Transcript Document

Overview of a Space Qualification
Process Radiation characterization and
beyond
L. BONORA, ESA/ESTEC-Component Division
Xanthi - Oct 2006
ESA/ESTEC
TEC-QCS
SUMMARY
Radiation: effects on EEE components
Radiation: tests & requirements
Beyond radiation, overview of the relevant
requirements for space components/flight
models.
ESCC Evaluation/Qualification Approach
Minimum Quality Management Requirements
ESA/ESTEC
TEC-QCS
Radiation: effects on EEE components (1)
Total Ionizing Dose (TID)
Degradation of μelectronics and optoelectronics
Cumulative long term effects
Parameter drifts, threshold shifts, timing changes, functional
failures
Non Ionizing Effects – Displacements Damage
Degradation of optoelectronics (GaAs …), CCDs, bipolar
technologies in very harsh environments
Cumulative long term effects ( disruptions of crystal lattice)
CMOS technologies less affected ( majority carriers)
ESA/ESTEC
TEC-QCS
Radiation: effects on EEE components (2)
Single Event Effects (SEE)
Single charged particles (heavy Ions and protons) passing
through a semiconductor material
Soft errors: data corruption (SEU), system shutdown (SEFI),
transients (SET)…
Hard errors ( sometimes destructive): Latch-up ( SEL), Stuck
bits (SHE), Gate ruptures ( Power MOSFETs and thin
capacitors in analog devices)…
New effect types or unknown manifestations of known effects
always possible especially for new technologies
ESA/ESTEC
TEC-QCS
Radiation: Tests and requirements for TID
Usual particle type: γ rays (1.17 & 1.33 MeV) from Co60 sources
Effects similar to/ representative of space radiation
High penetration (parts irradiated “as is” on test boards)
European Specification: ESCC 22900
Experimental Set-up
Sample size: (10 + 1) parts in gal, from a single lot
Static bias ( considered as a worst case) ON and OFF
Total dose ~100 krad(Si) max. in several steps (0/5/10/20/50/100)
Dose rate < 360 rad(Si)/h
Actual space dose rate very low ( a few rad(Si)/h)
High dose rate not relevant for bipolar/ BiCMOS technologies due to ELDRS
Facilities: one source at ESTEC, several in Europe (e.g., ONERA
Toulouse)
ESA/ESTEC
TEC-QCS
sat
cm2
Radiation:
Tests and requirements for SEE (1)
LET
LET (MeVcm2mg-1 )
LETt h
General:
Characterization: experimental curve σ vs. LET (HI) or energy (p+)
σ = ratio number of events / number of incident particles
Key parameters: σ sat, LETth and Weibull fit
For LETth < 12 MeV.cm2/mg → proton sensitivity possible
Based on these parameters → event rate calculations
For SET, pulse energies are also important
pulse amplitudes and durations have to be determined
For some events (e.g., SEGR), destruction of the test samples can’t
be prevented
Results may be strongly dependent from test patterns or application
conditions
European Specification: ESCC 25100
ESA/ESTEC
TEC-QCS
Radiation:
Tests and requirements for SEE (2)
Experimental method:
Fluences > 106 HI/cm2 or > 1010 p+/cm2
Sample size: ( 3+1) min.
Particle range > 30 μm
Bias: dynamic or static
The range of LETs (HI)/Energies (p+) must be sufficient to determine
threshold and saturation
A min. of 5 LET/Energy steps is required
De-lidded parts for HI – Back side irrad. possible
Experimental Set-up
ESA supported facilities: HIF(B), PSI (CH), RADEF (F)
Other facilities in Europe (IPN- Orsay) or in the USA (BNL …)
ESA/ESTEC
TEC-QCS
Radiation: Tests for Displacement Damage
Experimental method:
Unit of interest: NIEL ( Non Ionizing Energy Loss)
Affected types: CCDs / Optocouplers / GaAs (and similar
material) based components …
Ground test:
protons ( pref. < 60 MeV), fluences > 1010 p+/cm2
neutrons ( ~ 1MeV), fluences > 1010 n/cm2
Some parts are also TID sensitive ( if a silicon chip is included)
Sensitivity to bias conditions
ESA/ESTEC
TEC-QCS
Radiation:
points of contact at ESTEC & facilities availability
Who to contact ? Radiation Effects Section (TEC-QCA)
TID, DD: Ali Mohammadzadeh - [email protected]
SEE: Reno Harboe - Sorensen - [email protected]
Availability of the facilities can be checked on line in
ESA radiation section of ESCIES
https//escies.org
ESA/ESTEC
TEC-QCS
Radiation characterization of a
component/technology is a mandatory step BUT
 A lot more is required to get a Flight Model
At this stage, one has to distinguish between:
– An approval on a case by case basis which is an
individual and limited authorisation for a specific
project
– A full ESCC Qualification ( including an Evaluation
phase in the ESCC system) which is a general and long
term authorisation of use in space
Let’s first briefly present the relevant requirements
ESA/ESTEC
TEC-QCS
RELEVANT REQUIREMENTS
• ECSS
European Coop. for Space Standardisation
– Space Project Management; Space Product Assurance; Space Engineering
ECSS-Q60A: Requirements for supply and use of EEE components at
equipment level
• ESCC
European Space Components Coordination
( ESCC is the preferred option)
– The ESCC System is an international system for the specification /
qualification / procurement of EEE components for use in Space
programmes. It covers:
• the technical specification of EEE parts
• methodologies for component evaluation and qualification
• testing methods / quality assurance / operational provisions
ESA/ESTEC
TEC-QCS
RELEVANT REQUIREMENTS
ECSS- Q60A
Non-qualified components have to be evaluated
ECSS defines what to do but not how to do
The evaluation programme shall include:
A constructional analysis
A manufacturer assessment
An Evaluation testing
Electrical stress ( Life test, HTRB …)
Mechanical stress ( shocks, vibrations …)
Environmental stress ( temp. shock and cycling, seal tests …)
Assembly capability
Radiation testing ( TID and SEE)
ESA/ESTEC
TEC-QCS
ESCC Eval. / Qualif. Approach: The ESCC system in brief
An international system for the specification / qualification / procurement of EEE
components for use in Space programmes
For users, 3 levels of specifications:
• Basic: test methods, qualification methodology and general requirements
applicable to all ESCC components
• Generic: requirements for screening, periodic or lot acceptance testing and
qualification testing for individual families of components
• Detail: performance requirements for individual or ranges of particular
components
ESCC 20000 – Using the ESCC Specification System
ESA/ESTEC
TEC-QCS
ESCC QUALIFICATION
•
ESCC qualification approval is a status given to electronic components which
are manufactured under controlled conditions and which have been shown to
meet all the requirements of the relevant ESCC specifications.
•
Unlike the US MIL System, ESCC is based on a 2 step qualification approach:
Evaluation + Qualification
•
During the Evaluation phase, components/technologies can be more
extensively characterised and margins determined
•
3 main phases:
– Manufacturer Evaluation ( ESCC 20200) -> AUDIT
– Component Evaluation ( ESCC 22600 and ancillaries)
• Preparation and realization of an agreed Evaluation Test Program ( ETP) including:
– Constructional analysis and technology evaluation
– Step-Stress testing
• Preparation of a Process Identification Document (PID) & Detail Specification
– Component Qualification testing
• On components produced strictly as defined in the final PID and from a given lot
• According to ESCC Generic Spec. requirements
ESA/ESTEC
TEC-QCS
ESCC QUALIFICATION
ESCC 22600
Stand. Comp. Eval
COMPONENT EVALUATION
• Constructional Analysis
– On random samples taken from the current production
– Performed by the Evaluation Authority (ESCC Executive)
• Evaluation Test Programme
– Established in conjunction Manufacturer / ESCC Executive
– On a sample ( ~ 100 parts) representative of the component family
– In order to determine failure modes and margins, it includes:
• Endurance tests ( HTRB, Extended Burn-in, Life Test …)
• Destructive tests ( Step-stress, radiation, Environmental/Mechanical/Assembly…)
– Includes a CA on representative components
– Ancillary specifications 226xxxx* describe the procedure and requirements to
create and perform an ETP
*: xxxx = generic spec. number
ESA/ESTEC
TEC-QCS
ESCC QUALIFICATION
ESCC 22600
Stand. Comp. Eval
COMPONENT EVALUATION
• Process Identification Document ( PID)
– Shall be prepared by the Manufacturer
– Establishes a precise reference for an electronic component qualified in
accordance with the ESCC System
•
•
•
•
Component’s design configuration
Materials used in manufacture
Manufacturing processes and controls
Inspections and tests to be carried-out during and after manufacture
– PID shall be in accordance with the requirements of ESCC 22700
• Detail Specification
– Necessary if not already described by an existing Detail Specification
– Or if the existing specification requires updating
– Described in ESCC 20800.
ESA/ESTEC
TEC-QCS
ESCC QUALIFICATION
QUALIFICATION TESTING PHASE
• Prerequisites:
–
–
–
–
Successful completion of the Evaluation Phase (EPPL listing)
The PID reviewed and approved by ESCC Executive
A production and test schedule for major processing operations
A Production Flow Chart, Process Schedules and Inspection Procedures
• Components required for qualification testing must be produced
strictly in accordance with the PID
• Qualification testing of the component must be in accordance with
the requirements of the relevant ESCC Generic Specification
• On successful completion of the testing phase => ESCC QPL
• A Qualification, once established, is valid for 2 years
ESA/ESTEC
TEC-QCS
ESCC Gen. Spec. 9000
Integrated Circuits, Monolithic, hermetically Sealed
CHART F1
GENERAL FLOW FOR PROCUREMENT (ESCC GS 9000)
ESCC 9000
describes the
general
requirements for
-Qualification
-Qualification
maintenance
-Procurement
-Delivery
of hermetically
sealed, hermetic
ICs.
PRODUCTION CONTROL
Special In-Process Controls
F2
Wafer Lot Acceptance
SCREENING TESTS
F3
LOT VALIDATION TESTING
F4-SG2 (ESCC Qual)- optional
F4 (Not ESCC Qual)- mandatory
RELEASE
PERIODIC TESTING
DELIVERY
ESA/ESTEC
TEC-QCS
F4
ESCC 9000 – CHART F3
SCREENING TESTS / COMPONENTS FROM PRODUCTION CONTROL (F3)
All components shall be SERIALISED prior screening tests
(previous SCC Chart II and III)
all lots for qualification, maintenance, lot validation and delivery
shall be submitted to inspections and tests
High Temp. Stabilisation Bake
883-TM1008
Temp. Cycling
883-TM1010C
PIND
883-TM2020A
(PDV)
Param. Drift Values (Initial Measurement )
(HTRB)
High Temp., Reverse Bias, BI
devices with cavities
values recorded agaisnt SN
883-TM1015A
PDV post HTRB and before Power BI
Power BI
24h, max. store temp. rating
duration and conditions in ESCC DS
values recorded agaisnt SN, drifts calculated
883-TM1015 B/D/or E
Final PDV
lot failure criteria
240h, alternative allowed (detailed in 1015)
values recorded agaisnt SN, drifts calculated
lot failure criteria
3θ
High and Low Temp. Elec Measurements
ESCC DS
values recorded agaisnt SN
lot failure criteria
3θ
Room Temp. Elec Measurements
ESCC DS
values recorded agaisnt SN
lot failure criteria
sampling ( no failure allowed)
lot failure criteria
Check for LOT FAILURE
Seal (Fine and Gross Leak)
883-TM1014A/B/C
External Visual Inspection
ESCC BS 20500
Solderability
F4 if applicable
ESA/ESTEC
TEC-QCS
Max failure rate: 5%
during 100% testing
ESCC 9000 – CHART F4
QUALIFICATION AND PERIODIC TESTS (F4)
(previous SCC Chart IV and V)
50 (1 type) /36 (per type if 2 types) /26 (per type if 3 types) Components
SG1
ENV./MECHA. Subgroup
ENDURANCE SG
SG3
ASSEMBLY SG
24 months period
12 months period
24 months period
15/11/8 components
15/11/8 components
5/3/2 components
Mecha. Shock
883-2002B
Therm. Shock
883-1011C
Operating Life Test 2000h
883-1005
Terminal Strengh
883-2004
Vibration
883-2007A
Moisture
883-1004
Electrical Measurements
(values recorded agaisnt SN)
Internal Visual Inspection
ESCC 20400
Seal
883-1014A/B/C
Bond Strengh
883-2011
Ext.Visual Insp.
ESCC 20500
Die Shear
883-2019
Constant Acc.
883-2001E
values
recorded
agaisnt SN
SG2
Seal
883-1014A/B/C
Seal
883-1014A/B/C
Electrical
Measurements
Electrical
Measurements
Ext.Visual Insp.
ESCC 20500
Ext.Visual Insp.
ESCC 20500
ESA/ESTEC
TEC-QCS
Permanence of Marking
ESCC 24800
QUALITY MANAGEMENT
As a minimum, the QM
plan shall address the
requirements of ESCC QUALITY
24600
CONFORMANCE DOCUMENTATION AND
REQUIREMENTS
• As a minimum, the Manufacturer quality
management plan must address the ESCC 24600
requirements ( prescriptions to ISO 9001).
• The resulting Manufacturer quality management
system has to include and demonstrate the
application of all the applicable ESCC 24600
requirements.
ESA/ESTEC
TEC-QCS
QUALITY MANAGEMENT
As a minimum, the QM
plan shall address the QUALITY
requirements of ESCC
24600
CONFORMANCE DOCUMENTATION AND
REQUIREMENTS
• An appointed CHIEF INSPECTOR with clearly defined authority and
responsibility ( including CoC)
• CONTROL of NON-CONFORMING PRODUCTS invoking the requirements
of ESCC 22800
• QUALITY and CONTROL DOCUMENTATION including:
– Quality manual ( indicating as a objective the conformance to ESCC 24600)
– Document control procedures for all documents related to the ESCC components
manufacture ( incl. subs./suppliers management)
– A maintained PID
– Change Control Programme establishing the requirement for documentation of
ALL changes, their reasons and the associated data including reliability and requalification results
ESA/ESTEC
TEC-QCS
QUALITY MANAGEMENT
As a minimum, the QM
plan shall address the QUALITY
requirements of ESCC
24600
CONFORMANCE DOCUMENTATION AND
REQUIREMENTS
• TRACEABILITY has to be maintained at all stages of production and tests for
all lots
– Quality records have to be maintained for 5 years ( possibly 10 in a near future)
– Record of all components found to be defective
• A Conversion of CUSTOMER REQUIREMENTS (specific tests or test
vehicles, marking, rework, screening )
• A CONTROL/INSPECTION prog. Including:
–
–
–
–
On-receipt / incoming tests / inspections
Applicable ESCC in-process monitoring/control and back-end tests
Procedures shall detail the frequency, methods and criteria for evaluating test results
Data shall be maintained
ESA/ESTEC
TEC-QCS
QUALITY MANAGEMENT
As a minimum, the QM
plan shall address the QUALITY
requirements of ESCC
24600
CONFORMANCE DOCUMENTATION AND
REQUIREMENTS
• A training and certification programme with periodic
recertification ( for operators involved in ESCC components
manufacture)
• An appropriate failure analysis capability has to be established
with documented procedures for the application of the
techniques and the generation of reports. This capability may
include the use of appropriate external facilities.
• A Calibration programme to meet ESCC 21500
ESA/ESTEC
TEC-QCS