Transcript themis_080404

Preamplifier Integration in 3D PLUS Technology
• Preamplifiers in 3D Technology
• EM manufacturing
• Part list and component Lot Acceptance Tests
• FM manufacturing
• Schedule
THEMIS SCM CDR
MC VASSAL - 3D PLUS
CETP 04/08/2003
1
Preamplifier
Design & Characteristics
The Amplifier module
Electrical characteristics:
• 77 dB Gain
• Bandwidth 0.2mHz to 6 KHz
• low noise
• Feedback
Mechanical characteristics:
• 2 amplification levels
• 3 radiation shielding levels
• PGA
Dimensions: 20 x 20 x 15 (mm)
Weight : 15 g
Amplifier Module Layout
THEMIS SCM CDR
MC VASSAL - 3D PLUS
CETP 04/08/2003
2
Preamplifier
Design & Characteristics
The Regulator module
Electrical characteristics:
• Input : +/- 10V
• Output : + 7.6 V, -6.6V
• Resistor network for Calibration
Mechanical characteristics:
• 1 power supply regulator layer
• 1 calibration layer
• 2 radiation shielding layers
• PGA
Dimensions: 20 x 20 x 14 (mm)
Weight : 12 g
Regulator Module Layout
THEMIS SCM CDR
MC VASSAL - 3D PLUS
CETP 04/08/2003
3
Engineering Models
EM flowchart
For the THEMIS mission, 3D PLUS had to manufacture :
•
•
1 Regulator Engineering Model
3 Amplifier Engineering Models
The EM manufacturing is finished, the 4 modules were delivered to CETP in March
Main steps of EM manufacturing are :
Steps
1
Flex assembly
2
Flex electrical test at Tamb (R&R)
3
Precap visual inspection of flex before stacking
4
Module manufacturing
5
Module electrical test at Tamb (R&R)
6
Module screening
7
Varnishing
THEMIS SCM CDR
MC VASSAL - 3D PLUS
-> by 3D PLUS
CETP 04/08/2003
4
Engineering Models
Flex Assembly & Test
Flex assembly
Power supply level
Test procedure : Ref. THEPA_QUAL_11 written by CETP
Tests took place at 3D PLUS with CETP support
Flex types
Test
Comments
Steps
Functional
• 1st amplifier level
• 2nd amplifier level
• Power supply regulator
• input of calibration
•Continuity / Static / Dynamic
•Continuity / Static / Dynamic
•Continuity / Static
•Continuity
• With bare die & adjustment
• With bare die
• With bare die
• Without bare die
• 3 Adjustment, before and after GT
• 2 Before and after GlobTop*
• 2 Before and after GlobTop*
•1
Connectic
Visual inspection
1
Shielding
Continuity
1
* The Glob Top consists in covering wire bonding with resin to protect them.
All tests are recorded in 3D PLUS data base (date, nb of parts, kind of test, operator, part FAIL or PASS…)
THEMIS SCM CDR
MC VASSAL - 3D PLUS
CETP 04/08/2003
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Engineering Models
Manufacturing & Test
Module manufacturing according to PID
Test procedure : Ref. THEPA_QUAL_13 written by CETP
Tests took place at 3D PLUS with CETP support
Module screening :
• Stabilization bake, 72 hrs at +125°C
• 10 Thermal cycles –55°C / +125°C
• Electrical test at 3 temperatures : - 40°C, Tamb, + 65°C
• Final visual inspection with dimensional measurement
The test board is placed in an oven for temperature tests
THEMIS SCM CDR
MC VASSAL - 3D PLUS
CETP 04/08/2003
6
Engineering Models
Conclusion

The EM modules are compliant with specification (mechanically & electrically)
Amplifier EM - Gain (dB) - SN 1
Amplifier EM - Phase (deg) - SN 1
200
160
120
80
Gain (dB)
Phase (deg)
70
40
0
-40
-80
-120
-160
50
0.1
1
10
100
1000
10000

100000
-2000.1
1
10
100
1000
10000
Frequency (Hz)
Frequency (Hz)
The EM manufacturing allowed us :
• To validate the design
• To validate the tools
• To finalise the test procedures
THEMIS SCM CDR
MC VASSAL - 3D PLUS
CETP 04/08/2003
7
100000
FM Part List
Description
30 references
Passives
Type
Origin
package
Quantity
Resistor
CHP0505
Vishay
SMC 0505
11 references
Resistor networks
RMK33N
Vishay
Bare dies
10 references
CEC2
Eurofarad
SMC 0805
6 references
CNC7
Eurofarad
SMC 2220
1 reference
VJ0805
Vishay
SMC 0805
1 reference
TAJB
Vishay
Type E
1 reference
Ampli Op
LM108A
NSC
Bare die
1 reference
NPN Tansistor
2N2222A
Motorola
Bare die
1 reference
PNP Transistor
2N2907A
Motorola
Bare die
1 reference
1N4100
MSC
Bare die
1 reference
Dual JFET U404
U404
Siliconix
Bare die
1 reference
Dual JFET U422
U422
Siliconix
Bare die
1 reference
Current regulator diode
CR047
Siliconix
Bare die
1 reference
Description
Origin
Quantity
1st Amplifier level
CICOREL
1 reference
2nd
CICOREL
1 reference
Power supply regulator
CICOREL
1 reference
Input of calibration
CICOREL
1 reference
Shielding levels
CICOREL
3 references
Connectic
CICOREL
CIBEL
2 references
Ceramic Capacitor
Tantalium Capacitor
7 references
9 references
Actives
Printed
Circuits
Zener diode
Amplifier level
Some components were procured by CETP and others by 3D PLUS according to 3D PLUS procedure ref: 3DPA0350.
THEMIS SCM CDR
MC VASSAL - 3D PLUS
CETP 04/08/2003
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FM Part List
Description
30 references
Passives
Type
Origin
package
Quantity
Last delivery
Resistor
CHP0505
Vishay
SMC 0505
11 references
02/05/2004
Resistor networks
RMK33N
Vishay
Bare dies
10 references
02/05/2004
CEC2
Eurofarad
SMC 0805
6 references
03/08/2004
CNC7
Eurofarad
SMC 2220
1 reference
01/14/2004
VJ0805
Vishay
SMC 0805
1 reference
CETP Stock
TAJB
Vishay
Type E
1 reference
CETP Stock
Ampli Op
LM108A
NSC
Bare die
1 reference
03/22/2004
NPN Tansistor
2N2222A
Motorola
Bare die
1 reference
12/15/2003
PNP Transistor
2N2907A
Motorola
Bare die
1 reference
12/15/2003
1N4100
MSC
Bare die
1 reference
12/15/2003
Dual JFET U404
U404
Siliconix
Bare die
1 reference
CETP Stock
Dual JFET U422
U422
Siliconix
Bare die
1 reference
CETP Stock
Current regulator diode
CR047
Siliconix
Bare die
1 reference
CETP Stock
Description
Origin
Quantity
Delivery date
1st Amplifier level
CICOREL
1 reference
01/15/2004
2nd
CICOREL
1 reference
01/15/2004
Power supply regulator
CICOREL
1 reference
01/21/2004
Input of calibration
CICOREL
1 reference
01/15/2004
Shielding levels
CICOREL
3 references
01/26/2004
Connectic
CICOREL
CIBEL
2 references
01/21/2004
Ceramic Capacitor
Tantalium Capacitor
7 references
9 references
Actives
Printed
Circuits
THEMIS SCM CDR
Zener diode
Amplifier level
MC VASSAL - 3D PLUS
The first lot,
received in
December was
rejected at
visual
inspection
Components used in EM modules
will be also used in FM modules, at
the exception of 3 references:
LM108A, 1 resistor and 1 capacitor.
CETP 04/08/2003
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Lot Acceptance Test
For all components the following tests are performed :
•
•
•
Visual Inspection
Solderability test, Lead Integrity and Lead Finish Adhesion
Lot Acceptance Test

Electrical test at Tamb

1000hrs life test at 125°C (under polarization)

Electrical tests at –55°C, Tamb, +125°C

Drift calculation at Tamb
LAT are performed in partnership with LCIE, according to 3D PLUS Procedure 3DPA0350-4
LAT report : 3300-1085-1
Component type
Nbr of parts
U422
Bare die*
CMS
tests at
Status
Results
Comments
20 parts + 2 ref.
Closed
20 PASS, 0 FAIL
Lot accepted
U404
CR047
2N2222A
20 parts + 2 ref.
20 parts + 2 ref.
20 parts + 2 ref.
Closed
Closed
Closed
20 PASS, 0 FAIL
20 PASS, 0 FAIL
19 PASS, 1 FAIL
Lot accepted
Lot accepted
Lot accepted**
2N2907A
1N4100
LM108A
20 parts + 2 ref.
20 parts + 2 ref.
20 parts + 2 ref.
Closed
Closed
Open
20 PASS, 0 FAIL
20 PASS, 0 FAIL
-
Lot accepted
Lot accepted
Tests 1000 hrs: 05/19/04
10 Resistor network 10 parts + 1 ref.
Open
-
21 Resistors &
Capacitors
Open
-
T0,
240 hrs,
1000 hrs
T0, 500 hrs,
1000 hrs
T0, 500 hrs,
10 parts + 1 ref.
1000 hrs
Tests 500 hrs: 05/14/04
Tests 1000 hrs: 06/19/04
* Bare die are mounted in a TO39 package to facilitate tests
** 1 Fail after 240 hrs. The procedure 3DPA0350 (based on standard ESCC-Q-60-05) authorized 1FAIL for 20 parts
THEMIS SCM CDR
MC VASSAL - 3D PLUS
CETP 04/08/2003
10
FM manufacturing
For the THEMIS mission, 3D PLUS has to manufacture :
•
•
7 Regulator Flight Models
19 Amplifier Flight Models
(5 FM, 1 spares, 1 LAT)
(15 FM, 3 spares, 1 LAT)
Steps
1
Flex assembly
2
Flex electrical test at Tamb (GoNoGo)
3
Precap visual inspection of flex before stacking
4
Module manufacturing
5
Module electrical test at Tamb (GoNoGo)
6
Module screening
• Stabilization bake 72 hrs at +125°C
• Thermal cycles (x10) –55°C / +125°C
• Electrical test at Tamb before burn-in with R&R
• Burn-in 168 hrs at +125 °C
• Electrical test at 3 temperatures after Burn-in
• Parameters drift calculation at Tamb & P.D.A. Calculation
• Final visual inspection with dimensional measurement (3 modules)
7
Varnishing
8
Module Lot Acceptance Test
9
Material review
10
End Item Data Package
THEMIS SCM CDR
MC VASSAL - 3D PLUS
CETP 04/08/2003
11
FM Schedule
The key dates during FM manufacturing are :
Flex
Assembly & Tests
Pre Cap
Inspection
Module
Assembly & Tests
Screening
LAT module
To : 04/05/04
THEMIS SCM CDR
Week 21
MC VASSAL - 3D PLUS
End of June
07/23/04
09/30/04
FM delivery
to CETP
EIDP
CETP 04/08/2003
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