asteroid (101955) Bennu from
radar and lightcurve observations,” Icarus, Vol. 226, Issue 1, 2013, pp. 663-670.
[9] Otake, Hisashi, Tatsuaki Okada, Ryu Funase, Hiroki Hihara, Ryoiki Kashikawa, Isamu Higashino, and Tetsuya
Masuda. "Thermal-IR Imaging of a Near-Earth Asteroid." SPIE: International Society of Optics and Photonics. SPIE,
2014. Web. 13 Sept. 2014.
[10] "Spitzer Space Telescope Handbook." Spitzer Space Telescope Handbook 2.1 (2013): n. pag. Spitzer Space
Center, 8 Mar. 2013. Web. 8 Sept. 2014.
[11] Vanbebber, Craig. "Lockheed Martin Licenses New Breakthrough Infrared Technology." Lockheed Martin
Corporation, 7 Dec. 2010. Web. 9 Sept. 2014.
55
BACKUP SLIDES
56
CubeSat Bus Design Constraints
Bus Electrical Constraints
3.3 V
6.0 A Max
12 V
4.0 A Max
Unregulated Voltage
6.5 V – 8.6 V
6.0 A Max
Total Power
5 W Nominal Average
15 W Peak
Command Communication Bus
SPI Slave
High-Speed Communication Bus
Ethernet, Magnetics-Less Differential
Backup Communication Bus
I2C
Regulated Voltage Lines
Bus Structural Constraints
Total Volume
2U (10x10x20 cm)
Total Mass
2.66 kg + 0.1 kg/ - 0.5 kg
57
OPTICS BACKUP
58
ELECTRONICS BACKUP
59
THERMAL BACKUP
60
Thermal Model Motivation
• Once model can accurately simulate TVAC
environment it is validated for use in space
conditions
• Model can then be used by Lockheed Martin for bus
planning and to help drive con-ops
• Allows for easier integration of Bus/Payload thermal
analysis
Valid requirements:
1.SYS.6
61
TEC Test
• Setup
• PTB is controlling TEC’s using RTD sensor
feedback.
• Temperature of the plates are monitored
• Procedure
• PTB provides power to both the IPB and sensor.
• Software request image.
• Hardware returns and stores returned image.
62
Substitute TEC Test
• Overview:
• Using inexpensive single stage TEC’s a
stack is assembled consisting of 2
stages.
• This stack is placed between two
plates and then the PTB executes
control of the TEC’s
• Verifies
• TEC control and handling procedures
• Ability to control 2 TEC’s in series
• Assembly procedures
For testing only
Valid requirements:
1.SYS.4
2.THM.7
3.THM.2
3.ELEC.9
• Products
• Ability to proceed with more advanced
test of the actual TEC’s
Purpose and Objectives
Schedule
Test Readiness
Budget
63
Substitute TEC Test
• Setup
• PTB is controlling TEC’s using RTD sensor
feedback.
• Temperature of the plates are monitored
• Procedure
• Assemble TEC’s into plate assembly
• Control using the PTB
• Observe results and damage to devices
64
Electronics Ambient Thermal Test
 Overview:
• Benchtop observation of running
electronics in nominal scenario.
• Thermal profile will be obtained for
all boards.
Valid requirements:
1.SYS.4
1.SYS.6
2.THM.4
2.THM.6
 Verify
• Electronics do not exceed limits in
atmosphere.
• Determine heating distribution and
concentrations.
 Products
• Temperature profiles of all boards
at room temperature.
• Results fed back into thermal
desktop model heating distributions
on board level.
Purpose and Objectives
Schedule
Test Readiness
Budget
65
Electronics Ambient Thermal Test
 Set up
• All boards connected and running
• Flir thermal camera used as well as temperature
sensors
 Procedure
• Allow boards to operate both together and separate
• Record temperature profiles
66
Warm use of Image Sensor
 Overview:
• On a benchtop at room temperature all
electronics boards are connected.
• A image is requested and recorded.
 Verifies
• Sensor functionality.
• Software image capture capability.
• Hardware transport of image.
 Products
Valid requirements:
2.ELEC.2
3.ELEC.4
3.ELEC.6
• Allows cold test of sensor to begin
• Gives noise comparison for other test
Purpose and Objectives
Schedule
Test Readiness
Budget
67
Warm use of Image Sensor
 Setup
• IPB and PTB connected and functioning.
• IPB connected to sensor.
• RTD’s on sensor.
 Procedure
• PTB provides power to both the IPB and sensor.
• Software request image.
• Hardware returns and stores returned image
68
RTD Characterization
 Verifies
• Functionality
• Calibration
 Products
• Approved sensors are functional and within tolerance.
 Setup
• Ohmmeter sensing RTD leads
• Cup of boiling and ice water
 Procedure
• Insert each temperature sensor into the calibration source and
record the resistance value
• Post process the data to ensure that all sensors are both precise
and accurate.
 Results
• All 12 RTD’s reported the same temperature to within 0.1C
• Accurate to within 1C of each calibration source.
Purpose and Objectives
Schedule
Test Readiness
Budget
69
LN2 Assisted Cold Image
• Overview
• A LN2 cold finger is attached to the
sensor on a benchtop.
• An image is requested from the
sensor and recorded
• Verifies
• Sensor functionality.
• Software image capture capability.
• Hardware transport of image.
• Noise at operating temperature
• Products
• Allows optics test with sensor to
begin
• Gives noise comparison for other
test
Purpose and Objectives
Schedule
Sensor
LN2 Reservoir
Valid requirements:
2.ELEC.2
3.ELEC.4
3.ELEC.6
2.SFW.3
3.SFW.5
3.SFW.6
Test Readiness
Budget
IPB
PTB
2.THM.7
2.THM.1
3.THM.2
3.THM.3
70
LN2 Assisted Cold Image
•
•
Setup
• IPB and PTB connected and functioning.
• IPB connected to sensor.
• Cooled using a plumbing assembly with LN2
• RTD’s on sensor.
Procedure
• PTB provides power to both the IPB and sensor.
• Software request image.
• Hardware returns and stores returned image.
71
Passive and Active Heater Testing
• Overview
• The system is placed in the cooling
jacket.
• Temperatures are recorded as the
system maintains survival
temperatures
• The system is turned on and actively
regulates operating temperature
Valid requirements:
O4
1.SYS.4
2.THM.1
2.THM.6
3.THM.1
2.ELEC.4
3.ELEC.8
• Verifies
• Heater capability
• Control of boards to survival
temperatures
• Products
• Board can safely be used in the
integrated optics test and TVAC
• Heating response time characterized
Purpose and Objectives
Schedule
Test Readiness
Budget
72
Passive and Active Heater Testing
•
•
Setup
• Structure and boards inserted into testing setup cooling jacket
• RTDs are used for internal temperatures
• Thermocouples used for external temperatures
Procedure
• Boards are off with power off
• Jacket is filled and structure begins to cool to operating temperature
• At -20C boards are provided power and heating is observed
• The system is allowed to come to steady state
73
TEC cold test
• Overview
• The system is placed in the cooling
jacket.
• The TEC assembly actively cools focal
plane to operating temperature
• An image is captured and recorded
• Verifies
• Ability of system to capture an image
at nominal temperature with active
cooling
• Products
•
•
Ability of system to achieve required DeltaT
at operating temperature.
Image capture ability in form factor
Valid requirements:
2.ELEC.2
3.ELEC.4
3.ELEC.6
2.SFW.3
3.SFW.5
3.SFW.6
2.THM.7
2.THM.1
3.THM.2
3.THM.3
O4
1.SYS.4
3.ELEC.9
74
TESTING BACKUP
75
LOGISTICS BACKUP
76
Work Products Breakdown Structure
Structures
Electronics*
Thermal
Software
• Primary &
Secondary Mirror
Drawings
• Rev 1 Board
Schematics
• Block Diagram of
Thermal Paths
• Communications
Module
• Rev 1 Board Layout
• Focusing
Mechanism
Drawings
• Rev 1 Populated
Board
• Resistance Values
for Thermal
Contacts
• Sensor Interface
Module
• Thermal Mounting
Hardware
Drawings
• Load/Vibration
Analysis on Mirror
Supports
• Drawing Package
for all Components
• Drawing Tree
• CAD Model
• Machined
Components
• Rev 1 Board Test
Report
• Rev 2 Board
Schematics
• Rev 2 Board Layout
• Rev 2 Populated
Board
• Rev 2 Board Test
Report
• Integrated
Electronics
• Simulink Model
• Thermal Desktop
Model
• Integrated Thermal
System
• Rate
Determination
Module
• Image Interface
Module
• Temperature
Control Module
Optics
• Thermal
Background
Calculations
• Photon & SNR
Budgets
• Mirror Designs
• Baffle & Cold-Stop
Design
• Focused Optical
Assembly
• OP Code Dictionary
• Software
Reference
Document
• Software Package
• Assembled Units
* These deliverables pertain to both the Power and Image Processing Board
77
Work Products Breakdown Structure
Management
Testing
Systems
• PDD
• Procedure for TVAC Test
• CDD
• Procedure for Optics Test
• Test Procedures per
Subsystem
• PDR Presentation
• Integration Procedures
• ICD per Subsystem
• CDR Presentation
• MSDS Documentation
• Integrated Payload
• FFR
• Liner for Optics Test
• MSR Presentation
• Payload Bracket for
Optics Test
• TRR Presentation
• AIAA Paper
• Payload to Bus ICD
• SFR
• Aligned & Focused
Collimator
• Test Target
• Bus Simulator for TVAC
Test
• Test Results
78
Management Schedule
79