Transcript Future

Challenges and Opportunities
for Technion
and the Israeli Chip Industry
Avinoam Kolodny
EE Department
Technion – Israel Institute of Technology
July 2010
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CS
EE
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Thoughts about
Technion and the
Israeli chip industry
 Past
 Present:
current research challenges
 Future: opportunities and directions
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The Past from a Personal Viewpoint

My professional career:
between Technion and Intel
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1975: I graduated EE
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Got a part-time job at Intel
I
was the first student employed
by Intel Israel
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Why did Intel Hire Me?

Because there was no computer at Intel!
 They
needed to run simulations on the
Technion’s computer
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First thing I did for Intel
I
ported Intel’s simulator to the big IBM
machine at the Technion computer center
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First trip to Intel Santa Clara
 Intel
Israel bought a minicomputer
 They wanted me to go get the software
I
was still a Technion graduate student…
 … I asked my advisor…
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Technion’s
Microelectronics
Infrared focus
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Post Doc at Intel’s Non-Volatile
Memory Group
 In
the 1980s, Intel moved
from memories to processors
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Design Automation for Processors
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Synthesis-Based Chip Design
 Logic
designers became
programmers
 Key for the ASIC business
and “fabless” companies
 Israel
became
“Land of chips and software”
with synthesis
The 486 Processor
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Intel’s CAD History
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Contribution to Education
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Back to Technion
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Observation about the Past
 It
was all implied by Moore’s law:
– More and more transistors
– From memories to processors to systems
– Digital revolution: changed the world
–New ways to live, learn and teach
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From Past to Present
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Technion and the Israeli Chip Industry
Past
Present
Technion
Israeli
Chip
Industry
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Present Challenges Reflected in Current Research

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Interconnect
Energy efficiency
Programming of many-core systems
Correctness and security
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Connectivity and Complexity
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Adding more metal layers…

Wires dominate:
– Speed
– Power
– Noise
– Reliability
– Cost
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Interconnect Power:
2004 case study

Intel’s Pentium-M, low-power microprocessor
designed in Haifa, 0.13 micron CMOS

Bit-Transportation energy is larger than
computation energy!!!
Gate
34%
Interconnect
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%
Diffusion
15%
* N. Magen, A. Kolodny, U. Weiser and
N. Shamir, “Interconnect-Related Energy
dissipation in a Low-Power Microprocessor”,
Proc. SLIP, 2004.
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Bits as Cars on the Information highway
 Energy
efficiency in chip design
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As System Complexity Goes Up
Power Efficiency Goes Down
Uniprocessor
Performance
Die Area (or Power)
(F. Pollack. Micro 32, 1999)
 Power-efficiency
requires many
parallel local computations
– Chip Multi Processors (CMP)
– Thread-Level Parallelism (TLP)
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Possible future paradigm shift in VLSI:
Network on Chip (NoC)
From:
Dedicated signal wires
to:
Shared network
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* E. Bolotin, I. Cidon, R. Ginosar and
A. Kolodny., “QNoC: QoS architecture
and design process for Network on
Chip”, JSA special issue on NoC, 2004.
Computing
Resource
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Network
switch
Network
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From Present to Future
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Beyond 10 Years Ahead:
Future Challenges and Opportunities

MOS Device Scaling will slow down
–New ways for system integration
– Back to basic sciences
– Interdisciplinary solutions
– New architectures
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Long Term Issues for the Industry
 Flat
world
– Competition with Asia
 Imperatives
for Technion and the industry
– Israel can win by quality and innovation
– Education: more Ph.D. graduates
– Strong research collaboration
with Technion in computer engineering
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The Innovation Paradox -
Applied Creativity
in Organizations

Avi Kolodny
(Technion(

Dadi Perlmutter
(Intel(

Shlomo Maital
(TIM)
* F. Chu, A. Kolodny, S. Maital and D. Perlmutter,
“The innovation paradox: Reconciling creativity & discipline – How winning organizations
combine inspiration with perspiration,” Proceedings of IEEE International Engineering
Management Conference, October 2004.
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The Innovation Paradox
Creativity and project implementation
often require contradictory mindsets
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Need Both:
Creativity and Organization
The conflicting values must be reconciled!
 Not
by tradeoff ,
by synergy!
Creativity
Creativity
Discipline
Discipline
 We
found several methods for doing this
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“Head in the Clouds,
Feet on the Ground”
 Creative,
wild brainstorming
–No idea is rejected (“head in the clouds”)
 Detailed
evaluation of ideas
–By practicality and benefit (“feet on the ground”)
 Let’s
apply this for academia-industry
joint research!
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Past vs. Future
for Technion and the Industry –
Summary of Opportunities
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1) Research Partnership
 Past:
Technion enabled Israeli hi-tech
– Mostly as an engineering school
– Partly as a research institute
 Future:
Industry will need research to innovate
– More Ph.D.’s will be needed
– Research collaboration essential
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2) Industry-Funded Research
 Past:
Defense technology was the driver
–Defense-funded research
–Adapted later for commercial use
 Future:
Commercial developments lead
–Consumer products are adapted for defense
–Industry must fund academic research
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3) Organization / Culture
 Past:
–Technion focus on theory and individual
research
– Industry focus on practical short term results
 Future:
– Joint research in computer engineering
– Long and short terms
– Teamwork
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A Specific Plan:
Computer Engineering Research Center
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Hardware
Software
Physics
Electronic devices
Computer hardware
Theory
Algorithms
Software
High Performance Computing
Need for integrated view:
Hardware and software
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Create a focal point
The center as a focal point for collaboration
Research in Israel, centered at the Technion, including
Academia, R&D from Hi-Tech industry, as well as
R&D from leading international companies
(Microsoft, Intel, Google, etc.)
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Conclusion

The Technion gave invaluable leverage
for the past success of:
– Israel
– Israeli hi-tech industry
– Individual Alumni

Let’s work together towards mutual
success in the future!
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