Transcript Bubble_Jet
HP Thermal Bubble Jet Printer MARAN MA YUAN FANG RAMNEET SINGH Outline • History of Printer Technologies • HP Bubble Jet Printer • HP Print Head Fabrication • Print Head Packaging & Circuitry • Performance Analysis • Conclusions History • 1878 – Lord Rayleigh – droplet breakup • 1960 – Continuous ink-jet - stream broken into droplets via pressure wave pattern History (cont’d) • 1979 – Canon develops drop-on-demand thermal bubble-jet • 1984 – HP produces first commercial bubblejet called ThinkJet HP’s Bubble-jet Advantage • HP’s print head is disposable – doesn’t sacrifice quality • Better quality due to frequent replacement • Allows for up to 4800x1200 dpi @ 24 ppm • Allows the use of pigmented ink for increased precision and superior fade performance Video clip on HP Cartridge Print Head Functional Requirements Store ink for each nozzle Heat ink drop via heater resistor Release ink at desired quantity & position HP Print Head Fabrication • Integrated fabrication process, facilitates critical alignment of: – Ink reservoir – Heater resistor – Orifice plate Reusable substrate: silicon or glass, with photoresist islands Orifice plate: nickel, via electroforming Photoresist island Reusable substrate Orifice plate HP Print Head Fabrication (cont’d) First insulating barrier: prevent shorting of resistor/conductor with orifice plate Heater resistors: narrow region of conductor R = Rs (L/A) Heater resistors – plan view Heater resistor Lead-in conductor Insulating barrier layer Lead-in conductor C-shaped heater resistor HP Print Head Fabrication (cont’d) Second insulating barrier: prevent corrosion of resistor/conductor by ink Seed layer: sputtered metal, etched to C shape Ink reservoir wall: nickel, via electroplating Substrate removal: peeling to unplug orifices Second insulating layer Insulating layer Wall Seed pad hole HP Print Head Fabrication (cont’d) Table 1. HP Bubble Jet print head fabrication procedure summary [8] Layer Suitable Material Deposition Process Thickness [um] Substrate Oxidized Silicon/ Glass Orifice Plate Nickel Electroforming 20-75 Insulating Layer 1 Silicon Dioxide /Silicon Nitride /Silicon Oxynitride PECVD /LPCVD 1-3 Resistor & Conductor Polysilicon /Tantalum Silicide /Gold Sputtering /PECVD /LPCVD Insulating Layer 2 Silicon Nitride & Silicon Carbide LPCVD Seed Layer Nickel /Titanium /Chromium Sputtering Barrier Nickel Electroplating 200-300 0.05-0.5 0.5-2 0.5-2 10-75 HP Print Head Fabrication (cont’d) Print head structure – plan view: ink flow channels along A MEMS fabricated print head structure prior to assembly with cartridge Lead-in conductor C-shaped heater resistor Orifice (nozzle) C-shaped reservoir wall Heater resistor Lead-in conductor Ink reservoir Seed pad Wall Second insulating barrier layer First Insulating barrier layer Hole Orifice plate Print Head Packaging & Circuitry Packaging Print head soldered to ink supply chamber wall Electrical contact bonded to exposed conductors Ink supply chamber Electrical lead for circuit interfacing Ink supply chamber wall Lead-in conductor Dome of C-shaped ink reservoir wall Electrical contact with lead-in conductor Print Head Packaging & Circuitry (cont’d) Circuitry Print Head Packaging & Circuitry (cont’d) Performance Analysis Piezoelectric printers are susceptible to nozzle-clogging TIJ use pigmented ink and pressure nozzle ejection TIJ vs Piezoelectric dots Piezoelectric vs TIJ vs Laser print on plain paper Colour Printing dpi is not the best measure of performance Rapid ejection of small dots is the key to quality printing (dps) HP’s TIJ has a higher throughput Smaller drop fluid chamber – more nozzles and higher firing frequency Epson PM750 1440 dpi, 65microns HP 2000C 600 dpi, 45microns Colour Printing (cont’d) Piezoelectric versus TIJ drops-per-second comparison Conclusions The Bubble jet print head is fabricated using MEMS technology Fabrication processes include: PECVD, LPCVD, photolithography, etching and sputtering Integrated design of the print head can increase reliability and reduce cost References [1] [2] [3] [4] [5] [6] [7] [8] [9] [10] “Progress and Trends in Ink-jet Printing Technology”, Journal of Imaging Science and Technology, volume 42, Number 1, Janurary/Feburary 1998 Vince Cabill, “Introduction to Digital Printing Technology”: http://www.techexchange.com/thelibrary/tchnlgy.pdf [March 7 2005] “HP Business Inkjet 2800 Printer Series, Technical Specifications”, Hewlett-Packard Development Company [August 2005] “Piezoelectric Process”, PDS Consulting: http://www.pdsconsulting.co.uk/Images/Process/Piezelectric%20Process.jpg [May 8, 2006]. David B. Wallace, Donald J. Hayes and Christopher J. Fredrickson, "Ink-Jet Based Fluid Microdispensing for High Throughput Drug Discovery," March 2008, http://www.microfab.com/about/papers/chibook/chi_book.htm Inkjet Workshop, “Tutorials – Definitions,” March 2008, http://www.inkjetworkshop.com/definitions.html Stephen D. Senturia, Microsystem Design. New York: Springer, 2001. Eldurkar V. Bhaskar and Marzio A. Leban, “Integrated Thermal Ink Jet Printhead and Method of Manufacture” US Patent 4847630, July 11, 1989 C. S. Chan and Robert R. Hay, “Barrier Layer and Orifice Plate for Thermal Ink Jet Printhead Assembly” US Patent 4694308, September 15, 1987 Richard A. Murray, “Printer Ink Cartridge with Drive Logic Integrated Circuit” US Patent 5646660, July 8, 1997 Questions?