Transcript Chapter 6

Chapter 6 (II)
Designing
Combinational
Logic Circuits (II)
•Dynamic CMOS Logic
V1.0 5/4/2003
V1.1 5/11/2003
V1.2 5/15/2003
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Revision Chronicle

5/4:
 Split Chapter 6 into two parts: Part I focuses on
Static and Pass Transistor Logic. Part II focuses
on Dynamic Logic

5/11:
 Make minor revision in figures and adding the
summary.

5/11:
 Make minor revision in figures and equations
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Combinational Circuits
Dynamic CMOS

In Static CMOS circuits, at every point in time (except
when switching), the output is connected to either
GND or VDD via a low resistance path.
 Fan-in of n requires 2n (n NMOS plus n PMOS)
devices

Dynamic circuits rely on the temporary storage of
signal values on the capacitance of high impedance
nodes.
 Requires on n + 2 (n+1 NMOS plus 1 PMOS)
transistors
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Basic Dynamic Gate
Clk
Clk
Mp
Mp
Out
In1
In2
In3
Clk
Out
CL
PDN
A
PDN
C
B
Me
Clk
Me
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Two Phase Operations
Clk
Clk
Mp
Mp
off
on
Out
In1
In2
In3
Clk
CL
PDN
1
Out
AB+C
A
C
B
Me
Clk
Precharge (Clk = 0)
Evaluate (Clk = 1)
off
Me on
Out  CLK  ( A  B  C)  CLK
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Conditions on Output

Once the output of a dynamic gate is discharged, it
cannot be charged again until the next precharge
operation (one chance only).

Inputs to the gate can make at most one transition
during evaluation.

Output can be in the high impedance state during the
evaluation phase (PDN off), state is stored on CL
Different from Static CMOS  Output is connected to
Either Vdd or GND through low-resistance path.
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Properties of Dynamic Gates (I)




Logic function is implemented by the PDN only
 Number of transistors is N + 2 (versus 2N for static
complementary CMOS)
Full swing outputs (VOL = GND and VOH = VDD)
Non-ratioed: Sizing of the devices does not affect the logic
levels (c.f., Pseudo NMOS)
Faster switching speeds
 Reduced load capacitance due to reduced Logical Effort
(Cin)
 Reduced load capacitance due to smaller internal
capacitance.
 No short-circuit current, Isc, so all the current provided by
PDN goes into discharging CL
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Properties of Dynamic Gates (II)
 Power Dissipation
 No static current path ever exists between VDD and GND
(including Psc)
 No glitching
 Higher transition probabilities:
 Extra loading on CLK
 Overall power dissipation usually higher
P than static CMOS
01

PDN starts to work as soon as the input signals exceed VTn,
so VM, VIH and VIL are equal to VTn
 Low noise margin (NML)


Needs a precharge/evaluate clock (CLK)
tPLH = 0, tPHL = Function of CL and PDN
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Charge Leakage
(1) and (3): Reversed-biased diode
(2) and (4): Subthreshold leakage current (dominated)
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Charge Leakage
•Need minimum clock rate up to a few kHz
•Not good for low-performance applications such
as watches, etc.
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Solution to Charge Leakage
•Adding Bleeder Transistor: Same approach as level restorer
for pass-transistor logic.
•The Bleeder transistor is made high (device is small)
•A “feedback” configuration to elimaite static power
consumption
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Issues in Dynamic Design 2:
Charge Sharing
VDD
Clk
Mp
Out
CL
A
Ma
X
B0
Clk
Mb
Me
Ca
Cb
•Charge stored originally on CL is
redistributed (shared) over CL and
CA
•Lead to a drop on the output
voltage
•May cause incorrect output (e.g.,
the next stage is a Inverter gate).
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Charge Sharing
VDD
Clk
Mp

case 1) if V out < VTn
VDD
Mp
OutOut
A
CL C
L
AMa
Ma
X
B=0
B0
Mb

Clk
Mb
Me
Initial: VOUT (t  0)  VDD , VX (t  0)  0
X
Ca
Ca
Cb
Me
(VX  VDD  VTn (VX ))
C L VDD = C L Vout  t  + Ca  VDD – V Tn  V X  
or
Ca
V out = Vout  t  – V DD = – --------  V DD – V Tn  V X  
C
L
(VOUT  VX )
case 2) if V out > VTn
C
 --------------------a -
Vout = –V DD 

C
+
C
 a
L
Cb
VTn
CA

CL VDD  VTn
( when VOUT  VTn )
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Example of Charge Sharing (I)
Y  A B C
Va  Vb  Vc  Vd  0 at time0
Worst case:
ABC
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 2.5V  0.94V
(30  50)
2.5  0.94  1.56V : Switching voltage of Inverter
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Example of Charge Sharing (II)
C2  C7  low
A0  low
A15  high
when clk  1
Q in C1 is dumped intoC 2  C 7
Q in C1
Vn1 
C1  VDD
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( Ci )  C1
i 2
IF C1  3  C2 & C2  C3  C4  C5  C6  C7
t hen Vn1 
3C2
 VDD  0.33VDD  1.65V
6C2  3C2
 T urn ont heinvert er!!
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Solution to Charge Redistribution
Clk
Mp
Mkp
Clk
Out
A
B
Clk
Me
•Precharge critical internal nodes using a clock-driven
transistor (at the cost of increased area and
capacitance)
•All internal nodes are charged to Vdd during precharge  No charge sharing occurs.
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Combinational Circuits
Issues in Dynamic Design 3:
Backgate Coupling
Clk
Mp
A=0
Out1 =1
CL1
Out2=0
CL2
In
B=0
Clk
Me
Dynamic NAND2
Static NAND2
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Backgate Coupling Effect
Clock feedthrough
3
2
Out1
1
Clk
0
In
Out2
2
Time, ns
-1
0
4
6
Output of static NAND gate does not drop all the way
down to GND with the degraded Out1
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Issues in Dynamic Design 4: Clock
Feedthrough
Coupling between Out and Clk input
of the precharge device due to the
Clk
Mp
A
CL
gate-to-drain capacitance.
The voltage of Out can rise above
VDD.
B
Clk
Out
The fast rising (and falling edges) of
Me
the clock couple to Out.
May cause Latch-up!
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Cascading Dynamic Gates
V
Clk
Mp
Clk
Mp
Out1
Me
Clk
Out2
In
In
Clk
Clk
Me
Out1
Out2
VTn
V
???
t
Only ONE 0  1 transition allowed at inputs
during Evaluation Phase
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Combinational Circuits
Domino Logic
Clk
In1
In2
In3
Clk
Mp
11
10
PDN
Me
Out1
Combat leakage &
Charge sharing!
Clk
Mp Mkp
Out2
00
01
In4
In5
Clk
PDN
Me
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Why the Name “Domino”?
Clk
Ini
Inj
Clk
PDN
Ini
Inj
PDN
Ini
Inj
PDN
Ini
Inj
PDN
Like falling dominos!
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Properties of Domino Logic
Only non-inverting logic can be
implemented!
 Very high speed

 tpHL=0. Inverter can be sized to match Fan-out.
 Input capacitance reduced – smaller logical
effort
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Restructuring Logic for Domino Circuits
Use simple Boolean Transform such as DeMorgan’s Law!
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Multiple-output Domino Circuits
Function of
O3 = (C+D)
can be reused!
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Compound Domino Logic uses Complex
Static Gates at the Output
 (O1  O 2)  O3
 ABCDEF  GH
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Designing with Domino Logic
VDD
VDD
VDD
Clk
Mp
Clk
Mp
Out1
Mr
Out2
In1
In2
In3
PDN
PDN
In4
Can be eliminated!
Clk
Me
Clk
Me
Inputs = 0
during precharge
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Footless Domino
VDD
Clk
VDD
Mp
Clk
Mp
Out1
0
Clk
1
0
Outn
1
0
In2
0
Mp
Out2
In1
1
VDD
1
0
In3
1
0
1
Inn
1
0
The first gate in the chain needs a foot switch
Precharge is rippling – short-circuit current
A solution is to delay the clock for each stage
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Differential (Dual Rail) Domino
off
Mp Mkp
Clk
Out = AB
1
on
Mkp
0
Clk
Mp
1
A
!A
0
Out = AB
!B
B
Clk
Me
Solves the problem of non-inverting logic
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np-CMOS
Clk
In1
In2
In3
Clk
Mp
11
10
PDN
Me
Out1
Clk
Me
In4
In5
PUN
00
01
Clk
Mp
Out2
(to PDN)
Only 0  1 transitions allowed at inputs of PDN
Only 1  0 transitions allowed at inputs of PUN
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NORA Logic
Clk
In1
In2
In3
Clk
Mp
11
10
Out1
PDN
Clk
Me
In4
In5
PUN
00
01
Clk
Me
To other
PDN’s
WARNING: Very Sensitive to Noise!
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Mp
Out2
(to PDN)
To other
PUN’s
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Summary of Dynamic CMOS
Dynamic circuits should be designed with
care (watch out charge sharing, etc.)
 It has smaller footprint and higher speed, but
may not be best for low-power designs.
 The current trend is towards an increased
use of complementary static CMOS
 Design Automation Tools: Optimization at the
logic level, rather at the circuit level.

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