Transcript The Role of Packaging in Microelectronics

The Role of Packaging in Microelectronics
Definition of Microelectronics. Microelectronic
Devices, IC Packaging, Purposes of IC
Packaging, Semiconductor Roadmap, IC
Packaging Challenges,
DMT 243 – Chapter 2
M.Nuzaihan
The Role of Packaging in Microelectronics
INTEGRATED CIRCUITS (ICs)
Microchips with a
transparent
window, showing
the
integrated
circuit inside
Integrated circuit of Atmel Diopsis
740 System on Chip showing
memory
blocks,
logic
and
input/output pads around the
• Resulting in miniaturized product
became low in cost and high in
reliability.
periphery
The integrated circuit from
an Intel 8742, an 8-bit
microcontroller that includes
a CPU running at 12 MHz,
128 bytes of RAM, 2048
bytes of EPROM, and I/O in
the same chip
DMT 243 – Chapter 2
• An integration of many such circuit
blocks (discrete components such
as transistors, diodes, capacitors,
resistors were mounted on the
PWB) or components on a single
chip
• Can be as small as 1mm to 30 mm
• also known as IC, microcircuit,
microchip, silicon chip, or chip
M.Nuzaihan
The Role of Packaging in Microelectronics
Types of ICs
ICs are divided into two categories:
An
(orangeepoxy)
encapsulated
hybrid circuit on
a printed circuit
board.
• Hybrid IC (HIC)
- Contains interconnected diodes, capasitors and resistors
fabricated on asingle plastic, ceramics or insulated aluminium
substrate.
- Has the capability of performing a complete electronic circuit
function.
- Involves two or more material types.
• Semiconductor ICs /Monolithic ICs /Silicon Chip
- Contains devices fabricated from semiconductor materials.
DMT 243 – Chapter 2
M.Nuzaihan
The Role of Packaging in Microelectronics
IC Evolution
• The first IC in the
world in the
world in the
1960s had only
about 10
elements.
• Then LSI to VLSI
• ULSI/GSI – level
of 20 to 100
million transistor
per chip.
• Now – IC is
projected to
reach a billion
transistor on a
single chip
(SOC)
DMT 243 – Chapter 2
M.Nuzaihan
The Role of Packaging in Microelectronics
IC Evolution
DMT 243 – Chapter 2
M.Nuzaihan
The Role of Packaging in Microelectronics
IC Packaging
• Integrated circuit packaging is the final stage of
semiconductor device fabrication
• In the ICs industry it is called packaging and
sometimes semiconductor device assembly. Also,
sometimes it is called encapsulation or seal (by the
name of its last step).
DMT 243 – Chapter 2
M.Nuzaihan
The Role of Packaging in Microelectronics
IC Packaging
• Most ICs are bonded to small IC packages
- It is possible to attach chips directly to boards. Method used
extensively in low-cost consumer electronics. Placing chips in
packages enables independent testing of packaged parts, and
eases requirements on board pitch and P&P (pick-and-place)
equipment.
•
IC Packages
- inexpensive plastic packages: <200 pins
- packages with >1000 pins available
(e.g. Xilinx FF1704: 1704-ball flip-chip BGA)
• IC Packaging Materials
- Plastic, ceramic, laminates (fiberglass, epoxy resin), metal
DMT 243 – Chapter 2
M.Nuzaihan
The Role of Packaging in Microelectronics
IC Packaging
DMT 243 – Chapter 2
M.Nuzaihan
IC Packaging
Au wire
Solder Bump
Underfill
Chip
Substrate
Molding Compound
Solder Joint
Leadframe
Solder
Joint
Printed Circuit Board
Chip
1st-level
Interconnect
DMT 243 – Chapter 2
Pin Thru. Hole
Encapsulation
Package
(Substrate or leadframe)
2nd-level
Interconnect
PCB
M.Nuzaihan
The Role of Packaging in Microelectronics
IC Packaging Classification
IC package categories:
PTH (pin-through-hole)
Pins are inserted into through-holes in the circuit board and
soldered in place from the opposite side of the board
» Sockets available
» Manual P&P possible
DMT 243 – Chapter 2
M.Nuzaihan
The Role of Packaging in Microelectronics
IC Packaging Classification
SMT (surface-mount-technology)
SMT packages have leads that are soldered directly to corresponding
exposed metal lands on the surface of the circuit board
» Elimination of holes
» Ease of manufacturing (high-speed P&P)
» Components on both sides of the PCB
» Smaller dimensions
» Improved package parasitic components
» Increased circuit-board wiring density
DMT 243 – Chapter 2
M.Nuzaihan
The Role of Packaging in Microelectronics
DMT 243 – Chapter 2
M.Nuzaihan
The Role of Packaging in Microelectronics
IC Packaging Material
Plastic
– die-bonding and wire-bonding the chip to a metal lead frame
– encapsulation in injection-molded plastic
– inexpensive but high thermal resistance
– Warning: Plastic molds are hygroscopic
» Absorb moisture
• Storage in low-humidity environment. Observation of factory floor-life
» Stored moisture can vapourise during rapid heating
• can lead to hydrostatic pressure during reflow process. Consequences
can be: Delamination within the package, and package cracking. Early
device failure.
DMT 243 – Chapter 2
M.Nuzaihan
The Role of Packaging in Microelectronics
IC Packaging Material
Plastic
Details of a typical plastic package
DMT 243 – Chapter 2
M.Nuzaihan
The Role of Packaging in Microelectronics
IC Packaging Material
Ceramic
» consists of several layers of conductors separated by layers of ceramic
(Al2O3 “Alumina”)
» chip placed in a cavity and bonded to the conductors
Note: no lead-frame
» metal lid soldered on to the package
» sealed against the environment
» ground layers and direct bypass capacitors possible within a ceramic
package
» high permittivity of alumina (εr=10)
Note: High permittivity leads to higher propagation delay!
» expensive
DMT 243 – Chapter 2
M.Nuzaihan
The Role of Packaging in Microelectronics
DMT 243 – Chapter 2
M.Nuzaihan
The Role of Packaging in Microelectronics
DMT 243 – Chapter 2
M.Nuzaihan
The Role of Packaging in Microelectronics
Popular IC Packages
Plastic Dual-In-Line
(PDIP)
PDIP14
Small Outline
Integrated Circuit
(SOIC)
SO14
DMT 243 – Chapter 2
SC70
SC70-5
Thin Shrink
Small Outline
(TSSOP)
TSSOP14
M.Nuzaihan
The Role of Packaging in Microelectronics
Popular IC Packages
Plastic Lead Chip
Carrier (PLCC)
PLCC28
DMT 243 – Chapter 2
Thin Quad Flat
Package
(TQFP)
TQFP32
M.Nuzaihan
The Role of Packaging in Microelectronics
Popular IC Packages
Small Outline Integrated Circuit (SOIC)
• Available from SO8..SO28
• Gull-wing leads
• Popular, cost effective, and widely available IC package for low-pin-count ICs
• Dimensions: 8.6mm x 3.9mm x 1.75mm
• Pin-to-pin: 1.27mm (50mil)
DMT 243 – Chapter 2
M.Nuzaihan
The Role of Packaging in Microelectronics
Popular IC Packages
Thin Shrink Small Outline (TSSOP)
• Available up to TSSOP64
• Popular, cost effective, and widely available IC package for low-profile applications
• Dimensions: 5.0mm x 4.4mm x 1.2mm
• Pin-to-pin: 0.65mm (25mil)
DMT 243 – Chapter 2
M.Nuzaihan
The Role of Packaging in Microelectronics
Popular IC Packages
Ball Grid Arrays (BGA)
• Shown: BGA54
• Available pin count >1700
• Advanced IC package for high-density low-profile applications
• Chip-scale package (CSP)
• Dimensions: 8.0mm x 5.5mm x 1.4mm
• Pin-to-pin: 0.8mm
• Low lead inductance
DMT 243 – Chapter 2
M.Nuzaihan
DMT 243 – Chapter 2
M.Nuzaihan
List of plastic mold package
DMT 243 – Chapter 2
M.Nuzaihan
List of Ball Grid Array Packages
List of Ball Tape Carrier Packages
DMT 243 – Chapter 2
M.Nuzaihan
The Role of Packaging in Microelectronics
Purposes of IC Packaging
•
To provide the signal and power distribution of the
packaged IC to the systems.
•
To provide mechanical support and robustness to the
fragile IC.
•
To provide for environmental protection of the IC
•
To dissipate heat generated by IC chips
•
To facilitate the packaging and handling of IC chips
DMT 243 – Chapter 2
M.Nuzaihan
The Role of Packaging in Microelectronics
Requirements for IC Packaging
•
Must provide acceptable electrical properties, including
capacitance, resistance and inductance.
•
IC assembly technologies should provide a low cost solution
for the electrical interface between the chip and package.
•
High throughput manufacturing.
•
High reliability.
•
Repairability or replaceability where interconnection
between IC and package should provide removal of the failed
IC.
DMT 243 – Chapter 2
M.Nuzaihan
The Role of Packaging in Microelectronics
SEMICONDUCTOR ROADMAP
•
•
•
•
Updated every 2 years by a group of semiconductor companies
known as Semiconductor Industry Association (SIA).
The roadmap is called International Technology for
Semiconductors (ITRS).
Three most important parameters for packaging are:
(1) I/O which controls the pitch of the IC package;
(2) Size of the IC which controls the reliability of the IC to
package connection;
(3) power which controls heat dissipation properties of IC and
system-level packaging.
http://www.itrs.net/Common/2004Update/2004Update.htm
DMT 243 – Chapter 2
M.Nuzaihan
The Role of Packaging in Microelectronics
DMT 243 – Chapter 2
M.Nuzaihan
The Role of Packaging in Microelectronics
DMT 243 – Chapter 2
M.Nuzaihan
The Role of Packaging in Microelectronics
DMT 243 – Chapter 2
M.Nuzaihan
The Role of Packaging in Microelectronics
IC Packaging Challenges
Team Work Activity
DMT 243 – Chapter 2
M.Nuzaihan
The Role of Packaging in Microelectronics
(NEXT WEEK)
Wafer Back Grinding, Die Preparation, Die
Attach, Wire Bonding, Die Overcoat, Molding,
Sealing, Marking, DTFS, Lead Finish,
Electrical Testing, Tape & Reel, Dry Packing,
Boxing and Labeling.
DMT 243 – Chapter 2
M.Nuzaihan