Transcript transparencies

Low Voltage Power Supplies
I.
II.
III.
IV.
V.
VI.
VII.
VIII.
IX.
X.
Placement
Size
Power consumption
Cabling
Regulators board blocs
Component selection
Schematics
Firmware
Prototype design
Schedule
February 2005 – Barcelona
I.
Placement
At pannels with less MAPMT.
27 VFE maximum per 2 power supplies.
14 VFE maximum per regulators board.
Regulator board divided in two to reduce
power consumption per regulator board, so
7 VFE maximum per regulators board.
TOTAL of 16 Regulator Boards to be
produced.
II.
Size
Power supplies
Max: 476x670mm2
III. Power consumption
Consumption VFE:
+1’65A = 1408 mA
- 1’65A = 1280 mA
+1’65D = 604 mA
- 1’65D = 604 mA
+ 3’3A = 256 mA
+ 3’3D = 300 mA
With a maximum of 1’5A per regulator the
number of regulators per box are;
-14 regulators +1’65A (7 per board)
-14 regulators –1’65A (7 per board)
-7 regulators +1’65D (3 per board)
-7 regulators –1’65D (3 per board)
-3 regulators +3’3A (1 per board)
-3 regulators +3’3D (2 per board)
An other regulator for FPGA and electronics
consumption.
Maximum voltage drop per regulator
of 1’5V.
Voltage of power supplies may be of
+4’8V, +3’15V, -3’15V. In this
conditions and with a current of 1’5A
every regulator, the total power
consumption is;
-31’5W in +1’65 regulators
-31’5W in –1’65 regulators
-13’5W in +3’3 regulators
-TOTAL 76’5W!!! Each box
Monitoring of voltage, current, and board
temperature using a ProASIC FPGA with
ADC and inputs multiplexed.
IV. Cabling
Using voltages of +4’8V, +3’15V, -3’15V distribution should be:
Power supplies
+3’15 V
 200 A
4-5 ch
-3’15 V
5 ch
+4’8 V
1-2 ch
 50 A
to +1’65V R
E
G
U
to -1’65V
L
to GND
A
T
O
R
to +3’3V S
Regulator Board Blocs
Current measurement
throug FUSE
OpAmp
Voltage measurement
Amplification
Positive
Regulators
Negative
OpAmp
Regulators
CM change
Vref
OpAmp
Vsub
CM change
NTC
Resistors
M
U
X
A/D
Wheatstone
Bridge
Outer temperature
sensors
Inhibit control
FPGA
Transceivers
V.
I2C
LVDS
VI. Component selection
-APA 150 FPGA (TQ100) for its flexibility in design (flash) , easy to solder
(not BGA). Not as much radiation hard as Axcelerators.
-AD9203 10bits ADC, 40Msamples/s, 5 level depth pipeline, radiation hard.
-MAX4581 octal analog multiplexers, low resistance, radiation hard.
-DS92LV010 bidirectional CMOS/LVDS transceiver, radiation hard.
-BFT93, PNP high frecuency transistor, radiation hard.
-100mOhms fast fuses being used as Shunt resistors for current monitoring.
-TLV2462 dual package rail-to-rail opamps, radiation hard.
-L4913, L7913, Low Drop Out 3A adjustable voltage regulators, radiation hard.
-Normal crystal oscillator (JCO14-3-B40.0MHz). Radiation hardness?? (Alice
tests of comercial oscillators, no problems with 100krad).
VII. Schematics I. Positive regulators
-L4913
-Protection diode at
output.
-Local voltage
monitoring.
-Fuse used as shunt for
current measurement.
-Led indicator of
inhibit state.
750 
 R19 

VO  V ADJ .1 

1
,
225
.
1



  1'68V
 R13 
 2000 
R13  2k5
VII. Schematics II. Negative regulators
-L7913
-Protection diode at
output.
-Local voltage
monitoring.
-Fuse used as shunt for
current measurement (at
output for a low CM).
-Led indicator of inhibit
state.
750 
 R123 

VO  VADJ .1 
  1,225.1 
  1'68V
 R117 
 2000 
R13  2k5
VII. Schematics III. Positive current sensing
-Differential amplifier.
-Gain 20. Over 100mOhms; 1V = 1A.
-CM input from GND to 3’3V.
-Output max= 2V for ADC.
VII. Schematics IV. Negative current sensing
-Differential amplifier.
-Gain 20. Over 100mOhms; 1V = 1A.
-CM input from -1’65V to 1’65V.
-Output max= 2V for ADC.
-Output min= GND.
VII. Schematics V. MUX
- 8 to 1 analog MUX.
-If chip not enabled output in High Z
mode.
-Control via enable and ABC inputs.
-ABC in paralel for all MUX.
-ADC_IN in paralel for all MUX.
VII. Schematics VI. FPGA
-Hardware RESET.
-6 bit I2C selection.
-Independent Clock.
VII. Schematics VII. FPGA power start-up delay
-ACTEL notes recommend first
power Input core and then output
buffers. This is done with a delay in
INHIBIT pin of regulators.
-Delay dependent with RC constant.
-Permits FPGA control of Inhibit.
VII. Schematics VIII. I2C hardware
-Differential I2C with SDA direction control.
-By default receiving data (I2C slave).
- Double connector for bus calbing.
VIII. Firmware. FPGA Blocs.
I2C FSM.
Combinational bloc 1
Clock division to ADC.
Idle until I2C
command. R/W
registers.
MUX control.
ADC samples
RAM blocs
Samples
Status registers
Combinational bloc 2
Check samples
Channel limits
Combinational bloc 4
Tripple voting
Combinational bloc 3
Inhibit update from
Status registers
IX. Prototype design
-282x85mm2
-6 layer pcb, GND, +3’15, -3’15 planes.
-1000uF input capacitors.
-6 AWG12 cables (per input voltage) -> low losses in long cabling.
-12 AWG20 cables for output power and Vref Vbias signals.
-JST 3A (XA) and JST 20A(EV) connectors.
X.
Schedule
-Prototype tests start MARCH.
-Firmware development MARCH-APRIL.
-Tests with load and I2C master (emulation of Control
Board) APRIL-MAY.
-Final revision and start of production JUNE.
-Test of production SEPTEMBER.