Transcript TynaxListing823

Listing 823.
GPON/EPON the next generation of broadband
optoelectronics system on a chip
GPON on a Chip
 GPON/EPON the next
generation of broadband
optoelectronics system on
a chip
 Optical networking.
 Use of proven
semiconductor fabrication
technology to build a low
cost, integrated electrical
and optical system on the
same IC chip (GPON).
Market
 Primary market is
manufacturing of electrical
and/or optical network
communication
components.
 This is a global opportunity
as high-speed networks
are being installed all over
the world.
Market Growth
 Significant global growth
for the PON technology is
predicted in the next five
years.
 Worldwide market for
GPON electronics -- optical
network terminals (ONTs)
and optical line terminals
(OLTs) -- will be worth
$4.7 billion in 2011, up
from about $1.3 billion this
year.
Major players
 Verizon
 Ericsson AB
 Alcatel-Lucent
 France Telecom
 Nokia Siemens Networks
 Cisco
 Intel
 PacketFront
Problem Solved by the Technology
 Integration between
optical and electronicsbased systems by using a
single device.
 Today the connectivity is
made through specially
made couplers and
components that have
relatively higher losses,
more expensive to
manufacture, and are less
reliable.
How the Technology Solves the
Problem
 A proven semiconductor
manufacturing processes
and methodologies, which
are very precise, reliable,
and at a lowest cost of
manufacturing.
Technology Deployment
 Delivered to the
manufactures via systems
and processes used by
semiconductor
manufacturing companies.
 The products will be sold
to the network content
providers.
Competitive Advantage
 Significant cost savings.
 Lower cost resulting from
fewer components.
Development Platform
 Manufactured with
semiconductor processing
tools.
Development Status
 Near prototype stage.
 Optical coupler is ready for
production, detectors and
filters are off the shelf, the
laser diode needs to be
reconfigured, gratings on
the silicon substrate need
optimization.
Intellectual Property Ownership
 The I.P. belongs to the
seller, a large U.S.
semiconductor
manufacturing materials
company.
 There are no known liens
or encumbrances.
Patent Status
 U.S. Patents Pending:
 1. Patterning 3-D
Features in a Substrate.
2. Optical Coupling to IC
Chip.
 3. Multiplexed Optical
Sub-Assembly.
 4. Wafer Level
Alignment of Optical
Elements.
 Patent information
provided upon request.
Productization
 The existing development
team is in Silicon Valley,
USA.
 Some engineering
resources would be
required to complete the
development.
 The team and know-how
are available from the U.S.
Deal Structure Sought
 The deal structure
envisaged is the sale of
this technology asset.
 Acquisition in 3 parts:
 Initial acquisition.
 Payment triggered when
patents are issued.
 Royalties on product
sales
 3-5% Royalties
Frequently Asked Questions And
Answers
 Why is the developer of
this technology listing this
technology?
 Although the developer
is a Fortune 500
company, it supplies
semiconductor
manufacturers and does
not have existing
channels to bring this
product to market.
Follow Up
 Please refer to Tynax listing
number: 823 with regard to
this opportunity.
 Inquiries should be directed
to:
 Moshe Sarfaty
 [email protected]
Thank You