Transcript IMU 연구 진행 현황

System On Package(SOP) for Wireless
Communication
임근원
2005. 06. 16
Contents
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Packaging System
Shortcoming of SOC for RF, Digital, Optical Integration
Advantage of SOP
SOP for Wireless Communication
RF SOP
- Embedded Passives ( Inductor, Capacitor, Filter, Antenna)
- Integrated RF module
Digital SOP
Optoelectronics SOP
SOP
Status of SOP
Vision of SOP
SOP R&D
Lim Geun Won, June 16, 2005
Seoul National University
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Package system
 System-on-chip (SOC)
 Multichip module (MCM)
 System-in-package (SIP)
 System-on-package (SOP)
Lim Geun Won, June 16, 2005
Seoul National University
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Shortcoming of SOC for RF,Digital,Optical
Integration
 the difficulty of composing the specification of a mixed digital-analog-RF
system
 the lack of architectural templates and experience in heterogeneous SOC
implementation
 the lack of design and test methodologies and tools for partitioning, floor
planning, placement, routing
 high cost for large ICs due to the high cost of wafer fabrication and low yield
at less than 0.1 um technologies
 long design and test cycles in the face of system-level requirements
 wiring delay in SOC  damage for computing application
 intellectual property issues
Lim Geun Won, June 16, 2005
Seoul National University
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Advantage of SOP
 Wiring delay, “latency”, can be avoided by either moving wiring from
nanoscale on Ics to the microscale on SOP or making the digital chips smaller
 RF components are best fabricated in the package rather than on silicon
 The highest Q factors reported on silicon are about 10-25,
in contrast to 100-400 achieved in the SOP package
 Optoelectronics is moving onto the package for high I/O and high-speed
interconnections, replacing copper and addressing both the resistance and
cross-talk of electronics ICs
 design time shorter, flexibility to use emerging technology
smaller chip with high yield and wiring length
Lim Geun Won, June 16, 2005
Seoul National University
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SOP for wireless communications
: cross section of SOP substrate illustrating diverse technology function
Lim Geun Won, June 16, 2005
Seoul National University
: wireless communication system in SOP technology
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RF-System-On-Package
 RF-SOP
:complete packaging solution for RF module
by integrating embedded passives components and MMIC at the package level
passives components (filter, antenna, and external high-Q passive element
for block such as PA and VCO)
+MMIC chipset (PA, low-noise amplifier(LNA), up-and-down mixer(MIX), VCO)
: Components fabricated on SOP
Lim Geun Won, June 16, 2005
Seoul National University
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RF-System-On-Package
 Progress in lines and spaces, and microvias on SOP substrate
- 5 and 10 um wide lines, 10 um spaces, 4 um copper thickness
- fabrication planar multilayer wiring with stacked microvias
Lim Geun Won, June 16, 2005
Seoul National University
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Embedded Passives
 Multilayer Inductor
: effective inductance of the planar and 3D inductors
(a) Planar spiral
: Q of the planar and 3D inductor
(b) offset 3D (c) helical inductors
Lim Geun Won, June 16, 2005
Seoul National University
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Embedded Passives
 Multilayer Capacitors
VIC topology occupies nearly an
order of magnitude less area than
the MIM
:Three-dimensional views of MIM and VIC configuration
:The conventional MIM structure consists of a dielectric layer sandwitched between two
square plates neglecting the higher order excitation mode.
However, the vertically interdigitated configuration (VIC) makes the
plate size smaller as more plates are deployed on a larger number of dielectric layers
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Seoul National University
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Embedded Passives
 Multilayer filter
 Integrated Antenna
:3D layer by layer view of multilayer filter structure
:3D integrated module with CBPA and embedded filter
filter와 connection
:configuration of CBPA
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Seoul National University
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Integrated RF-SOP Modules
 Ku-Band Transmitter Module
- the balanced stripline topology where coupled line segments are sandwiched by two
ground planed at an equal distance of 17.6 mil(4 LTCC tape layers)
- the compact module by embedding the filter saves more than 40% area
compared to the module on a typical alumina substrate
• total gain : 41 dB
• out power : 26 dBm
• LTCC module(integration of BPF)
- insertion loss:
1.8 dB at 14.5 GHz
:Configuration and picture of compact Ku-band transceiver module
Lim Geun Won, June 16, 2005
Seoul National University
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Integrated RF-SOP Modules
 Integrated Power Amplifier Module
- a two-stage 1.9 GHz PA with second harmonic tuning circuits using Si M-MOSFET
• N-MOSFET : 0.8 um BiCMOS on the LTCC board
• MIM capacitor : matching components
• RF ground capacitor : VIC topology (requirement
for large capacitance value for 1.9 GHz)
• Second Harmonic tuning circuit:
series inductive-capacitance resonator at 3.8 GHz
• 48% PAE
• out power : 26 dBm
• power gain at 1.9 GHz with 3.3 drain supply voltage
: 17 dB
(a) the 1.9 GHz power amplifier module with fully
on-package passives (b) die photo
Lim Geun Won, June 16, 2005
Seoul National University
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Integrated RF-SOP Modules
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Performance comparison of the 1.9 GHz power amplifier
On-package components
achieve superior Q performance
Lim Geun Won, June 16, 2005
Seoul National University
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Digital SOP
 Digital SOP
- 60 um gap between the power and ground planes
 low impedance path for the power distribution
- dielectric material : epoxy with copper matallization
- split power islands to isolate the trans. and receiver FPGA’s from transceiver chip
- embedded decoupling layer : low impedance path for decouple capacitor
- 2.48 Gb/s differential serial channal
: Layout and cross section of digital block
Lim Geun Won, June 16, 2005
Seoul National University
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Optoelectronics SOP
 Optoelectronics SOP
- the heterogeneous integration of optically active devices (laser, detector array, laser
amplifier) and passives(waveguides, gratings, beam splitter)
: optoelectronics SOP concept and design
a) waveguide array embedded in FR-4 board
b) embedded p-i-n detector
c) polymer microlens
d) embedded i-MSM
e) beam splitter
f) curved waveguide array
g) blazed polymer grating, blaze angle 29°
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Seoul National University
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System-On-Package(SOP)
 SOP concept for system integration of thin film components
Lim Geun Won, June 16, 2005
Seoul National University
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Status of SOP
 problem of SOP technology
- interference between each of the block in a package
:EMI/EMC
- on-/off-chip power management
:power supply stability, thermal problem according to power
- how to test
- design infrastructure
:the lack of design concept to on-/off- chip packaged environment and design tool
 application example
- 803.11b IFE module ( Agere Co.)
- CIS/CCD camera module
- 15 AQ DC/DC point of load converter ( Power One Co.)
Lim Geun Won, June 16, 2005
Seoul National University
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Vision of SOP
 SOP: Moore’s Law for ICs
SOP for system integration as IC for transistors
 SOP is a system
level technology
Lim Geun Won, June 16, 2005
Seoul National University
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Global SOP R&D
Lim Geun Won, June 16, 2005
Seoul National University
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Summary
 SOP requires system design and architecture leading to IC-package-system
codesign and addressing signal and power integrity, EMI, and wiring layout
 In future, business and legal barriers are significantly more difficult to
overcome for the SOC than for SOP based product
 SOP is system level technology with all the system functions and
interconnections and takes advantage of the synergy between IC, package,
and the system
Lim Geun Won, June 16, 2005
Seoul National University
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Reference
•
R. Tummala and V. Madisetti, “System on chip or system on package,” IEEE Des. Test
Comp., vol. 16, pp. 48-56, Apr.-June 1999.
•
R. Tummala “SOP;What Is It and Why? A New Microsystem-Integration Technology
Paradigm-Moor’s Law for System Integration of Miniaturized Convergent System of the
Next Decade”
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Tummala, R.R.; Swaminathan, M.; Tentzeris, M.M.; Laskar, J.; Gee-Kung Chang;
Sitaraman, S.; Keezer, D.; Guidotti, D.; Zhaoran Huang; Kyutae Lim; Lixi Wan;
Advanced Packaging, IEEE Transactions on “The SOP for Miniaturized, Mixed-Signal
Computing, Communication, and Consumer Systems of the Next Decade” Volume
27, Issue 2, May 2004 Page(s):250 - 267
•
Kyutae Lim; Pinel, S.; Davis, M.; Sutono, A.; Chang-Ho Lee; Deukhyoun Heo;
Obatoynbo, A.; Laskar, J.; Tantzeris, E.M.; Tummala, R.”RF-System-On-Package(SOP)
for Wireless Communications”, Volume 3, Issue 1, March 2002 Page(s):88 - 99
•
Pinel, S.; Lim, K.; DeJean, R.G.; Li, L.; Lee, C.-H.; Maeng, M.; Davis, M.F.; Tentzeris,
M.; Laskar, J.; Microwave Conference, 2003. 33rd European, “System-On-Package (SOP)
architectures for compact and low cost RF front-end module,” Volume 1, 7-9 Oct. 2003
Page(s):307 - 310 Vol.1,
Lim Geun Won, June 16, 2005
Seoul National University
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