Transcript Presentation Slides

ECE 300 Microprocessor
Project
MSP 430
Group Members
Demetric Banahene
David Fish
Zack Pannell
Objectives
The purpose of this project is multi-fold.
To learn to interpret a printed circuit board
layout.
To learn some basic skills of making ultra-fine
solder connections.
To link files to form a project and compile and
link the programs of the project.
To learn the basics of using the debugging tool,
C-Spy, of the IAR Software to program the board
To select a proper temperature sensor.
Board Components - Chip
The first component that was soldered
onto the board was the MSP430
Microprocessor Chip using the provided
Microscope.
This was done by aligning the chip with
the circuit traces and keeping it stable with
a tiny bit of flux.
There were 100 solder connections which
proved to be difficult at first.
Board Components-LCD Display
The LCD Display had 40 pins to solder.
It was hard to line up the pins to fit in the
slots on the board.
The holes on the board sucked the solder
down into board.
Board Components – Resistor and
Capacitors
These components
were placed on the
board and held in
place by a small
amount of flux.
They were then
soldered down.
C1
C2
C3
C4
C5
C6
C9
C10
R5
0.1 uf
0.1 uf
10 uf (polarized)
0.1 uf
0.1 uf
10 uf (polarized)
1.0 uf
0.1 uf
47 kohms
Board Components- Other parts
The components were placed on the
board in the following order: Push button
switch, voltage regulator, 5 volt input plus,
slider switch, JTAG connector, and finally
the 32.7 kHz crystal.
These parts were soldered onto the board.
Board Components – Banana
Jacks and Stand Offs
Holes were drilled into the board to make
room for the two banana jacks and four
stand offs.
The parts were then screwed in through
the holes.
Programming the Chip
The software given in the kit was installed.
The files provided by Dr. Green, lcd.c,
lcd.h, delay.c, delay.h, demo.c, sensor.c,
were placed in a designated project folder.
The MSP430 Flash emulation tool was
connected to the board and the computer.
A new project was created and the
procedure in the project manual was
followed.
Temperature Sensor
The AD590LH was selected.
Specifications:
Output Type:
Analog
Sensor Output:
+1 µA/°K
Supply Voltage Range: +4V to +30V
Temp Range(s):
-55 to +150
AD590 Pin Diagram
Temperature Sensor
The temperature sensor circuit was built using
the following:
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AD590LH temperature sensor
1000 ohm potentiometer
100 ohm potentiometer
1000 ohm resistor
LM741 Op Amp
10,000 ohm resistor
1800 ohm resistor
2 9-Volt Batteries
Calibrating the Sensor
The 100 ohm potentiometer was adjusted
until the output was (273 + °C) mV
The 1000 ohm potentiometer was adjusted
until the circuit produced a gain of 5.
Programming the Board
The files lcd.c, delay.c, sensor.c were
compiled and flashed to the board.
The banana jacks were connected from
the sensor to the board.
The temperature was then displayed on
the LCD screen in both Fahrenheit and
Celsius.
Temperature Sensor
Temperature Settling
40
35
Temperature (Deg C)
The temperature
sensor took
approximately 8
cycles (40 seconds)
to settle to the correct
temperature.
This can be seen in
the graph to the right.
30
25
20
15
10
5
0
0
20
40
60
80
Time (s)
100
120
140
What we learned
How to solder
How to use a microscope to make ultrafine solder connections
Circuit troubleshooting
How to use the IAR Systems tools
Patience
A basic understanding, at a first level, on
how several aspects of engineering are
brought together to form a useful system
The Completed Board and Sensor