Transcript Ch11The ABCs of ESD EOS and SOA

Bridging Theory in Practice
Transferring Technical Knowledge
to Practical Applications
The ABC’s of ESD,
EOS, and SOA
The ABC’s of ESD, EOS, and SOA
The ABC’s of ESD, EOS, and SOA
Intended Audience:
• Electrical engineers with a knowledge of simple electrical circuits
• An understanding of MOSFET devices
Topics Covered:
• What is Electrostatic Discharge (ESD)
• What is Electrical Over Stress (EOS)
• What is Safe Operating Area (SOA)
Expected Time:
• Approximately 90 minutes
The ABC’s of ESD, EOS, and SOA
• What is ESD
– Where does ESD come from
– MOSFET Gate susceptibility
– Test Standards
– Component level vs. module level tests
• What is EOS
• What is SOA
Electrostatic Discharge (ESD)
• We are all familiar with a common form of electrostatic discharge (ESD):
Shaggy Carpet
• ESD is the sudden transfer of electrostatic charge between objects at
different electrostatic potentials
Where Does ESD Come From
• Triboelectric Charging
– Mechanical Contact and Separation
– “Walking on carpet”
 Direct Charging
– Mobile Charge Transfer
– “Plugging in a cable” (e.g. USB to PC)
 Ionic Charging
– Not properly balanced Air Ionizer can charge an object (instead of intended operation
to neutralize/balance charge)
–Charged object comes into contact with a grounded object (such as machine pick-up
probe or grounded human operator)
–This is example of charged device model (CDM) event—more to come!!!
Where Does ESD Come From?
• Which levels can occur?
– Below 3-4kV you see, hear or feel nothing!
– Just above 4kV, air-gap-sparks can occur
– 1mm == 1kV (5mm spark ~ 5kV)
 Why does a 2kV protected device survive the real world?
– You are charged relatively to earth, not to “pin7”
– You do not have 4kV between your thumb and your index finger
• Influence of Air Humidity
– Higher relative air
humidity does cause a
“moisture” film on
surfaces
– Charge is more
distributed, lower voltages
thus occur
– But dry air does not have
a higher inherent
“resistance”
ESD Voltage (kV)
Where Does ESD Come From?
office room (winter) without
air humidity regulation
16
15
14
13
12
11
10
9
8
synthetic
7
6
5
4
wool
3
2
anti-static
1
5
10
20
15%
30 40
35%
50
60
70
80
90 100
% Relative Air Humidity
MOSFET Gate Susceptibility
Source
Often, the
source is
grounded
Gate
Drain
Insulating
SiO2 Gate
SiO2
n
n
p-type
Charge Is Applied to the
MOSFET Gate
Source
Gate
But, the
Drain
charge is
stuck on gate due
to insulating SiO2
SiO2
Cgs
n
n
p-type
A Quick Review of
Voltage and Capacitance
Voltage
• Think of voltage as an amount of
possible electrical work
• A high voltage means additional
electrical work is possible
• If the voltage is improperly directed or
used, unintended
(and potentially
harmful) work will be performed
+12V
Ground
Battery
A Quick Review of
Voltage and Capacitance
• Variables and Constants:
C  Capacitance
Q  Charge
V  Voltage
0 ox  Permittivity of Silicon Dioxide
A  Area of Capacitor Plates
d  Distance Between Conductors
• Two Basic Equations:
C
Q
V
C

0 ox A
d
• Rearranging yields:
Q
Q
V 
C 0ox A
d
Qd

0ox A
Quick Review Summary:
Qd
V 
0ox A
0 ox
•
is a constant for a given material (SiO2)
• As the charge (Q) on the capacitor increases the voltage across the capacitor increases….
Gate Charge Induces a
Gate Voltage
Source
VGATE
SiO2
n
Gate
QGATE d

0ox A
Drain
VGATE  100V
POP
n
p-type
Induced Gate Voltage
Creates a Hole in the SiO2
Source
Gate
Drain
SiO2
n
n
Allowable E-field
within SiO2 exceeded
p-type
Induced Gate Voltage Creates a
Hole in the SiO2
Source
Gate
Gate-Source
Short
MOSFET
cannot
turn on
Drain
SiO2
n
n
p-type
Gate susceptibility summary:
Qd
V 
0ox A
• As the charge (Q) on the capacitor increases the voltage across the capacitor increases….
• If the transistor decreases in size the thickness of the SiO2 gate (d) decreases but, the area (A) of the gate decreases faster • For the same amount of charge, the voltage across the capacitor is higher for a
smaller transistor
• More advanced technologies may require additional ESD precautions
Induced Voltage for 3m and
1.2m CMOS Processes
• 3m Process (Minimum Size Transistor)
–
–
–
–
tox
L
W
Q
= 400 Å = 4x10-8 m
= 3m
1.16 x1011C  4.0 x108 m 

V
 1.5kV
12
6
6
= 3m
 3.9  8.85x10 F / m 3.0x10 m 3.0 x10 m 
= 1.16x10-11 C
• 1.2m Process (Minimum Size Transistor)
–
–
–
–
tox
L
W
Q
= 200 Å = 2x10-8 m
1.16 x1011C  2.0 x108 m 

= 1.2m
V
 4.7kV
12
6
6
 3.9 8.85x10 F / m 1.2x10 m 1.2x10 m 
= 1.2m
= 1.16x10-11 C
Note: 0OX  (3.9)(8.85x10-12 F/m)
ESD Standards & Test: Overview
• ESD Standards & Tests should simulate “real world” events as realistic as
possible
• There is no “single/one size fits all” ESD Test available 
Different handling/mounting conditions have resulted in different ESD
tests
– e.g. car-manufacturers follow different ESD standards than componentsuppliers: both are talking about ESD but not about the same applied ESDstandards
 Be careful to know complete standard definition
– “ESD 2kV”, “2kV HBM”,… does not mean much: The Standard is
missing
 e.g
JEDEC22-A114; MIL-STD-883, Method 3015.7, ……(more complete)
ESD Standards & Tests: Overview
• A “Standard” consists of …
– … a used MODEL
(HBM, MM, …)
– … VALUES for the elements used in the model
(R=1500 Ohm, C=100pF)
– … plus TEST PROCEDURE: how to apply the standard
(e.g. 3 pulses)
Standard = Model + Values + Procedure
 Therefore Standards can differ in each subset, in the
– MODEL
– VALUES
– TEST PROCEDURE
 “HBM 2kV” is not specific – “2kV JEDEC22-A114” is better defined
ESD Models: Human Body Model
R
• Human Body Model (HBM) consists
of a Capacitor and a series Resistor
• Values are defined in the specific
standard
– Commonly used: C =100pf, R=1500
Ohm (JEDEC, Mil, etc.)
• Test Procedure is defined in the
specific standard
– Commonly used: 1 to 3 pulses, both
polarities, 3 devices/voltage level
Commonly used for component tests
C
Model
HBM Standards
(R=1500 Ohm, C=100 pF)
• JEDEC JESD 22-A114 [2]
• Military Standard Mil.883 3015.7 [3]
• ANSI/ESD STM5.1 [4]
• IEC 61340-3-1
“Human ESD Model”
(R=2000 Ohm, C=150 pF – 330 pF)
• ISO/TR 10605 [5]
“Human Body Representative”
(R=330 Ohm, C=150 pF)
• IEC 61000-4-2 [6]
ESD Models: Human Body Model 
Waveform
1kV
• HBM Jedec22-A1114
Waveform:
– 10ns rise time typically (short)
• 2-10ns are allowed
– Peak current:
• Rule of Thumb:
– 1kV = 2/3 Ampere
Vesd
Ipeak 
1500 [ W]
VESD (V)
1000
Ipeak - Ipeak+10%
(A)
0.67 – 0.74
ESD Models: Machine Model
• Machine Model (MM) consists of a
Capacitor and no series Resistor
• Values are defined in the specific
standard
C
– Commonly used: C =200pF,
• Test Procedure is defined in the specific
standard
Model
– Commonly used: 1 to 3 pulses, both
polarities, 3 devices/level
Some definitions use MM
“standard” with a 25 Ohm series
resistor, which at least doubles
the achievable ESD Level!
MM Standards
(C=200 pf)
• JEDEC JESD 22-A115 [11]
• ANSI/ESD STM5.2
“Philips Standard”
(C=200 pF, R=10-25 Ohm, L=0.75-2.5µH)
• Standard??
ESD Models: Machine Model
• MM stress is similar to
HBM
– Oscillations due to setup
parasitics
• MM and HBM failure
modes are similar
Source: T. Brodbeck; Models.pdf
• Less reproducible than
HBM
VESD (kV)
0.1
0.2
Ipeak - Ipeak+30%
(A)
1.5 - 2.0
2.8 - 3.8
Charged Device Model Test
• Models an ESD event which occurs when a device acquires
electrostatic charge and then touches a grounded object
Device
Device placed
discharges
in dead-bug
through ground probe
position
Dielectric
Field Plate
High Voltage Source
CDM Waveform: Highly dependent on
die size and package capacitance
500V with 4pF verification module
tr<400psec / Ip1~4.5A / Ip2<0.5Ip1 / Ip3<0.25Ip1
Source: AEC-Q100-011B
AEC-Q100
• Automotive Electronic Council (AEC) Stress
Test Qualification “100”: AEC Q100 – xxx
AEC is not a single standard but a collection of requirements for automotive suppliers
 AEC Q100 validated suppliers have to fulfill the ESD regarding
qualification described in it
– AEC Q100-002: HBM (JEDEC) 2000V OR AEC Q100-003: MM
(JEDEC) 200V
AND
– AEC Q100-011: CDM (JEDEC)
 Corner Pins 750V
/ Non-corner pins 500V
Component vs. Module level tests
• ESD (pulses) testing originates from a subset of the wide field of EMC
(Electromagnetic Compatibility, EMI … Immunity)
• Due to the importance in the Semiconductor Industry, ESD testing has
evolved into its own field of specialization
 The ESD/EMC world in general can be divided into two mainfields:
(Powered) Systems
(Unpowered) Components
ESD Standards & Tests:
System vs. Component
Goal: UNDISTURBED functionality
during and after ESD stress
under powered / functional
conditions
Goal: UNDESTROYED
components after ESD stress:
All specification-parameters
should stay within its limits
ESD is a part of EMC qualification
Different “behavior criteria” in response to
ESD on system level exists (class A to D)
ESD is a part of product qualification
“Pass”/”fail” criteria
 Just dedicated pin combinations
feasible
 I/O vs. GND
 All pin combinations can occur
and are tested
 The reference/enemy is always earth
potential
 Relative measure of robustness of
end product during operation
 Relative measure of robustness
during handling/manufacturing
ESD Test methods (Models)
System
vs.
Component
Module/System Level
Human Body Model
(HBM)
150pF / 330 W
EN 61000-4-2
(so called “GUN Test”)
Human Body Model (HBM)
150pF / 2000 W
ISO 10605
Human Body Model (HBM)
330pF / 2000 W
ISO 10605
Component Level
Human Body Model (HBM)
100pF / 1500 W
JEDEC-Norm JESD22-A114-B
(MIL-STD883D, method 3015)
Machine Model (MM)
200pF / 0 W
JEDEC-Norm JESD22-A115-A
(correlates to HBM)
Charged Device Model (CDM)
Package pF / 0 W
JEDEC-Norm JESD22-C101-A
ESD Models: Human Body Model 
Component Test
• A “Pin-to-Pin” ESD Tester
(like HBM, MM Testers)
consists of the HV source and
the model with its values,
connected to two “Terminals”
R
HV
Terminal A
C
Terminal B
• The Terminals are not changed
for polarity reversal …
 The capacitance is charged
one time positively and one
time negatively
 Tester-Ground along with
parasitics stay constant
ESD Models: Human Body Model 
Component Test
• 2 different Pin-Combination-Types are tested
– Supply-Pin-Tests
• All Pins (individually one at a time) at Terminal A vs. Supply-X at
Terminal B
• Repeat for Supply-Y, Supply-Z, etc. at Terminal B
– Non-Supply-Pin-Test
• “All Non-Supplies (individually one at a time) at Terminal A vs. all
other non-supplies together at Terminal B”
• Repeat for each non-supply at Terminal A
• 1 positive and 1 negative pulse for each pin-combination
• Step-Stress, 500V, 1kV, 2kV and 4kV should be used; different
levels and steps can be defined
– A new set of 3 devices per level is used
ESD Product Qualification Test @ IFX according to
JEDEC EIA/JESD 22-A114-B [2] described in IFX
Procedure [1]
ESD Supply-Pin Test: HBM ESD Each pin
vs. Supply-1 (GND)
• ESD Test P1.1
– All pins vs. Supply 1 (in this
case GND)
– In this case:
• 10 different
combinations
• 1+ and 1- pulse for each
combination
•  20 pulses for each
voltage step
ESD Supply-Pin Test: HBM ESD Each pin
vs. Supply-2 (VBB)
• ESD Test P1.2
– All pins vs. Supply 2 (in
this case VBB)
– Then subsequently All
pins vs. Supply 3 (Vdd)
– In this case:
• 11 different
combinations
• 1+ and 1- pulse for each
combination
•  22 pulses for each
voltage step
ESD Non-Supply-Pin Test: HBM ESD Each nonsupply vs all other non-supply
• ESD Test P2
– Each non-supply vs. All
other non-supply
– One non-supply at a
time on Terminal A
– All other non-supplies
at Terminal B
– In this case:
• 8 different combinations
• 1+ and 1- pulse for each
combination
•  16 pulses for each
voltage step
ESD Standards & Test:
System-Level Test
• Direct Discharge: Test points
of normal accessibility.
– The Reference-’”Pin” at
System-Level test is “Earth”
and not a part of the DUT
• Indirect Discharge into
couple plate: Test for
radiated disturbance
immunity
HBM: System Level Tests applied to
components??
• Some Customers ask for systemlevel test at component level
– Component is not powered
– Only pins which are accessible to the
outside world are tested
– Reference pin(s) are the component
ground pin(s)
– Pass/Fail according to Component
test-program
– ESD current is 5x higher at a dedicated
voltage level compared to component
ESD tests
7.5A
ESD @ 2kV
Red: IEC (“GUN”)
Blue: JEDEC “HBM”
1.3A
1ns 10ns
Pulse Charge Comparison
Discharge generated Pulses (RC)
Ri
[Ohm]
C
[pF
]
Ipeak
[A]
Charge
Charge
relatively
to HBM,
JESD22114
Standard/Pulse
Vma
x [V]
Duratio
n
(1090%)
Component
"HBM" JESD 22-114
8000
150ns
1
1500
100
5.3
800nC
1
System
"GUN" IEC 61000-42
8000
120ns
10
330
150
33
1.2µC
1.5
System/Vehic
le
ISO/TR 10605 inside
8000
1µs
3
2000
330
30
2.64µC
3.3
System/Vehic
le
ISO/TR 10605
outside
8000
360ns
3
2000
150
30
1.2µC
1.5
-
10
20mC
25x10^3
Application
# of Pulses
Voltage generated Pulses
Vehicle
Vehicle
Vehicle
Vehicle
ISO 7637: 1
ISO 7637: 2
ISO 7637: 3a
ISO 7637: 3b
-100
100
150
150
2ms
5000
10
50µs
5000
10
-
10
0.5nC
6.25x10^4
100ns
1h
(3.6x10^6)
50
-
3
300nC
0.375
100ns
1h
(3.6x10^6)
• HBM
50
-
8kV 2is normalized
to “1”
200nC
0.25
HBM ESD
Gate Shorted to Source
Very small damage area due to low energy of ESD pulses, normally cannot be seen
with “naked eye”
HBM ESD
Gate Shorted to Source
This device had a G-S short and you can see the burn
mark is right at the boundary region of gate poly and source
metal which is common since this is the area of highest
E field strength
Gate contact metal
Gate Polysilicon
Source contact metal
Can ESD Sensitive Devices in an
Automobile Be Protected?
• Electrostatic discharge sensitive components
can be protected in an automobile
• Installation of spark gap topologies
• Establishing a predictable charge well
topology such as capacitors
Decrease ESD Sensitivity with a
Predictable Charge Well Topology
• Recall our earlier equation:
Qd
V 
0ox A
• Place a capacitor across the device/pin to be
protected
• The additional external capacitor sheds the
electrostatic discharge energy, reducing the voltage
at the pins of the semiconductor device
Decrease ESD Sensitivity with a
Predictable Charge Well Topology
IC
ESD generator
Protected
Pin
Cprotection
ESD current/charge
For most robust design, the voltage at this point should be lowered to be less than
internal ESD structure breakdown voltage so all current/energy is shed thru external
capacitor. Please note that there is no resistor between C_prot and IC so high
current/energy can flow into IC if internal ESD structure breaks down and begins to
conduct current
Decrease ESD Sensitivity with a
Predictable Charge Well Topology
• System level/gun tests ESD voltages may need to be 15,000V
(direct contact)
– Gun tests uses 330pf for source capacitor
• For automotive technologies having ESD structures with 4045V breakdown is common
C_prot = (C_gun / Vbr_ESD) * V_gun
= (330pF / 45V) * 15kV
= 110nF
Typical internal IC
ESD Protection Circuits
Ground Referenced Protection
VSupply Referenced Protection
External
Pin
Protected Circuit
VSupply
External Pin
Protected Circuit
IC
IC
ESD Summary
• Electrostatic discharge occurs when excessive static charge on
an object builds up to a very high voltage (thousands of volts)
and causes device damage during contact and subsequent
discharge (current flow) with another object
• MOS devices with insulating SiO2 gates are especially
susceptible to ESD damage
• Different test standards have evolved for component level and
system level tests and confusion can result if these standards
are not understood and clarified in reports and
communication
• The very fast (HBM=nsecs / CDM=psecs) ESD pulses have low
energy and result in VERY small physical damage signatures
The ABC’s of ESD,
EOS, and SOA
• What is ESD
– Where does ESD come from
– MOSFET Gate susceptibility
– Test Standards
– Component level vs. module level tests
• What is EOS
• What is SOA
What is Electrical Over
Stress (EOS)?
• Electrical Over Stress is exactly what it says….
A device is electrically stressed over it’s specified limits in terms of voltage, current,
and/or power/energy
• Unlike ESD events, EOS is the result of "long" duration stress events (millisecond
duration or longer)
– Excessive energy from turning off inductive loads
– Load Dump
– Extended operation at junction temperatures > 150degC
– Repetitive excessive thermal cycling
– Excessive/extended EMC exposure, etc.
• EOS often results in large scorch marks, discoloration of metal, melted metallization
and/or bond wires, and massive destruction of the semiconductor component
What is Electrical Over
Stress (EOS)?
• Failures from EOS can result in the following:
– Hard failure: failure is immediate and results in a complete
non-operational device
– Soft failure: EOS results in a marginal failure or a shift in
parametric performance of the device
– Latent failure: At first the EOS results in a non-catastrophic
damage but after a period of time further degradation
occurs resulting in a hard or soft failure
EOS: Thermal Lifetime Curve
Lifetime
Point of accelerated
device qualification
10 000 h
Lifetime curve for device
worst case parameters
1 000 h
100 h
270°C
10 h
app. 350°C
170°C
1h
Irreversible damage
Overtemperature
shutdown
0.1 h
Ⅰ
Spec valid,
full lifetime,
full function
150°C
Ⅱ
220°C
260°C
Soldering
Device temperature
200°C
Ⅲ
270°C
Spec restricted,
No spec, no permanent damage,
reduced lifetime,
highly reduced lifetime,
limited functionality no function guaranteed
350°C
Ⅳ
Device destruction,
irreversible damage,
permanent out of control
What is Electrical Over
Stress (EOS)?
• What indicates EOS?
Degradation/recrystalisation of metal (≥400ºC)
---also repetitive fast transients<100ºC
Scorched/Melted metal (≥650ºC)
Melted silicon (≥1200ºC)
EOS Failure Signatures---Generalities
Visualization of single- and repetitive pulse events
max. Chip temperature
:
single mode
melting point in
thermal hot spot
repetitive mode
number of cycles
1
(e.g.)102
106
This isn‘t a completely black & white effect, but there can be a significant
difference in single- and repetitive pulse failure signatures
EOS: Failure signature from excessive
inductive turn-off energy
• Example – Inductive clamp single pulse
IDS(start)=10A, t=11.8 ms, T=25°C, Vbb = 12V
I_ramp(10A/11.8ms)
E=2.14 Joules
Failure signature (10A):
EOS at the
„hot spot“
- No metal degradation
- Scorch in DMOS field
- NO bond fuse
No metal degradation
near bond
EOS: Failure signature from repetitive
thermal cycling combined with high current
Severely degraded
recrystalized metal
Electrical Over Stress (EOS)
• A common failure for electrical over stresses is
MELTED METALLIZATION AND/OR BOND WIRES
Gold Wire DC Ratings*
Aluminum Wire DC Ratings*
350m
40A
50m
2.5A
25m
1A
50m
2A
*Assumes TJ < 150C, TLeads < 85C, TWire < 220C, and Wire Length<3mm
125m
8A
How to Electrically Over Stress
Components
• Put components in/out of sockets while power already applied (hot
plug)
• Applying electrical signals which exceeds a component’s ratings
• Apply an input signal to a device before applying supply voltage
and/or ground
• Apply an input signal to a device output
• Use an inexpensive power supply (supply overshoot)
• Provide insufficient noise filtering on the board’s input line(s)
• Use a poor ground with high resistance and inductance
EOS Summary
• Electrical over stress refers to a condition when a
device is electrically stressed over its specified limits
• EOS often catastrophically damages devices by
degrading or melting of metallization and bond wires
• Operation of devices within the specified Safe
Operating Area will eliminate electrical over stress
damage
The ABC’s of ESD,
EOS, and SOA
• What is ESD
– Where does ESD come from
– MOSFET Gate susceptibility
– Test Standards
– Component level vs. module level tests
• What is EOS
• What is SOA
Safe Operating Area (SOA)
• The safe operating area is a set of conditions
specified for a certain device
• Within the safe operating area, the
semiconductor component is specified to
operate as expected
• By definition, no electrical over stress occurs
within the specified safe operating area
SOA Graph for MOS Transistor
• Single pulse, Tcase = 25C, Tjunction < 125C
4s
15s
50s
10A
200s
1ms
1A
DC
0.1A
1V
10V
100V
VDS, Drain-Source Voltage
1000V
Pulse Width
ID, Drain Current
100A
SOA Graph for
Linear Voltage Regulator
• VOUT = 5V, Tjunction < 150C
Soldered to board
with 3cm2 copper
heatsink
IOUT, Output Current
150mA
100mA
Ta = 25C
Ta = 85C
50mA
Ta = 125C
0A
10V
15V
20V
VIN, Input Voltage
25V
The ABC’s of ESD,
EOS, and SOA
Thank you!
www.btipnow.com