Transcript Microprocessor Project

ECE 300 Microprocessor
Project
Using The
Texas Instruments
MSP 430F449PZ Controller
Group members:
William Bohon
Steve Bishop
Ann Tan
Marve Morrow
Project Overview
1.
2.
3.
4.
Project Assignment
Parts Gathering
First Group Meeting - Soldering
Practice
Board Construction:


MSP430F449PZ Chip
Capacitors and Resistors
Project Overview



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
5.
6.
7.
8.
JTAG
More Components
LCD Display
Standoffs
Banana Jacks and Wires
Programming the chip
Troubleshooting
Temperature Sensor
Completed Board
Project Assignment



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Students were assigned into groups and group
leaders were selected.
The details of the project were explained to
group leaders after the lecture in which it was
assigned.
Project equipment, including microscope and
soldering equipment, were given to each group
for a limited amount of time.
Group leaders contacted their team and
explained the project.
Parts Gathering
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
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Parts were bought from the ECE parts
store in Ferris Hall for $15.
MSP 430F449PZ samples were ordered
online from Texas Instrument.
The most suitable sensor for the project
was researched.
Samples of sensors were ordered online
through the website:
http://www.analog.com
Soldering Practice


Group members practiced soldering on a
provided practice board with the extra
MSP430 chip during the first group
meeting.
A couple of capacitors were also used for
practice.
Board Construction –
MSP430 chip
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
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The MSP430F449PZ chip was soldered first
because it had the finest connections, and
having other devices get in the way of its
installation would have been difficult.
Flux was applied to the pin connection points,
and the chip was carefully aligned with these
pins using a microscope as aid.
Pins were first soldered at the corners for two
reasons:


1. To secure the aligned chip.
2. To stop excess heat from damaging the chip.
Board Construction –
Capacitors and Resistors
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
The 47k resistor was placed at R5.
The non-polarized capacitors were installed to
the following positions with the following
capacitance:
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C1 with 0.1 μF
C2 with 0.1 μF
C4 with 0.1 μF
C5 with 0.1 μF
C9 with 1.0 μF
C10 with 0.1 μF
Board Construction –
Capacitors and Resistors

The polarized capacitors were placed in C3
and C6, both having 10 μF capacitance.
The Polarized capacitors were installed after
the JTAG connection was installed because
this allowed power to run through the board.
With the power, polarity could be found with a
voltmeter.
 The positive end was connected to the side of
the capacitor with a dark stripe.

Board Construction – JTAG


The JTAG was installed by soldering the
pins on the back side of the board.
A microscope was used to avoid soldering
a connection between the pins and
ground.
Board Construction –
More Components

Other components were soldered to the
board:
 Power switch
 Voltage Regulator
 Five Volt Input Plus
 Slider Switch
 Time Crystal
Board Construction –
LCD Display
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
Similar to the JTAG connector, this was
soldered on the back side of the board
with care to avoid shorting pins with the
ground.
This was one of the last components
installed because the screen is fragile.
Board Construction –
Standoffs
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
The standoffs were installed into each
corner.
This protects the back side of the board
from being damaged by keeping the board
off its supporting surface.
Board Construction –
Banana Jacks

The banana jacks were drilled into the top
right part of the board.
The red one was connected to Ja6, which
goes to an analog data pin of the MSP430
chip.
 The black one was connected to ground at
Z3. Z3 was determined as ground by
observing the lack of buffering between the
port hole and the black ground on the back
side of the board.

Board Construction –
Wiring
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
Wires were used to connect the banana
jacks to their ports
There was also a wire that grounded the
resistors at C1, C2, and C3 to the port
hole Z5.
Programming the Chip
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The files lcd.c, lcd.h, delay.c, delay.h, demo.c,
sensor.c. were copied to a computer directory
from the ECE 300 website.
The 27–pin cable connector of the FET (Flash
Emulation Kit) was connected to the parallel port
of a computer, and the 14-pin connector was
connected to the JTAG port in order to program
the chip.
Procedures shown in the manual were followed.
Troubleshooting

Our demo test message “888808888” revealed that
some of our LCD pixels were not showing up. The steps
below were done for troubleshooting:
 Connections of the LCD on the board , and the
MSP430 on the board were checked.
 The cause was identified when the dead pixels lit up
when pressure was applied to the pin connections on
the right side of the MSP430 chip.
 The problem was solved by re-soldering some
connections to these loose pin connections.
Temperature Sensor
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The AD22103KT from Analog Devices.

This temperature sensor has three pins, as
shown:
Temperature Sensor

The sensor was hooked up in the following
manner:
Vo to the red banana jack (port Ja6)
 Vs to TP3 VCC (determined to be a 2.85 V source)
 GND to the black banana jack (Port Z3)


An additional wire was soldered to port TP3
VCC for the Vs connection.
Temperature Sensor

The formula for “sample” in sensor.c had to be
modified in order to correctly output temperature.
 It initially output voltage.
 Using the formula below from the data sheet, the
equation was found to be:
 TA = (41.35 * Vout – 8.929) degrees C

Where Vs is 2.85 V, and Vout was the previous
formula in sensor.c.
Temperature Sensor
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
TA = (41.35 * Vout – 8.929) degrees C
In the actual formula written to sensor.c,
8.929 is multiplied by 100 because the
program shifts the decimal place to the left by
two. This was not needed in multiplying Vout
because it was already adjusted for the
shifting.
The Completed Board