Transcript Atomic structure and bonding

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Enter
Mechanical
phenomena
The model of Drude
Electrical conduction
Electrical phenomena
Thermal
expansion
Diffusion and
oxidation
Crystalline structure. X-rays.
Amorphous and glassy materials.
Manufacturing of materials.
Solid solutions.
Atomic structure
and bonding
Types of solids
Thermal
conduction
and heat transfer
Kinetic
molecular theory
Atomic structure and bonding. Types of solids
1. Atomic structure. Electronic shells. Quantum numbers.
2. Atomic bonding. Energy diagram.
3. Covalent, ionic, metallic and Van-der-Vaals bonding.
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Crystalline structure. X-rays. Manufacturing.
Amorphous and glassy materials. Solid solutions.
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The Crystalline State. Types of crystals. Unit cell. Packing factor.
Miller indices.
Atomic planes and planar concentration.
X-ray Diffraction. Electromagnetic waves. Wavelengths of X-rays.
Interference. Bragg's law.
Scheme of diffractometer. Selection rules.
Crystalline Defects. Point defects: vacancies, impurities.
Point defects in ionic crystals: Schottky and Frenkel defects. Ionized impurities.
Line defects. Edge and screw dislocations.
Planar defects. Grain boundaries.
Crystal surfaces. Surface reconstruction. Types of surface imperfections.
Stoichiometry.
Allotropy. Three phases of carbon.
Single-Crystal Czochralski Growth
Glasses and Amorphous Semiconductors. a-Si and a-Si:H. Structure,
manufacturing, applications.
16. Solid Solutions and Two-Phase Solids. Phase diagram of isomorphous alloy. Lever
rule.
17. Zone refining and silicon purification.
18. Binary eutectic phase diagrams. Pb-Sn solders.
Kinetic theory
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1. Kinetic Molecular Theory. Ideal gas. Mean velocity. Avogadro's number. Mole.
Boltzmann's and gas constants. Absolute temperature.
2. Degrees of freedom Maxwell's principle of equipartition of energy.
3. Distribution of Molecular Velocities. Energy Distribution. Stern experiment.
Boltzmann factor and distribution.
4. Heat, Thermal Fluctuations and Noise. RMS voltage. Johnson resistor noise.
Electrical conduction
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The Drude Model of Electrical Conduction. Scattering. Drift mobility.
Temperature Dependence of Resistivity. Scattering on phonons.
Matthiessen's Rule. Scattering on impurities.
The electrical conduction in thin films. Scattering on surface.
Electrical Conductivity of Non-metals. Electrons and holes in
semiconductors. Activation energy of conductivity.
Electrical Conductivity of Non-metals. Ionic conductivity. Activation energy of
conductivity.
The Hall Effect. Lorentz force. Hall effect in metals.
Hall effect in semiconductors. Hall Devices.
Skin Effect: HF resistance of a Conductor
Nordheim’s rule
Mixture rules
Mechanical phenomena
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1. Stress and Strain (engineering and true).
2. Elastic Moduli (Young's modulus, Poisson's ratio, shear modulus, bulk modulus). Units.
Typical values.
3. Tensile expeiment. Samples and tensile test machine.
4. Stress-Strain Characteristics. Elastic and plastic deformations. Necking. Fracture.
Stress and strain at fracture.
5. Yield and tensile strengths. Typical values.
6. Brittle and Ductile Materials. Ductility
7. Elastic and Plastic Work. Resilience and Toughness.
8. Plastic Deformation in Metals. Glide of edge and screw dislocations.
9. Crystal slip. Slip line, slip directions and slip plane. Burgers vector. Crytical shear
stress.
10. Interaction of dislocations. Pinning of dislocations by impurities and grain boundaries.
11. Structure of polycrystalline material after plastic defomation.
12. Cold Work. Typical operations of metal forming or shaping.
13. Phenomenon of recrystallization. Temperature dependence of recrystallization rate.
14. Mechanical strengthening mechanisms.
15. Hardness. Tests of hardness. Connection with strength.
16. Cracks. Stress concentration.
17. Crytical stress.Crack Propagation. Griffith's Theory of Brittle Fracture.
18. Ductile Fracture.
19. Fatigue. Endurance limit.
20. Creep. Creep regions (primary, secondary and tertiary). Influence of temperature and
stress value on creep rate.
21. Impact Energy and Toughness. Test of impact energy. Impact energy and temperature.
Thermal expansion
1. Thermal expansion and atomic bonding
2. Grüneisen's law
3. Temperature dependence of thermal expansion coefficient.
Debye temperature.
4. Thermal stress and strain.
5. Differential thermal expansion
6. Thermal fatigue and failure
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Diffusion and oxidation
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Diffusion coefficient. Activation energy.
Diffusion in bulk, on surface and along grain boundaries.
Fick's first law
Fick's second law
Diffusion from unlimited and limited supplies. Error function. Gaussian
distribution.
6. Diffusion doping of semiconductors
7. The growth of silicon dioxide: dry and wet oxidation. Factors changing the
growth rate.
8. Initial linear and parabolic growth
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Thermal conduction and heat transfer
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The heat. Fourier's law of thermal conduction. Thermal conductivity
Mechanisms of effective thermal conduction
Parabolic heat equation
Analogy between thermal and electrical phenomena. Equivalent circuits.
Transitional thermal processes
Power derating
Heat transfer by radiation. Stefan's law. Emissivity.
Heat transfer by convection. Newton's law. Thermal boundary layer.
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