Transcript ACSI 1999 Projected Gross Revenue (thousands of dollars)

Interoperability Beyond Design
Sharing Knowledge between Design and
Manufacturing
Don Cottrell
VP Emerging Technologies
Si2 Corporation
Thomas J. Grebinski
SEMI Data Path Task Force Chair
SEMI Universal Data Model Working Group Chair
ISQED- International Symposium on Quality Electronic
Design
March 25, 2003
Data-centric IC Designs
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The IC design community is becoming more data
centric.
– Overcoming the issues of interoperational efficiencies.
• Common data structures for the entire IC design data
flow.
– Open data structure standards
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OpenAccess and Si2
Open-source applications program interface.
Open-source reference data base for all IC design data.
Free license for anyone to use and redistribute..
The realization of common expectations
– within an increasingly complex, more intimately
connected and data-intensive design data flow.
ISQED- International Symposium on Quality Electronic
Design
March 25, 2003
Open-source Reference Data Base and
API
• OpenAccess Coalition and Si2
– Click-thru internal use license
• Free access to API specification
• Free access to reference database binaries
– Signed internal use and distribution license
• Free access to reference database source
• Royalty-free redistribution rights (binaries only)
• Rights to distribute modifications to the reference
database (binaries only) that do not alter the API
ISQED- International Symposium on Quality Electronic
Design
March 25, 2003
Commercial EDA Tools
University Research
Internal Proprietary Tools
External Design Partners
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Standard API
Reference Database
Cores/Cells
Gates
Transistors
Physical Layout
OASIS (planned)/GDSII
ISQED- International Symposium on Quality Electronic
Design
The realization of common expectations
OpenAcess Design Data Base and API
March 25, 2003
Wide range of Functionality
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Design Database
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Chips / Blocks / Cells
RTL to Silicon
Digital / Analog
Automated / Custom
Logical / Physical
Batch / Interactive
Translators
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GDS2
OASIS (planned)
LEF
DEF
Verilog (planned)
SPEF (planned)
SPICE (planned)
Library Database
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Design organization
Design management
Access control
Technology Database
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Foundry Rules
Design Constraints
ISQED- International Symposium on Quality Electronic
Design
March 25, 2003
Opaque View Beyond IC Design
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The data view beyond IC design is opaque after
GDSII and OASIS.
– Design intent is not conserved beyond GDSII and
OASIS.
• GDSII and OASIS are a geometric encapsulation of the
design.
• SEMI P10 and text files fed downstream are another
encapsulation (interpretation) of the design intent.
• The basic design data structure has changed
substantially and thus, the design and mask engineering
view up and downstream is not immediately accessible
and also not clear (unambiguous).
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Different data structures between design and
mask manufacturing centers.
– Obscures the up and downstream view further.
– Need to convert to standard record structures for mask
manufacturing.
ISQED- International Symposium on Quality Electronic
Design
March 25, 2003
SEMI P10
Text Files
OASIS
GDSII
ISQED- International Symposium on Quality Electronic
Design
OASIS/GDSII
Conversion to
standard record
types
Mask Technical Planning Data Base
Internet File Transfers
Physical Layout
Geometric Shapes
Cells, Cores, Gates, Transistors
Design Data Base
IC Design Data Encapsulation for Mask
Manufacturing
March 25, 2003
ISQED- International Symposium on Quality Electronic
Design
Frame generation, bar coding, test structures
Layer Extractions, Scaling, Shrinking
Mask Layout
Sizing, Biasing,
Data Finishing
Tonality, Mirroring
Data Fracture
OASIS/GDSII
MIC, MEBES, Toshiba
Mask Layout Data Hitachi, JEOL, KLA, etc.
Mask Technical planning Data Base
Mask Data Preparation and Storage
Data Preparation
March 25, 2003
OASIS/GDSII
MIC, MEBES, Toshiba
Mask Layout Data Hitachi, JEOL, KLA, etc.
Mask Technical planning Data Base
Machine-specific Data Flow
ISQED- International Symposium on Quality Electronic
Design
Pattern Generation
Job Queue Data base
Mask Inspection
Mask Critical Dimensions
March 25, 2003
CFRAC
Extraction
Mask Pattern Generation
CFRAC
Extraction
Rendering
Rendering
FRAC
Writer Job Queue Data Base
Data Flow and Transformation in a
Mask Writer
Viewers- Integrity Test
ISQED- International Symposium on Quality Electronic
Design
March 25, 2003
ISQED- International Symposium on Quality Electronic
Design
Technical Planning Data Base
Data preparation Filter
Technical Planning Data Base
Record Types Filter
Technical Planning Data Base
Encapsulation Filter
Design Data Base
Changes in Structure and Hierarchy of Design
and Manufacturing Data
March 25, 2003
ISQED- International Symposium on Quality Electronic
Design
Rendering
Mask Pattern Generation
CFRAC
Extraction
FRAC
Writer Job Queue Data Base
CFRAC, Extraction and Rendering Filter
FRAC
Technical Planning Data Base
The Fracturing of Fractured Mask Layout Data
March 25, 2003
Design and Manufacturing Interoperability
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IC and mask design intent are lost downstream
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Numerous filters and translations of data drop design and
manufacturing hierarchy.
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There is no real time direct data link to what is written on a mask.
Which gives the IC designer an opaque view of how the design is
spatially transformed onto a mask.
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Such a view is a compelling need when non-parasitic biasing and
proximity corrections push a design outside acceptable IC design rules.
Such constraints will increase as the spatial density budget for circuit
elements increases.
Such losses extends “time to market” and increase design
and manufacturing costs.
It will become increasingly important to design at a higher
level of abstraction with a real-time view of what is actually
writable on a mask or wafer.
It will also become increasingly important to ensure that any
movement of data is as efficient, portable and extensible
as possible.
ISQED- International Symposium on Quality Electronic
Design
March 25, 2003
Finer Data Granularity Expected at the Mask
Pattern Generation Level
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Design and manufacturing data granularity continues
to increase.
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Greater access to design data
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100 to 300 Gb files with the expectation that the cost of
ownership to write or manufacture a mask does not increase.
Job Queue and sorting data rates are reaching several
hundreds of Mb/second with needed storage capacity in the
Terabytes region.
These types of demands run orthogonal to the necessary
reduction of COO and a shorter time to market.
Interconnectivity data will help improve mask layout and
engineering data processing time.
Massive parallel processing
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Sorting is fundamental for efficient massive parallel processing
Access efficiency features, such cell reference tables and
bounding boxes, accelerates transformations, such as sorting
ISQED- International Symposium on Quality Electronic
Design
March 25, 2003
The SEMI and OpenAccess Universal Data
Model (UDM)
IC Design
Mask Manufacturing
DRC
Simulation
Verification
Synthesis
Encapsulation
CD measurement
Pattern generation
Inspection
Encapsulation/Simulation
Data preparation/Assembly
Fracturing/Verification
Standard API
IC Design and Mask Technical Planning Data Base
Cells, Cores, Gates, Transistors
Physical Design Layout
Geometric shapes
Mask layout
Write-, inspection- and CD measurement-ready data files
ISQED- International Symposium on Quality Electronic
Design
Hierarchical Data Base
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March 25, 2003
The SEMI and OpenAcess UDM
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One standard data base and applications
program interface (API).
– For design and mask manufacturing.
– Access to all design and mask manufacturing data
through one common data language.
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Standard semantics for all model objects,
attributes and relationships
– No ambiguity between or within design and
manufacturing tasks.
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Hierarchy preserved through to mask pattern
generation, CD measurements and inspection.
– Unified design to manufacturing data flow and effort.
ISQED- International Symposium on Quality Electronic
Design
March 25, 2003
The SEMI and OpenAcess UDM
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Full access to design and manufacturing intent up and
down the design and manufacturing flow.
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Opens the door to more efficient massive parallel
processing at the mask pattern generation level.
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Thread safe and data preparation
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Query by Region for pattern generation and inspection
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multiple threads within an application can operate on data in
parallel without the risk of one thread contaminating the data on
another.
request objects that are within a specified spatial area (e.g. a
stripe)
multiple stripes in parallel; multiple executions.
Direct access to mask layout and DRC extraction data by region of
interest during mask inspection and CD measurement operations.
Unlimited scalability
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The model is limited only by the ability to store and manage
the data within the data base.
ISQED- International Symposium on Quality Electronic
Design
March 25, 2003
Extending the reach of the UDM
IC Design
Device manufacturing
Mask Manufacturing
Process characterization
Parasitics development
CMP
Etch
CVD, PECVD, Implant
PSM, Lithography, etc.
Mask Quality Assessment
Standard API
Universal Data Model
Wafer process data
Process Parasitics
ISQED- International Symposium on Quality Electronic
Design
Hierarchical Data Base
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March 25, 2003
UDM Status
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The technology exists today for full
implementation
– The reference data base and API are already available
and being used today.
– Mask and wafer implementations underway through
SEMI, OpenAccess Coalition and Si2.
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It is a community resource
– Change-order team in place.
– Applicable to design, mask and wafer data flows.
– Applicable to high-speed and volume data rendering
and measurement applications.
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Free-use license
– Free-use after release from the OpenAccess coalition.
ISQED- International Symposium on Quality Electronic
Design
March 25, 2003
Organizations Involved
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SEMI Data Path Task Force
– Tom Grebinski ([email protected])
• Task Force Chair
– Applicable site
• www.semi.org
• www.si2.org/eda-mask
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SEMI UDM Working Group
– Tom Grebinski and Don Cottrell
– Working Group Co-chairs
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OpenAccess Coalition and Si2
– Scott Peterson, LSI Logic (OAC Chairman)
– Steve Schulz- President and CEO, Si2
([email protected])
– Applicable sites
• www.openeda.org
• www.si2.org /openaccess
ISQED- International Symposium on Quality Electronic
Design
March 25, 2003
Companies Participating
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Cadence Design
Mentor Graphics
Synopsys
Micronic Laser Systems
JEOL
KLA-Tencor
Applied Materials
Dai Nippon Printing
Toppan Printing
Photronics
Dupont Photomasks
STMicroelectronics
TSMC USA
Toshiba (NuFlare)
Hitachi
Hewlett-Packard
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ISQED- International Symposium on Quality Electronic
Design
International Sematech
IBM
Infineon
Texas Instruments
Motorola
Philips Semiconductor
JEOL
Alcatel
Intel
AMD
SELETE/JEITA
National Semiconductor
LSI Logic
March 25, 2003
Moving Forward
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Critical Path Items
– New members to SEMI Data Path Task Force and
Working Groups
– New members to the OpenAcess Coalition
• Implementation of the mask and wafer extensions to the
OpenAccess Data base and API.
• Extending and then bridging the responsibilities between
design, mask and wafer manufacturing.
– Data-intensive flow integration with OpenAccess
and the UDM.
• Pattern generation
• Data Preparation
• Mask inspection and CD measurement
– Formalize relationship between SEMI, SI2 and
OpenAccess Coalition
ISQED- International Symposium on Quality Electronic
Design
March 25, 2003
Successful Track Record
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Si2 and the OpenAccess Coalition
– Open-Source Reference Data Base and API
– Source and Binary code made available for the model
and API.
• Unprecedented effort and availability
– Released to the public January 1, 2003
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SEMI Data Path Task Force
– The development of a replacement for GDSII called
OASISTM.
ISQED- International Symposium on Quality Electronic
Design
March 25, 2003
Successful Track Record
• OASISTM
– 64-bit Open Artwork System Interchange Standard.
• vs. 16-32 bit
– direct access to cell pointers
• GDSII has only sequential access to cell data.
– 10-50 times more compact
– Makes use of modality
– Can mimic data organization of virtually any writing
or inspection pattern file.
– Flexible property mechanism which can be used to
tag figures, arrays, and cells with as much textual and
numeric information as needed by downstream
processors.
ISQED- International Symposium on Quality Electronic
Design
March 25, 2003
Successful Track Record
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The creation of the Universal Data Model (UDM)
– Embrace of the technology worldwide and across
several industry platforms.
• A recognition of the importance of the link between
design and manufacturing by the industry and the media.
– Adoption of the OpenAccess reference data model
and API as the basis for the ongoing development of
the UDM.
ISQED- International Symposium on Quality Electronic
Design
March 25, 2003
Adoption of the Technology
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The compelling need
– Data granularity of an IC design and the manufacturing
of an IC continues to increase.
• Closer integration of the data flow; greater opportunity to
lose design intent at a number of levels.
– Greater inability with the tracking and credible use of design
and manufacturing data.
• Greater need for speed with fewer errors.
– Massive parallel processes into the tera-pixels per second.
• Greater need for deign intent at the mask data
preparation, pattern generation and inspection levels.
• Greater need for manufacturing intent in the design
space; cross talk is there ad getting louder.
– Proximity corrections at the manufacturing level render DRC
at the design level less effective. The need for a view by
design at the mask production level.
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There is no choice
ISQED- International Symposium on Quality Electronic
Design
March 25, 2003