Market - Electrical Engineering and Computer Science
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Transcript Market - Electrical Engineering and Computer Science
Michael McCorquodale, Chief Executive Officer
Mobius Integrated Systems Corporation
1001 E. Jefferson Ave.
Suite 105
Detroit, MI 48207
[email protected]
313.205.3489
2nd Annual Babcock/Eno River Capital Elevator Competition
March 31, 2001
Presentation Agenda
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Agenda
The Purpose of Mobius
Problems with Existing Implementations
The Mobius’ Solution
Management Team
Market
Strengths and Challenges
Funding Sought
Why Invest?
Purpose
Problems
Solution
Team
Market
S&C
Funding
Why?
The Purpose of Mobius
Mobius Integrated Systems Utilizes Emerging
and Available Technology to Deliver True
System-On-A-Chip (TSoC) Solutions to the
Embedded Systems Market
What is an embedded system?
The Engine Control Module
(ECM) is an example of an
embedded system:
Inside the engine a sensor
detects the fuel-to-air ratio
and transmits the signal to
the ECM so the fuel
injection can be adjusted
accordingly
Agenda
Purpose
Problems
Solution
Team
Market
S&C
Funding
Why?
Problems with Implementation
Antenna
Sensor
Sensor/Actuator
Interface
Wireless
Interface
Microprocessor
Actuator
Frequency Reference
Microprocessor
Sensor/Actuator
Interface
Quartz Crystal Resonator
(Frequency Reference)
Sensors/Actuators
Wireless
Interface
Board Level Implementation
Agenda
Purpose
Problems
Solution
Team
So what’s the problem?
Packaging costs high
Power too high
Size too large
Engineering resources
spent designing board
Functionality low
Applications limited
Market
S&C
Funding
Why?
The Mobius Solution
Antenna
Sensor
Sensor/Actuator
Interface
Wireless
Interface
Microprocessor
Actuator
Frequency Reference
Mobius
Microprocessor
Sensor/Actuator
Interface
Quartz Crystal Resonator
(Frequency Reference)
Sensors/Actuators
Wireless
Interface
True System-on-a-Chip
Implementation
(TSoC)
Board Level Implementation
Agenda
Purpose
Problems
Solution
Team
Market
S&C
Funding
Why?
Realizing The Mobius’ Solution
TSoC Implementation
Packaging costs reduced: Fewer Circuits
Power reduced: Less Input/Output
Size Reduced: Fewer Circuits, Fewer Pins
Fewer Engineering Resources: Simpler System
Increased Reliability: Longer Operating Life
Possibilities for increased functionality
Possibilities for new applications
The MS-8 prototype developed at The University of Michigan
Agenda
Purpose
Problems
Solution
Team
Market
S&C
Funding
Why?
Realizing The Mobius’ Solution
How is it Done?
Utilizing emerging technology: MEMS
Integrating existing technology: RF + Analog + Digital
New application in existing technology: Si Wireless
Support Emerging Standards: Bluetooth
Vision: SoC solutions require competency in all technologies
No Intel of Microsystems Exists: Si RF, SOI, MEMS, etc.
Who will integrate these technologies?
Recognizing MEMS as an enabling
technology: Prototype MEMS resonators
developed at The University of Michigan
Agenda
Purpose
Problems
Solution
Team
Market
S&C
Funding
Why?
The Mobius Team: Founders
Michael McCorquodale
–Chief Executive Officer
–Ph.D. Candidate: Wireless Integrated Circuit and MEMS Research
–Embedded Circuit Development with Hughes Space and Communications
Keith Kraver
–Chief Technical Officer
–Ph.D. Candidate: Low-Power, Low-Voltage, Mixed-Signal IC Research
–Embedded Analog Circuit Development with National Semiconductor
Matt Guthaus
–Chief Operations Officer
–Ph.D. Candidate: Low-Power Microarchitecture Research
–Automotive Microcontroller Development with National Semiconductor
Agenda
Purpose
Problems
Solution
Team
Market
S&C
Funding
Why?
The Mobius Team: Advisory Board
Dr. Richard Brown
–Chairman of Advisory Board
–Founder, Sensicore Corporation: A Chemical Sensor Company
–Associate Chair Electrical Engineering Division, University of Michigan
Joe Giachino
–Member, Automotive Microsystems Specialist
–Technical Chairman, Michigan Microsystems Consortium
–Over 30 Years Experience in Automotive Microsystems, Ford/Visteon
Dr. Dennis Grimmard
–Member, Semiconductor Manufacturing Specialist
–Manager, Solid-State Electronics Laboratory, University of Michigan
Agenda
Purpose
Problems
Solution
Team
Market
S&C
Funding
Why?
Market
System-on-a-Chip (SoC) Market:
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Total Available Market: Currently $5 Billion
Projected to be $17 Billion by 2002
Currently SoC 30% of Integrated Circuit (IC) Market
Projected to be 70% of IC Market by 2003
Automotive ECM Market:
– Total Accessible Market: 15 Million Units per Year
– Target Market: 100k – 200k ECMs
Additional Markets
– Scaling in Additional Markets: biomedical, environmental
monitoring, industrial, manufacturing, communications,
wireless, instrumentation, and testing
Agenda
Purpose
Problems
Solution
Team
Market
S&C
Funding
Why?
Mobius’ Strengths
Strengths
– Strong Technical Foundation
– Top Ph.D. Students, Top Faculty, Top Institutions,
Top Research
– Interdisciplinary Group and Innovative Approach
to TSoC Development
– Vision: Recognizing Emerging Technology,
Leveraging Knowledge of Existing Technology
– Hustle: Young, Motivated, Experienced Team,
Well Recognized
Agenda
Purpose
Problems
Solution
Team
Market
S&C
Funding
Why?
Mobius’ Challenges
Challenges
– Formal Business Experience
Solution: Recruited 6 Top Michigan MBA Students
for Business Plan Development This Term
– Strong Competitors:
Established Semiconductor Companies
Solution: Competitors Must Retool, Competitors
Must Combine Disparate Resources, New Org
Structure for TSoC Development
Agenda
Purpose
Problems
Solution
Team
Market
S&C
Funding
Why?
Funding Sought
Capital Sought
– $3MM First Round to Initial Product Delivery
Expenditures
– Development, Management, and Sales Teams
– Office Space, Computer Hardware, CAD Tools
– Design, Manufacturing, and Testing of Initial
Product
Agenda
Purpose
Problems
Solution
Team
Market
S&C
Funding
Why?
Why Invest in Mobius?
Reasons to Invest in Mobius
Strong, Scalable, Needed Technology with
Significant Added Value
Motivated, Experienced, Talented Team
Tremendously Expanding Market
Applications in Broad Spectrum of Markets
Opportunity to Capitalize on Emerging
Applications
Agenda
Purpose
Problems
Solution
Team
Market
S&C
Funding
Why?
Why Invest in Mobius?
Current Strategy
Full Business Plan just Completed
Prototypes Developed, Manufactured, and Tested
Seeking Start-Up Capital From Angel Investors and
Venture Capitalists
Looking to Fill Gaps: Management and Partnerships
Developing Specification for Initial Product Offerings
R&D underway for Bluetooth Enabled ECM
Agenda
Purpose
Problems
Solution
Team
Market
S&C
Funding
Why?