1310_JA_EHS_LiaisonR_for_SEuropa_r1.0

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Transcript 1310_JA_EHS_LiaisonR_for_SEuropa_r1.0

Japan Environmental, Health and Safety
Committee Liaison Report
SEMICON Europa 2013 Meetings
October, 2013
Leadership
• Committee Co-chairs
– Supika Mashiro/ Tokyo Electron
– Hidetoshi Sakura/ Intel
• GCS voting member
• EHS Committee representative to the JRSC
– Moray Crawford/ Hatsuta Seisakusho
• GCS voting member
Leadership Changes of Task Force
• Task Force Leadership
– S18 Revision Task Force
• Since the all tasks have been finished, the TF was
disbanded, and Supika Mashiro/ Tokyo Electron and
Moray Crawford/ Hatsuta Seisakusho were relieved of
the TF co-leader position.
– GHG Emission Characterization Task Force
• Minoru Kagino/ Toshiba stepped down as a co-leader
of the TF, and Tetsuya Kitagawa/ Sony took over.
Committee Organization
EHS Committee
Supika Mashiro/ TEL
Hidetoshi Sakura/ Intel
Moray Crawford/ Hatsuta Seisakusho
Disbanded
FPD System Safety TF
Ikuo Goto/ Murata Machinary
Naokatsu Nishiguchi/
Dainippon Screen MFG
S18 Revision TF
Supika Mashiro/ TEL
Moray Crawford/ Hatsuta
STEP Planning WG
Kenji Sugihara/ Panasonic
S23 Revision TF
George Hoshi / TEL
Lauren Crane/ KLA-Tencor
Seismic Protection TF
Eiji Nakatani/ Dainippon Screen MFG
GHG Emission
Characterization TF
George Hoshi / TEL
Tetsuya Kitagawa/ Sony
Meeting Information
• Last Meeting
– September 26, 2013 during Japan Fall Meetings
2013 at SEMI Japan, Tokyo, Japan
• Next Meeting
– December 6, 2013 in conjunction with SEMICON
Japan 2013, Makuhari Messe, Chiba, Japan
Ballot Result
• None
Upcoming Ballots
• S23 Revision Task Force - the earliest possible cycle
– Doc. 5513A, Revision to SEMI S23-0311, Guide for
Conservation of Energy, Utilities and Materials Used by
Semiconductor Manufacturing Equipment
• Seismic Protection Task Force - the earliest
possible cycle
– Doc. 5556, Line Item Revisions to SEMI S2-0712,
Environmental, Health, and Safety Guideline for
Semiconductor Manufacturing Equipment Revisions
Related to Section 19 Seismic Protection
Revised SNARF
• Seismic Protection Task Force
– Doc. #5556, Line Item Revisions to SEMI S2-0712,
Environmental, Health, and Safety Guideline for Semiconductor
Manufacturing Equipment Revisions Related to Section 19
Seismic Protection.
TF/ WG/ SG Reports (1/5)
• S18 Revision Task Force
– SEMI S18-0312 was published.
– Japanese version of SEMI S18-0312 was also published in
April.
– TF was disbanded since their task was finished.
– Supika Mashiro/ Tokyo Electron and Moray Crawford/
Hatsuta Seisakusho were relieved of the TF co-leader
position.
TF/ WG/ SG Reports (2/5)
• S23 Revision Task Force
– Working for Doc. #5513A, Line Item Revision to SEMI
S23-0311, Guide for Conservation of Energy, Utilities and
Materials Used by Semiconductor Manufacturing Equipment
– Under Preparation of the expansion of RI2
(Temperature Control Unit)
– Introduced the details of revision of SEMI S23 at
energy saving meeting by JEITA and SEAJ for
promotion of effective use.
TF/ WG/ SG Reports (3/5)
• Greenhouse Gas (GHG) Emission Characterization
Task Force
– Minoru Kagino/ Toshiba stepped down as a co-leader of
the TF, and Tetsuya Kitagawa/ Sony took over.
– Working for the promotion and the practical use of SEMI
S29.
• Activities of dissemination with JEITA PFC committee
and SEAJ
TF/ WG/ SG Reports (4/5)
• Seismic Protection Task Force
– Working for Doc. #5556, Line Item Revisions to SEMI S20712, Environmental, Health, and Safety Guideline for
Semiconductor Manufacturing Equipment Revisions
Related to Section 19 Seismic Protection.
– SCOPE of SNARF was revised as below, as result of
discussion.
• This documentation activity covers changes in section 19 of
SEMI S2 and Related Information 4
– To change Design Load based on ASCE7-10
– To modify related Information 4 based on ASCE7-10
– Will draft the document on target to submit it for the
earliest possible cycle.
TF/ WG/ SG Reports (5/5)
• FPD System Safety Task Force
– The Task Force currently has no activity.
• STEP Planning Working Group
– STEP/ SEMI S2 will be held on November 15, at the
SEMI Japan, Tokyo, Japan.
http://www.semi.org/jp/node/17701/ (Japanese Only)
Other Activities
• Program for SEMICON Japan 2013
– SEMI EHS Standards Workshop: EHS Challenges for 450mm to
be held on 13:00-17:00, December 4, at Makuhari Messe
http://www.semiconjapan.org/en/sessions/std1
Thank you!
For more information, please contact:
Naoko Tejima, SEMI Japan
[email protected]