Transcript Future
Challenges and Opportunities
for Technion
and the Israeli Chip Industry
Avinoam Kolodny
EE Department
Technion – Israel Institute of Technology
July 2010
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CS
EE
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Thoughts about
Technion and the
Israeli chip industry
Past
Present:
current research challenges
Future: opportunities and directions
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The Past from a Personal Viewpoint
My professional career:
between Technion and Intel
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1975: I graduated EE
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Got a part-time job at Intel
I
was the first student employed
by Intel Israel
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Why did Intel Hire Me?
Because there was no computer at Intel!
They
needed to run simulations on the
Technion’s computer
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First thing I did for Intel
I
ported Intel’s simulator to the big IBM
machine at the Technion computer center
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First trip to Intel Santa Clara
Intel
Israel bought a minicomputer
They wanted me to go get the software
I
was still a Technion graduate student…
… I asked my advisor…
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Technion’s
Microelectronics
Infrared focus
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Post Doc at Intel’s Non-Volatile
Memory Group
In
the 1980s, Intel moved
from memories to processors
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Design Automation for Processors
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Synthesis-Based Chip Design
Logic
designers became
programmers
Key for the ASIC business
and “fabless” companies
Israel
became
“Land of chips and software”
with synthesis
The 486 Processor
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Intel’s CAD History
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Contribution to Education
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Back to Technion
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Observation about the Past
It
was all implied by Moore’s law:
– More and more transistors
– From memories to processors to systems
– Digital revolution: changed the world
–New ways to live, learn and teach
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From Past to Present
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Technion and the Israeli Chip Industry
Past
Present
Technion
Israeli
Chip
Industry
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Present Challenges Reflected in Current Research
Interconnect
Energy efficiency
Programming of many-core systems
Correctness and security
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Connectivity and Complexity
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Adding more metal layers…
Wires dominate:
– Speed
– Power
– Noise
– Reliability
– Cost
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Interconnect Power:
2004 case study
Intel’s Pentium-M, low-power microprocessor
designed in Haifa, 0.13 micron CMOS
Bit-Transportation energy is larger than
computation energy!!!
Gate
34%
Interconnect
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%
Diffusion
15%
* N. Magen, A. Kolodny, U. Weiser and
N. Shamir, “Interconnect-Related Energy
dissipation in a Low-Power Microprocessor”,
Proc. SLIP, 2004.
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Bits as Cars on the Information highway
Energy
efficiency in chip design
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As System Complexity Goes Up
Power Efficiency Goes Down
Uniprocessor
Performance
Die Area (or Power)
(F. Pollack. Micro 32, 1999)
Power-efficiency
requires many
parallel local computations
– Chip Multi Processors (CMP)
– Thread-Level Parallelism (TLP)
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Possible future paradigm shift in VLSI:
Network on Chip (NoC)
From:
Dedicated signal wires
to:
Shared network
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* E. Bolotin, I. Cidon, R. Ginosar and
A. Kolodny., “QNoC: QoS architecture
and design process for Network on
Chip”, JSA special issue on NoC, 2004.
Computing
Resource
Module
Network
switch
Network
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From Present to Future
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Beyond 10 Years Ahead:
Future Challenges and Opportunities
MOS Device Scaling will slow down
–New ways for system integration
– Back to basic sciences
– Interdisciplinary solutions
– New architectures
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Long Term Issues for the Industry
Flat
world
– Competition with Asia
Imperatives
for Technion and the industry
– Israel can win by quality and innovation
– Education: more Ph.D. graduates
– Strong research collaboration
with Technion in computer engineering
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The Innovation Paradox -
Applied Creativity
in Organizations
Avi Kolodny
(Technion(
Dadi Perlmutter
(Intel(
Shlomo Maital
(TIM)
* F. Chu, A. Kolodny, S. Maital and D. Perlmutter,
“The innovation paradox: Reconciling creativity & discipline – How winning organizations
combine inspiration with perspiration,” Proceedings of IEEE International Engineering
Management Conference, October 2004.
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The Innovation Paradox
Creativity and project implementation
often require contradictory mindsets
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Need Both:
Creativity and Organization
The conflicting values must be reconciled!
Not
by tradeoff ,
by synergy!
Creativity
Creativity
Discipline
Discipline
We
found several methods for doing this
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“Head in the Clouds,
Feet on the Ground”
Creative,
wild brainstorming
–No idea is rejected (“head in the clouds”)
Detailed
evaluation of ideas
–By practicality and benefit (“feet on the ground”)
Let’s
apply this for academia-industry
joint research!
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Past vs. Future
for Technion and the Industry –
Summary of Opportunities
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1) Research Partnership
Past:
Technion enabled Israeli hi-tech
– Mostly as an engineering school
– Partly as a research institute
Future:
Industry will need research to innovate
– More Ph.D.’s will be needed
– Research collaboration essential
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2) Industry-Funded Research
Past:
Defense technology was the driver
–Defense-funded research
–Adapted later for commercial use
Future:
Commercial developments lead
–Consumer products are adapted for defense
–Industry must fund academic research
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3) Organization / Culture
Past:
–Technion focus on theory and individual
research
– Industry focus on practical short term results
Future:
– Joint research in computer engineering
– Long and short terms
– Teamwork
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A Specific Plan:
Computer Engineering Research Center
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Hardware
Software
Physics
Electronic devices
Computer hardware
Theory
Algorithms
Software
High Performance Computing
Need for integrated view:
Hardware and software
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Create a focal point
The center as a focal point for collaboration
Research in Israel, centered at the Technion, including
Academia, R&D from Hi-Tech industry, as well as
R&D from leading international companies
(Microsoft, Intel, Google, etc.)
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Conclusion
The Technion gave invaluable leverage
for the past success of:
– Israel
– Israeli hi-tech industry
– Individual Alumni
Let’s work together towards mutual
success in the future!
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