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Glasgow Update
Andy Blue
Update
• ABCn130
– Dicing and FIB work
– Wire bond trials
– Bonding program v3
• X-ray imaging of Glue Coverage
• Spending
– Cabinets
• ATLAS12 measurements
– Analysis software
Andy Blue
WP3 Strip Meeting
ABNc 130
• First ABCn chips are now with FIB group
– Remainder of chips to be diced
• 30 for FIB
• Remainder for wire bond trials
– Plan is to hand out to groups at AUW
• As well as Glass ASICs
Andy Blue
WP3 Strip Meeting
130nm Bonding Parameters
• 2nd Wire bonding trials began
– Using back to back abcn130 chips
• Separated by 1.5mm to allow 30o angle with 500um bond loop height
– used chips from periphery of wafer
• Bonds to go down next few days
– Will look at the lower bond forces suggested at last meeting
Andy Blue
WP3 Strip Meeting
QA - Wire bonding Programs
•
Now have a range of programs for wire bonding QA
–
250nm Barrel
• Hybrid work
– V1 : Records bond number and fault
– V1.2: Records bond number and tells user info
on bond
• Module Work
–
130nm Barrel
• Hybrid Work
V3 finished last week
•Able to cope with
Different hybrids and modules for
both endcap and barrel
Different bond programs for
different institutions
• User chooses appropriate .h file for
usage
Andy Blue
WP3 Strip Meeting
QA – SVN repository
•
As of last have SVN account at CERN
Andy Blue
•
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Means anyone can download the version they want
Can play with/optimise code
Will let others know when ready to download from
•
Can use same area for other code (eg vac monitoring)
WP3 Strip Meeting
Medipix Hybrid Pixel Detector
• Had this idea for a while
– Use the Medipix chip to X-ray the ASIC gluing
– Images taken of Module via Bart over various areas
• 60Kev (Vp) X-rays with 1s acquisitions
Medipix/Timepix
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Andy Blue
65k single-photon counting
pixel array;
Square pixel size of 55 µm;
14x14 mm area;
Electron or hole collection;
Threshold equalisation;
Count rate of ~100 kHz;
Readout in 300 µs;
High dynamic range;
WP3 Strip Meeting
X-ray Imaging – ASIC Gluing
• Scanned glued hybrid on Module
(from Bart)
• Very clear Imaging of glue spots
• Rough analysis shows glue coverage
of 39%
• Good for
• Sanity check
• Initial 130nm glues?
Andy Blue
WP3 Strip Meeting
BCC on Module
• Imaging of BCC on the
module
• Tuning “should” allow me
to see the module to hybrid
glue as well
• We also have an
automated stage that can
be used to raster scan a
full module
Andy Blue
WP3 Strip Meeting
Spending
• Dry storage cabinets
– Delivery dates of Tue 25th and Wed 26th March
– FAO Cambridge & RAL to successfully receive these as a
Glasgow order I need a scan of the delivery confirmation
from your sites
• Almit ran out of component for model ordered
–
“The original HSD-1106-51 had a basic control unit and display but it has been replaced with a
SIEMENS display and controller (that has been used on more expensive Totech cabinets for
about 5 years) that makes the dry unit operate more efficiently …..and operates in a
SMARTER way…”
–
“it dries faster (recovers quicker) after door openings and holds the RH set point more
accurately…so the performance is better…”
–
“They should be sold at a higher price…but yours prices won’t change.”
Andy Blue
WP3 Strip Meeting
ATLAS12 measurements
• Fixed Analysis code
– Returns correct (bad) CCE from irradiated sample under test
– Writing additional code that plots measurements from multiple
files for given sample
• E.g. CCE measurements for varying voltage and automatically
plots in ROOT
Example of code in testbeam
reconstruction
Plots cluster size from various input
files
Andy Blue
WP3 Strip Meeting