Transcript 1410_JA_EHS_LiaisonR_for_NAFall_1.0

Japan Environmental, Health and Safety
Committee Liaison Report
NA Standards Spring 2014 Meetings
October, 2014
Leadership
• Committee Co-chairs
– Supika Mashiro/ Tokyo Electron
– Hidetoshi Sakura/ Intel
• GCS voting member
• EHS Committee representative to the JRSC
– Moray Crawford/ Hatsuta Seisakusho
• GCS voting member
Committee Organization
EHS Committee
Supika Mashiro/ TEL
Hidetoshi Sakura/ Intel
Moray Crawford/ Hatsuta Seisakusho
FPD System Safety TF
Naokatsu Nishiguchi/
Screen Semiconductor Solutions
S23 Revision TF
George Hoshi / TEL
Lauren Crane/ KLA-Tencor
STEP Planning WG
Kenji Sugihara/ Panasonic
GHG Emission
Characterization TF
George Hoshi / TEL
Tetsuya Kitagawa/ Sony
Seismic Protection TF
Eiji Nakatani/
Screen Semiconductor Solutions
Meeting Information
• Last Meeting
– July 24, 2014 during Japan Summer Meetings 2014
at SEMI Japan, Tokyo, Japan
• Next Meeting
– December 5, 2014 in conjunction with SEMICON
Japan 2014, Tokyo Big Sight, Tokyo, Japan
Leadership Changes of Task Force
• None.
Ballot Result
• Doc.#5719, Delayed Line Item Revision to SEMI S260811, Environmental, Health, and Safety Guideline for
FPD Manufacturing System (Delayed Revisions
Related to Limitations)
– Line Item 1: Delayed Revision to §3 “Limitations”
 Passed as balloted
Result of LI was forwarded to the ISC A&R SC and
waiting for the result.
Ballot Result
• Doc.#5720, Line Item Revisions to SEMI S26-0811,
Environmental, Health, and Safety Guideline for FPD
Manufacturing System; Revisions Related to General
Harmonization to SEMI S2
– Line Item 1: Revision to “accredited testing laboratory” of § 5
“Terminology”
 Passed as balloted
– Line Item 2: Revision to §11 “Safety Interlock Systems”
 Passed as balloted
– Line Item 3 Revision to §13 “Electrical Design”
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•
•

Part A Revision to “hazardous electrical power”
Part B Revision to “Electrical Design”
Part C Deletion of “Appendix2 Enclosure openings”
Passed as balloted
Ballot Result
– Line Item 4 Revision to §18 “Mechanical Design”
 Passed as balloted (Super Clean)
– Line Item 5 Revision to “§25 Non-Ionizing Radiation and Fields”
• Part A Revision to “§25 Non-Ionizing Radiation and Fields”
• Part B Revision to “Appendix 6 Exposure Criteria and Test
Methods for Non-Ionizing Radiation (other than Laser) and
Electromagnetic Fields”
• Part C Add of “Related Information 3 Documentation of NonIonizing Radiation (§25 and Appendix 6) including Rationale for
Changes”
 Passed as balloted (Super Clean)
Results of all line items were forwarded to the ISC
A&R SC and waiting for the result.
New SNARFs / TFOFs
• None.
Upcoming Ballots
• Seismic Protection Task Force - The earliest possible
cycle
– Doc. 5556, Line Item Revisions to SEMI S2-0712,
Environmental, Health, and Safety Guideline for
Semiconductor Manufacturing Equipment Revisions
Related to Section 19 Seismic Protection
• S23 Revision Task Force – temporally aborted
– Doc. 5513A, Line Item Revision to SEMI S23-0311, Guide for
Conservation of Energy, Utilities and Materials Used by
Semiconductor Manufacturing Equipment. (Line Item (1) only)
TF/ WG/ SG Reports (1/5)
• S23 Revision Task Force
– TF recognizes needs to convert S23 Revision Task
Force to a Global Task Force.
– TF’s activities can be implemented on the basis of the
global consensus by converting to a global task force
from the step of submission of the SNARF.
– TFOF will be revised to convert a global task force,
and proposed it to GCS via SEMI staff.
– Submitting the Line Item (1) of Doc. #5513A, Line
Item Revision to SEMI S23-0311, Guide for
Conservation of Energy, Utilities and Materials Used
by Semiconductor Manufacturing Equipment is
aborted temporally.
TF/ WG/ SG Reports (2/5)
• Greenhouse Gas (GHG) Emission Characterization
Task Force
– TF continuously checks compatibility of SEMI S29 and EPA.
TF/ WG/ SG Reports (3/5)
• FPD System Safety Task Force
– The following 2 documents were reviewed at the committee
meeting and the results were shown on the slide 6-8.
• Doc. 5719, Line Item Revision to SEMI S26-0811, Environmental,
Health, and Safety Guideline for FPD Manufacturing System, Delayed
Revisions Related to Limitations
• Doc. 5720, Line Item Revisions to SEMI S26-0811, Environmental,
Health, and Safety Guideline for FPD Manufacturing System, General
Harmonization to SEMI S2
TF/ WG/ SG Reports (4/5)
• Seismic Protection Task Force
– TF has been working for Doc. #5556, Line Item Revisions to SEMI
S2-0712, Environmental, Health, and Safety Guideline for
Semiconductor Manufacturing Equipment Revisions Related to
Section 19 Seismic Protection, discussing with NA Seismic
Protection Liaison TF.
– It will be submitted for the earliest possible cycle.
TF/ WG/ SG Reports (5/5)
• STEP Planning Working Group
– STEP/ SEMI S2 was held on October 17, 2014, at the
SEMI Japan, Tokyo, and successfully finished, attracted
81 attendees.
Other Activities
• Program for SEMICON Japan 2014
– SEMI EHS Standard Energetics Workshop -Emerging Chemistries
and their Combinations introducing Risks to Semiconductor
Manufacturing Operations, Fab, Environment and Life-, will be held
during SEMICON Japan 2014.
• Date: 13:00-17:00, Wednesday, December 3, 2014
• Venue: 6F Conference Tower, Tokyo Big Sight
• Program Chair: Supika Mashiro/ Tokyo Electron, Hidetoshi
Sakura/ Intel, Moray Crawford/ Hatsuta Seisakusho
• Registratrion fee: Until Nov. 21: JPY 16,000 / From Nov. 22: JPY
19,000 (Consumption tax (8%) not included.)
• Session Summary & Agend:
https://semi-reg.smktg.jp/public/session/view/24?lang=en
Thank you!
For more information, please contact:
Naoko Tejima, SEMI Japan
[email protected]