Transcript Trends in Electronics Reliability Testing

Trends in Electronics Reliability Testing
by
Dr. John W. Sofia
Analysis Tech
Phone: (781) 245-7825
Fax: (781) 246-6257
Email: [email protected]
Website: www.analysistech.com
Trends
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The Starting Point
Trends
First Transistor
Bell Labs, 1947
First Integrated Circuit
Texas Instruments, 1958
www.lucent.com
www.ti.com
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Yesterday And Today
Intel 4004-2.3x103 transistors
Intel Pentium II-7.5x106 transistors
Today
1970
www.intel.com
Trends
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Heat Fluxes For Various Events
Chu, Simons, et.al 1999
Trends
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Moore’s Law
Performance doubles with every new chip generation
(approximately every 18-24 months)
observed by Gordon Moore in 1965.
www.ibm.com
www.intel.com
Trends
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Driving Factors
Simons, 1999
Trends
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CPU Power Trend
Aghazadeh, M., 1994
Trends
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Relative Cooling Capability of Various Modes of
Convective Heat Transfer and Coolants
Kraus and Bar-Cohen, 1983
Trends
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Power Dissipation of CMOS Devices
Vs. Clock Speed
Montesano &
Cassia, 1995
Trends
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Simons, 1996
Explosion in Heat Flux
Explosion in heat flux
CPU Heat Dissipation Over Time
Trends
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Processor Performance Vs. Temperature
Kryotech, Inc., 1999
Trends
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National Technology Roadmap For Semiconductors
Year of first
product shipment
1997
1999
2001
2003
2006
2009
2012
Technology Generations
Isolated Lines (1/2 pitch) (nm)
250
180
150
130
100
70
50
Logic Transistors/cm2
3.7M
6.2M
10M
18M
39M
84M
180M
Chip Frequency
(on-chip clock) (MHz)
750
1250
1500
2100
3500
6000
10000
Chip size (mm2 )
280
400
445
560
790
1120
1580
Power Supply Voltage (V)
2.5-1.8
1.8-1.5
1.5-1.2
1.5-1.2
1.2-0.9
0.9-0.6
0.6-0.5
Maximum Power (V)
High Performance
70
90
110
130
160
170
175
Maximum Power (V)
Hand Held
1.2
1.4
1.7
2
2.4
2.8
3.2
Chip IO's
1450
2000
2400
3000
4000
5400
7300
TJ /TA (C)
125/55
125/55
125/55
125/55
125/55
125/55
125/55
www.nist.gov
Trends
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Industry Trends
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CMOS will continue to be the pervasive semiconductor
technology for both memory and logic.
Chip sizes will increase, but circuit density will increase even
more resulting in higher heat flux
Cost will become an increasingly significant challenge for
future high-end cooling designs.
There will be increase emphasis on reducing design time.
The majority of new computer systems will most likely be aircooled for the next few years.
The application of low temperature cooling as a means to
achieve improved system performance may be expected to
increase over the next few years.
Simons, 1999
Trends
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Major Causes of Electronic Failures
Source: U.S. Air Force
Avionics Integrity Program
Reynell, M. 1990
Trends
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Trends in Electronic Cooling
Trends
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Increasing module and device heat fluxes
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Declining thermal design-margins
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Trends in Electronic Interconnects
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Larger numbers of interconnects / signals
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Smaller (less robust) mechanical size interconnects
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Trends in System Costs
Trends
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Decreasing cost-performance ratio
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Increasing cost of system failure to end user
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Trends in Test Needs
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Increasing challenges to avoid thermal & interconnect failure
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Increasing needs (& budgets) for reliability testing
Trends
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Analysis Tech
Thermal and Interconnect Reliability Test Systems
Trends
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Analysis Tech
Test & Measurement Systems for Electronic
Packaging Reliability
Thermal Analyzers:
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Measurement of all device thermal-characteristics
Electrical method of junction temperature measurement
Complete test lab equipment
Complete component test services
Event Detectors:
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Trends
Electrical monitoring of interconnect reliability
For thermal-cycle, vibration, and shock testing
Ideal for long-term unattended test
Solder joints, connectors, and all advanced interconnects
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