Transcript Temperature Sensor Array Using flexible Substrate

Temperature Sensor Array Using
flexible Substrate
9533701 陳俊廷
Outline
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Abstract
Introduction
Design
Fabrication
Results
Conclusions
Abstract
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Temperature sensor array based on MEMS
technology
Temperature sensor array is composed of 256(16×16)
sensors inside a 28×20mm2 area
Polyimide (PI) thin film (35μm) with a copper layer
(40μm) on one side as the starting material
Doubled-sided fabrication process is applied to
create the sensing elements and interconnects for
scanning circuitry
Measuring the resistance of each element in the
temperature sensing array
Introduction
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Research on artificial skin for robots has been
popular, that should be highly arrayed in a requested
area on a flexible substrate
Higher density on a flexible copper-polyimide
substrate
Temperature sensing element is a platinum resistor
The temperature variation is detected by measuring
the resistance change of the resistor due to
temperature variation
Design
Design
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The resistance is proportional to length and
inversely proportional to cross-sectional area
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L
A
The platinum layer is designed to be long and
narrow；the copper is relatively wide, in order to
ensure that the resistance change is caused by
the meandering platinum patterns
Copper layer was designed to be 10 times larger
than platinum
The resistivity is 10.6μΩ-cm for platinum and
1.68μΩ-cm for copper
Design
 pt L pt Wcu H cu
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 cu  cu Lcu W pt H pt
 pt
Fabrication
Fabrication
Results
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A thermocouple is used for
measuring the accurate
ambient temperature
R(T )  R(T0 )(1   (T  T0 ))
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α is the TCR of platinum
T0 is the ambient
temperature
Conclusions
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A 16×16 temperature sensor array in a 28×20mm2
area is fabricated on a flexible copper-PI substrate
using MEMS fabrication technology
The dimensions of the copper and the platinum
patterns are carefully designed to ensure the
temperature dependent resistance of the copper
layer is negligible during the temperature
measurement