Description - Electrical and Computer Engineering

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Transcript Description - Electrical and Computer Engineering

Two Semester Senior Design Capstone
ECE 4805-4806
Information Session
March 19, 2014
Gino Manzo
571-722-2667
[email protected]
Topics
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Welcome/Introductions
Objective
Approach
Motivation
Project Review
Logistics
Next Steps
Questions
Two Semester Senior Design Capstone ECE 4805- 4806
• Objective
– Provide students an “industry-like” experience that includes technical, business, and
professional skill development
• Approach
– Real-life technical problems solved by student teams
– Industry/Faculty sponsorships
• $5k/project
• Ideally 4hrs/month industry support
• Real life problem
– Student teams mentored by Subject Matter Expert, Industry POC, Instructor
– Scope:
• Business cycle (SOW,RFP, TS)-> design concept -> detailed design-> prototype>test /verification-> student poster session with industry sponsors
• Students manage budgets/schedule/customer interface
• Soft skill development (eg. communications, team dynamics, etc)
– Focus on Technical+ Business + Professional Development
– Option to existing single semester capstones
Two Semester Senior Design Capstone ECE 4805-4806
• Motivation to Change- driven by ECE Industrial Advisory Board (IAB)
– Industry wants students with
• Well rounded technical foundation
• Program management, business skills
• Developed soft skills -> best learned by practicing-> 2x
• What do you get credit for?
– For EE’s, 4805 counts as a tech elective, 4806 as a capstone design
– For CPE’s, 4805 counts as a tech elective, 4806 as a Design Technical Elective
• Key Benefits
– Students: industry exposure, networking, improved skill set
– Companies: access to student/faculty, solution to problem
– ECE: enhanced industry relationships, funding, improved alignment
• Schedule
– 1Q14: course approval and industry sponsorship solicitation initiated
– Feb/March: finalize sponsorships (goal 20)
– April/May: match students to projects
– Launch Fall 2014 semester
Project Summary
• 20 projects available
• Very Diverse: microelectronics ->establishing wireless in
residence halls
• Large/small companies; Virginia to Oregon
• Citizenship restrictions
– 14 no US Citizenship requirements
– 4 require US Citizenship (Lockheed-Martin, VPT Inc.)
– 2 prefers US Citizenship (Intel)
• No NDAs or IP agreements
• Enthusiastically Supported by Sponsors and Faculty
• Dedicated Instructor/Mentor
ECE 4805/06 Project Summary
Project
Reliability Low K Interconnect Structures **
Design/Fabricate/Evaluate Photovoltaic Cells
Design/Fabricate/Evaluate IC Transistors/Circuits
Radiation Test Methodologies, Hardware, Test Database *
Hi-Reliability Capacitor Investigation
IC Building Blocks: Design and Simulation *
Sensorless Magnetic Levitation System
Self-Organizing Coherent Distributed RF Transmitter
Infrared Sea Surface Temperature (SST) Sensor
Design/Build/Evaluate Multi-Channel Sensor Interface
High Speed Switch Fabric: Modems to Transceivers
Fluxgate Magnetometer Drive
Asymmetric Material Design Analog Circuit *
Data Stream Compression and Encryption IC *
Develop Low rate “Under” Communications Capability **
Web-enabled High Voltage Waveform Generator
Simultaneous Programming of Multiple ID Tags
Stopgap Wireless Provisioning for VT Residence Halls
Commodity Computing Core and Storage Platforms
Mobile Single Sign On
* US Citizenship Required
Sponsor
Intel Corporation – Hillsboro, OR
Micron Technology, Manassas, VA
Micron Technology, Manassas, VA
VPT Inc., VA
BAE Systems, Manassas, VA
Lockheed-Martin, Manassas, VA
National Instruments, Austin, TX
John Hopkins Applied Physics Lab, Laurel, MD
John Hopkins Applied Physics Lab, Laurel, MD
Measurement Specialties, Inc , Hampton, VA
Northrop Grumman Corp., San Diego, CA
Prime Photonics, Blacksburg, VA
Lockheed Martin
Lockheed Martin
Inmarsat
General Electric, Salem, VA
General Electric, Salem, VA
Virginia Tech Information Technology, Blacksburg, VA
Virginia Tech Information Technology, Blacksburg, VA
Virginia Tech Information Technology, Blacksburg, VA
** US Citizenship Preferred
Contact Instructor: Gino Manzo (24/7)
[email protected]
571-722-2667
Reliability Low K Interconnect Structures
Intel Corporation – Hillsboro, OR
• Description
– Learn Resistive Switching (RS) Characterization
Methodologies
– Develop test methodologies to study dielectric failures
– Design, Fabricate Low K Interconnect Structures
– Perform reliability testing/analysis
– Report results and recommend improvements
• Deliverables
– Demonstration of test structures and test
methodologies
– Bonus: conclusive results on root cause of TDDB
Design/Fabricate/Evaluate Photovoltaic Cells
Micron Technology, Manassas, VA
• Description
– Investigate trade-off of maximizing illumination area and
minimizing series resistance of a PV cell
– Design, fabricate, evaluate PV cell of at least 5x5mm,
preferably 10x10mm, with various geometries on a GaAs
or GaSb
– Learn clean room fabrication basics including
photolithography, etching and metal deposition
• Deliverables
– 2 or more photovoltaic cells with dimensions of at least 5
mm on a side
– Report describing PV characteristics as a function of top
electrode layouts
Design/Fabricate/Evaluate IC Transistors/Circuits
Micron Technology, Manassas, VA
• Description
– Fabricate p and n channel metal oxide semiconductor field
effect transistors (MOSFETs)
– Design, fabricate, evaluate circuit building blocks (e.g.
inverter, AND/OR gates, etc)
– Learn clean room fabrication basics including diffusion,
gate dielectric deposition, photolithography, etching and
metal deposition
• Deliverables
– p and n channel MOSFETS, inverter, two input AND/OR
circuits
– Report describing design, process details and test report
Radiation Test Methodologies, Hardware, Test Database
VPT Inc., VA
• Description
– Develop test methodologies for a host of power
converter piece parts (e.g. op amplifiers, transistors,
diodes, pulse width modulators circuits, etc)
– Design and build supporting test hardware
– Support radiation testing of components
– Analyze and document results
• Deliverables
– Printed circuit boards designed to test various
components,
– C++ programs for test solutions,
– Data analysis report including statistical analysis
Hi-Reliability Capacitor Investigation
BAE Systems, Manassas, VA
• Description
– Space Computers have 500+ highly reliable capacitors
Location, value, reliability are critical for success
– Develop Stress Test Methodologies (similar to Mil-Std-202 and
Mil-PRF-123) for a host of capacitors types
– Design/Build test hardware
– Generate statistically significant reliability database
– Analyze failure modes, provide user recommendations, design
handbook
– Option: Extend analysis to other computer components
• Deliverables
– Printed circuit boards designed to test various capacitors
– Test methodologies document; Design handbook
– Data analysis report including statistical analysis
IC Building Blocks: Design and Simulation
Lockheed-Martin, Manassas, VA
• Description
– Schematic level design and simulation of IC building blocks based on
requirements provided by LM ( design work can be done using
TowerJazz or IBM’s SiGe PDK’s)
– IC blocks include:
• LNA design for ISM bands ~2.5Mhz
• VGA again for ISM bands
• Active mixer, Gilbert Cell type
• Output amplifier, +13 to +20 dBm output power again in ISM band
– From the designs above, build (in Cadence) a receiver design
as a group
•Deliverables
– Block schematics, simulations, layouts, post layout simulations
– Integrated receiver schematic, layouts, and simulations
Sensorless Magnetic Levitation System
National Instruments, Austin, TX
• Description
– Currently a rudimentary design has been simulated
– Objective innovate, refine, extend, and build
• Deliverables
– Slower than real-time FPGA co-simulation demonstrating stable and
robust sensorless magnetic levitation control system.
– Real-time simulation demonstrating stable and robust sensorless
magnetic levitation control system.
– Globally optimized cyber-physical system (CPS) design. Optimization
spans electromagnetic, power electronics and control software domains.
– Working physical prototype utilizing open source 3-phase inverter
research board and demonstrating stable and robust sensorless magnetic
levitation control system.
– Real time signal level hardware-in-the loop(HIL) simulation for
comprehensive validation and verification of the sensorless magnetic
levitation control system.
Self-Organizing Coherent Distributed RF Transmitter
John Hopkins Applied Physics Lab, Laurel, MD
• Description
–Students will develop a self-organizing coherent distributed
RF transmitter
– A small number (<6) of nodes comprised of inexpensive
microcontrollers with DAC capability (ex. Arduino Due)
must through wireless communications determine their
relative positions and transmit a coherent signal towards a
given direction.
–Nodes will include RF upconverters to utilize a reasonable
coherent transmit frequency (nominally VHF).
– A goal of 90% of the theoretical coherent gain from all
nodes measured at a receiver is desired.
• Deliverables
– Demonstration of coherent transmit, final report
Infrared Sea Surface Temperature (SST) Sensor
John Hopkins Applied Physics Lab, Laurel, MD
• Description
– Design and build a compact, inexpensive, low-power and
highly-accurate infrared (IR) sea surface temperature (SST)
sensor
– Capable of being mounted on an unmanned aerial vehicle
(UAV) or ruggedized and deployed on a buoy
–This sensor is to be used for more timely and reliable data
collection than what is afforded by polar-orbiting satellites since
the sensor would be able to collect data continuously and when
clouds are present (which currently obscures IR satellite
measurements).
• Deliverables
– System design and prototype sensor package with
understanding of accuracy, repeatability (between various
sensors) and documented calibration procedure
Design/Build/Evaluate Multi-Channel Sensor Interface
Measurement Specialties, Inc , Hampton, VA
• Description
–Design Multi-channel Sensor Interface with following
components
• Analog Front End to be digitized
• FPGA implemented Micro-sequencer
• FPGA implemented low pass filter
• FPGA implemented SPI interface
• Option: FPGA implemented conversion engine
• Option: Microprocessor or FPGA implemented
Communications Protocol for command, control, and
data streaming
• Deliverables
– FPGA design code and documentation of the above
High Speed Switch Fabric: Modems to Transceivers
Northrop Grumman Corp., San Diego, CA
• Description
– Develop hardware that supports feasibility of a high speed switch
fabric that interfaces digital modems (FPGA/DSP/ASIC) to
transceivers (RF-mixed signal).
Power Cable
VITA Power Supply
Spectrum Analyzer
Connector
VITA Power Supply
SMA
SMA
SMA
to
MCX
SRIO Switch Module
T
R
Signal Generator
XCVR Module 1
SRIO (ADC/DAC Data)
SMA
SMA
Waveform
Processor Module 1
R
Signal Generator
XCVR Module 2
SRIO (ADC/DAC Data)
SRIO (ADC/DAC Data)
Ethernet Switch
Ethernet
Controller
Module
•Deliverables
Cat5a Enet
R
J
4
5
Signal Generator
SMA
to
MCX
T
Waveform Processor
Module 2
I2C Ctrl
PC with
GUI Application
R
Ethernet
T
Debug Ethernet
Module
– Limited demonstration of switch
– Design and test documents
Ethernet
Ethernet
Spectrum Analyzer
SMA
SMA
T
SRIO (ADC/DAC Data)
High
Speed
Switch
Fabric
Ethernet
SMA
to
MCX
Spectrum Analyzer
OSCILLATOR
VITA Rack
SMA
to
MCX
Spectrum Analyzer
Power Supply
(300 Watt)
R
Spectrum Analyzer
SMA
SMA
Signal Generator
Fluxgate Magnetometer Drive
Prime Photonics, Blacksburg, VA
• Description
– Design and construct a fluxgate magnetometer drive and
measurement package
– Fluxgate magnetometer is a device that measures the
intensity and orientation of magnetic lines of flux
–Optimize frequency/amplitude to achieve lowest SNR for
novel metallic being developed by Prime Photonics
– Develop drive hardware, construct, evaluate
– Option: participate in EM of novel material
– Option: conduct demo at NASA Goddard (Spring 2015)
•Deliverables
– System prototype, design and test documents
Asymmetric Material Design Analog Circuit
Lockheed Martin, (Space Systems)
• Description
– Traditional circuit design focuses on miniaturization. New materials such as conductive
inks, dielectric polymers, powders, nanomaterials and “organic electronics” are now
available widely from a range of catalog sources.
– This project will define boundaries for what analog circuits are possible with catalog
materials using hand tool application techniques such as paint brush, syringe, template and
spray application.
– Phase 1 – material sourcing and element testing
• Create catalog of Asymmetric Electronic Materials
• Build/test Asymmetric Analog Circuit elements – characterize performance
– Phase 2 – design/build circuit
• Use performance data from Fall Semester to design a useful analog circuit
• Build and test circuit using Asymmetric Materials
• Deliverables
– Catalog of available Asymmetric Electronic Materials (characteristics, cost, etc..)
– Asymmetric Circuit Element performance data (transistors, resistors, capacitors,
interconnects, etc..)
– Circuit Design of a useful analog circuit using Asymmetric Electronic Materials
– Asymmetric Materials Analog Circuit performance data and ‘YouTube’ video
Data Stream Compression and Encryption IC
Lockheed Martin
• Description
– Near-real time Data Stream Compression and Encryption IC based on
requirements provided by LM.
– ASIC based option: System level and architecture design of ASIC. Initial
simulation and performance characteristics, layout and re-simulation, and
re-design to meet requirements post layout.
– FPGA based option: Block level design and simulation of the FPGA.
Initial performance characteristics Refinement and implementation of the
FPGA schematic design, simulation with real data.
• Deliverables
– Schematic Design, Netlist (FPGA),FPGA or ASIC simulations, Expected
performance characteristics, Block Layouts (ASIC option),Updated
Simulations (ASIC option),Updated schematics, FPGA option: Real data
simulation results, performance characteristics
Simultaneous Programming of Multiple ID Tags
General Electric, Salem, VA
• Description
– Design and create a device for simultaneous programming of multiple
Maxim 1-Wire ID tag devices
– This project uses the open source data from Maxim Integrated to
match the performance of the DS9097U-E25 to program up to 6
DS2502 devices simultaneously.
– The project will employ a USB 2.0 connection to the programmer with
a user interface and API definition.
– Future scalability could include the ability to program more than six
devices simultaneously.
• Deliverables
– Detailed design documents
– Working Prototype
– Software source code
– Final design should be ready for small lot production (10-100)
Web-enabled High Voltage Waveform Generator
General Electric, Salem, VA
• Description
– Develop a small electronic board that will have two 4-20ma analog inputs used to
control frequency (0-20Khz) and amplitude of an AC waveform output.
– The output will be able to provide 0-150 Vpk-pk with an isolated output.
– Current output should be limited between 10ma - 30ma. Designed to meet
EN61010-1 3rd edition.
– The configuration, such as scaling, should be done through an Ethernet port.
– Future scalability could include:
• Interlink between 3 boards to allow for simulated 3 phase output.
• The ability to generate an arbitrary waveform.
• Besides a simple automation interface, also allow a web based interface
• Deliverables
– Detailed design documents
– Working Prototype
– Software source code
– Final design should be ready for small lot production (10-100)
Develop Low rate “Under” Communications Capability
Inmarsat
• Description
– Perform system trades to develop an architecture for M2M
waveforms at Ka-band
– Signals shall be spread to enable operation over satellites
without interference to primary users
– Prototype hardware is developed to demonstrate throughput
and interference capability
– Tests will be done on an Inmarsat satellite simulator or across a
live Inmarsat satellite
• Deliverables
–System architecture and link budgets
–Working Hub Prototype modem
–Working Terminal Prototype modem
–Test results, all documentation and software
Stopgap Wireless Provisioning for VT Residence Halls
Virginia Tech Information Technology, Blacksburg, VA
• Description
– Problem: Freshmen come to campus expecting wall-to-wall wireless,
especially in their residence hall rooms. Wireless service is unavailable
in many places, and residents use up a lot of data minutes on their
smart phones.
– A stopgap measure would be to lease secure, high quality wireless
routers for students to connect to their Ethernet ports
– Optimize and remediate performance problems due to rogue routers,
physical obstacles such as Hokie stone, and capacity shortages on
some switch nodes.
– Enable optimum popular wireless applications such as gaming and
media streaming
• Deliverables
– Prototype system demonstration
– Documented system design
– Source code for any associated tools for configuration and monitoring
Commodity Computing Core and Storage Platforms
Virginia Tech Information Technology, Blacksburg, VA
• Description
– Develop a Virginia Tech commoditized parts computing core and storage
platform for use by IT and other interested parties.
– Utilize off-the-shelf OEM parts to build a low cost, energy efficient,
scalable and redundant computing architecture.
– Base work on existing technologies such as http://www.opencompute.org/
and http://blog.backblaze.com/2013/02/20/180tb-of-good-vibrationsstorage-pod-3-0/
– Utilize locally developed 3D printing, custom electrical circuit design,
vibration-dampening materials, and locally develop management software
to eliminate existing design limitations.
• Deliverables
– Custom-developed compute server and storage platform
– Complete design documents for building energy efficient, scalable and
redundant computing server platform
– Locally developed cross-platform software to centrally manage n+1 server
platform nodes
Mobile Single Sign On
Virginia Tech Information Technology, Blacksburg, VA
• Description
– Problem: Identity Management Services (IMS), recognizes the need
for a Single Sign On (SSO) infrastructure for native mobile
applications.
•Native applications typically store passwords individually, many
times in plain text, providing both bad security and poor user
experiences.
– One solution is a Native Authorization Agent as proposed to the
OpenId Foundation (http://goo.gl/rzgYAz).
– Create open source implementation of the OpenId proposal to
potentially be used by the university and offered to the larger higher
education and identity communities.
–Deliverables
•Software code for at least Android and/or iOS
•Associated documentation of the design, implementation, and
testing
Class Format (Subject to change)
Class will consist of lectures, team time, customer time,
instructor mentoring
ECE 4805
• Business Process
10%
• Design Concept
20%
• Design Implementation
30%
•
Detailed Design- 20%
•
Simulations- 10%
• Project Management
10%
• Communication
10%
• Professional Development
20%
(such as leadership/team member traits &
behaviors, listening skills, identifying
strengths, weaknesses)
ECE 4806
• Design Implementation
60%
•
Simulations- 10%
•
Prototyping -20%
•
Design of Experiments- 10%
•
Test/Validation-20%
• Project Management
10%
• Communication
10%
• Professional Development
20%
(such as leadership/team member traits &
behaviors, improving
strengths, weaknesses, interviewing skills
diversity, inclusion, ethics)
Textbooks (Subject to change)
Recommended Reference Material
• Design for Electrical and Computer Engineers, by Ralph Ford and Chris Coulston,
Edition: 1, 336 pages, Publication Date: March 31 2005, Publisher: McGraw-Hill Higher
Education, ISBN: 0073380350
• Electronic Measurement and Instrumentation by Klass b. Klassen, 343 pages,
Publication Date: November 2003, Publisher: Cambridge University Press, ISBN:
0521471575
• Optimization of Electronic Measurements, by Chistie Enke, Stanley Crouch, Gary
Horlick, Howard Malmstadt, 203 pages, Publication Date: January 1, 1974, Publisher:
W. A. Benjamin, ASIN: B0006CBO0W
• The 5 Dysfunctions of a Team, by Patrick Lencioni, 240 pages, Publication Date: June
3, 2010, Publisher: John Wiley & Sons, ISBN-10: 9780787960759
• Micromessaging, by Stephen Young, Edition: 1, 224 pages, Publication Date: October
2006, Publisher: McGraw-Hill Professional Publishing, ISBN-10: 0071467572
• Leading Change, by John Kotter, 208 pages, Publication Date: September 1996,
Publisher: Harvard Business Review Press, ISBN: 0875847471
Next Steps
• Sign up for Class!!
– March 25th- April 1st
• Send me an email with Prioritized Project Preference
– 1_____
– 2_____
– 3_____
• Contact me if any questions/concerns
Gino Manzo
[email protected]
571-722-2667
Questions